Muutke küpsiste eelistusi

Optical Inspection of Microsystems [Pehme köide]

Contributions by (Institut d'Electronique Fondame), Contributions by (Fraunhofer IZM, Berlin, Germany), Edited by , Contributions by (IMEC, Leuven, Belgium), Contributions by (Nanyang Technological University, Singapore), Contributions by , Contributions by , Series edited by (University of Rochester, New York, USA), Contributions by , Contributions by (Universite de Franche-Comte, Besancon, France)
  • Formaat: Paperback / softback, 532 pages, kõrgus x laius: 254x178 mm, kaal: 453 g, 23 Tables, black and white; 230 Halftones, black and white; 479 Illustrations, black and white
  • Ilmumisaeg: 17-Oct-2019
  • Kirjastus: CRC Press
  • ISBN-10: 0367390574
  • ISBN-13: 9780367390570
Teised raamatud teemal:
Optical Inspection of MicrosystemsSuurem pilt
  • Formaat: Paperback / softback, 532 pages, kõrgus x laius: 254x178 mm, kaal: 453 g, 23 Tables, black and white; 230 Halftones, black and white; 479 Illustrations, black and white
  • Ilmumisaeg: 17-Oct-2019
  • Kirjastus: CRC Press
  • ISBN-10: 0367390574
  • ISBN-13: 9780367390570
Teised raamatud teemal:
Püsilink: https://www.kriso.ee/db/9780367390570.html
Märksõnad:
Where conventional testing and inspection techniques fail at the micro-scale, optical techniques provide a fast, robust, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands.

Optical Inspection of Microsystems is the first comprehensive, up-to-date survey of the most important and widely used full-field optical metrology and inspection technologies. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moiré techniques, interference microscopy, laser Doppler vibrometry, holography, speckle metrology, and spectroscopy. They also examine modern approaches to data acquisition and processing. The book emphasizes the evaluation of various properties to increase reliability and promote a consistent approach to optical testing. Numerous practical examples and illustrations reinforce the concepts.

Supplying advanced tools for microsystem manufacturing and characterization, Optical Inspection of Microsystems enables you to reach toward a higher level of quality and reliability in modern micro-scale applications.

Arvustused

The editor of this book has been working in the field of optical metrology for most of his career, so it is no surprise that he has edited a well-balanced and up-to-date picture of the most important optical measurement techniques used for microcomponents inspections. The book describes the basic principles of image correlation, light scattering, atomic force microscopy, moiré methods, grating interferometry, interference microscopy, laser Doppler vibrometry, digital holography, speckle metrology, and spectroscopic techniques, and also their major application for Microsystems testing. Each chapter includes a reasonable number of references. This book is a welcome addition to the literature on optical inspection. It is an excellent value for any graduate student, application engineer, research laboratory and group working in this field, and also for those who are contemplating using these techniques to solve a specific problem. Guillermo H. Kaufmann, Instituto de Fisica Rosario, Argentina, in OPN Optics & Photonics News, Vol. 18, No.3, March 2007

Image Processing and Computer Vision for MEMS Testing. Image Correlation
Techniques for Microsystems Inspection. Light Scattering Techniques for the
Inspection of Microcomponents and Microstructures. Characterization and
Measurement of Microcomponents with the Atomic Force Microscope (AFM).
Optical Profiling Techniques for MEMS Measurement. Grid and Moiré Methods for
Micromeasurements. Grating Interferometry for In-Plane Displacement and
Strain Measurement of Microcomponents. Interference Microscopy Techniques for
Microsystem Characterization. Measuring MEMS in Motion by Laser Doppler
Vibrometry. An Interferometric Platform for Static, Quasi-Static, and Dynamic
Evaluation of Out-Of-Plane Deformations of MEMS and MOEMS. Optoelectronic
Holography for Testing Electronic Packaging and MEMS. Digital Holography and
Its Application in MEMS/MOEMS Inspection. Speckle Metrology for Microsystem
Inspection. Spectroscopic Techniques for MEMS Inspection. Index.
Osten, Wolfgang