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Optical Inspection of Microsystems [Kõva köide]

Edited by , Contributions by (Institut d'Electronique Fondame), Contributions by (Fraunhofer IZM, Berlin, Germany), Contributions by (IMEC, Leuven, Belgium), Contributions by , Contributions by , Contributions by (Nanyang Technological University, Singapore), Contributions by , Contributions by (Universite de Franche-Comte, Besancon, France), Series edited by (University of Rochester, New York, USA)
  • Formaat: Hardback, 503 pages, kõrgus x laius: 254x178 mm, kaal: 1089 g, 375 equations; 230 Halftones, black and white; 23 Tables, black and white; 479 Illustrations, black and white, Contains 109 hardbacks
  • Ilmumisaeg: 20-Jul-2006
  • Kirjastus: CRC Press Inc
  • ISBN-10: 0849336821
  • ISBN-13: 9780849336829
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Optical Inspection of MicrosystemsSuurem pilt
  • Formaat: Hardback, 503 pages, kõrgus x laius: 254x178 mm, kaal: 1089 g, 375 equations; 230 Halftones, black and white; 23 Tables, black and white; 479 Illustrations, black and white, Contains 109 hardbacks
  • Ilmumisaeg: 20-Jul-2006
  • Kirjastus: CRC Press Inc
  • ISBN-10: 0849336821
  • ISBN-13: 9780849336829
Teised raamatud teemal:
Püsilink: https://www.kriso.ee/db/9780849336829.html
Märksõnad:
Where conventional testing and inspection techniques fail at the micro-scale, optical techniques provide a fast, robust, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands. Optical Inspection of Microsystems is the first comprehensive, up-to-date survey of the most important and widely used full-field optical metrology and inspection technologies. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moiré techniques, interference microscopy, laser Doppler vibrometry, holography, speckle metrology, and spectroscopy. They also examine modern approaches to data acquisition and processing. The book emphasizes the evaluation of various properties to increase reliability and promote a consistent approach to optical testing. Numerous practical examples and illustrations reinforce the concepts.

Supplying advanced tools for microsystem manufacturing and characterization, Optical Inspection of Microsystems enables you to reach toward a higher level of quality and reliability in modern micro-scale applications.

Arvustused

The editor of this book has been working in the field of optical metrology for most of his career, so it is no surprise that he has edited a well-balanced and up-to-date picture of the most important optical measurement techniques used for microcomponents inspections. The book describes the basic principles of image correlation, light scattering, atomic force microscopy, moiré methods, grating interferometry, interference microscopy, laser Doppler vibrometry, digital holography, speckle metrology, and spectroscopic techniques, and also their major application for Microsystems testing. Each chapter includes a reasonable number of references. This book is a welcome addition to the literature on optical inspection. It is an excellent value for any graduate student, application engineer, research laboratory and group working in this field, and also for those who are contemplating using these techniques to solve a specific problem. Guillermo H. Kaufmann, Instituto de Fisica Rosario, Argentina, in OPN Optics & Photonics News, Vol. 18, No.3, March 2007

Image Processing and Computer Vision for MEMS Testing
1(54)
Markus Huttel
Introduction
2(1)
Classification of Tasks
2(2)
Image Processing and Computer Vision Components
4(18)
Behavior of Light, Colors, and Filters
5(3)
Illumination
8(4)
Lens Systems
12(3)
Sensors
15(1)
CCD Sensors
16(2)
CMOS Sensors
18(1)
Color Sensors and Cameras
19(1)
Camera Types and Interfaces
20(1)
Frame Grabbers
21(1)
Processing and Analysis of Image Data
22(27)
Computer Vision Process
22(2)
Image Data Preprocessing and Processing Methods
24(1)
Histograms
24(1)
Point Transformations
25(2)
Spatial Filtering
27(4)
Image Data Analysis Methods
31(1)
Spectral Operations
32(4)
Solving Measurement and Testing Tasks
36(1)
Finding a Test Object or Region of Interest
36(4)
Position Recognition
40(2)
Measuring Geometric Features
42(3)
Presence Verification
45(2)
Defect and Fault Detection
47(2)
Commercial and Noncommercial Image Processing and Computer Vision Software
49(1)
Image Processing Techniques for the Processing of Fringe Patterns in Optical Metrology
50(2)
Conclusion
52(3)
References
52(3)
Image Correlation Techniques for Microsystems Inspection
55(48)
Dietmar Vogel
Bernd Michel
Introduction
55(2)
Deformation Measurement by Digital Image Correlation (DIC) Techniques
57(13)
Cross-Correlation Algorithms on Digitized Micrographs
57(3)
Extraction of Displacement and Strain Fields
60(3)
Determination of Derived Properties
63(3)
Capabilities and Limits
66(2)
Combining Finite Element (FE) Simulation with DIC Methods
68(2)
Base Equipment for DIC Applications
70(6)
Components for Measurement Systems
70(2)
Requirements for High-Resolution Scanning Microscopes
72(1)
Software Tools
73(3)
Applications of DIC Techniques to Microsystems
76(23)
Strain Analysis on Microcomponents
76(4)
Defect Detection
80(1)
Validation of Finite Element Modeling
81(1)
Measurement of Material Properties
82(6)
Microcrack Evaluation
88(4)
3-D Deformation Analysis Based on AFM Micrographs
92(3)
Determination of Residual Stresses in Microcomponents
95(4)
Conclusions and Outlook
99(4)
References
99(4)
Light Scattering Techniques for the Inspection of Microcomponents and Microstructures
103(18)
Angela Duparre
Introduction
103(1)
Theoretical Background of Light Scattering
104(2)
Measurement Equipment
106(3)
Standardization of Light Scattering Methods
109(1)
Applications for Microcomponent and Microstructure Inspection
110(5)
Combination of Light Scattering and Profilometric Techniques
115(1)
Conclusions and Outlook
116(5)
References
117(4)
Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM)
121(24)
F. Michael Serry
Joanna Schmit
Introduction
122(1)
Components of AFM and Principles of AFM Operation
122(3)
Probe
123(1)
Scanner
123(1)
Controller
124(1)
Detection, Input Signal, Set Point, and Error Signal
124(1)
Z Feedback Loop
125(1)
AFM Imaging Modes
125(9)
Primary AFM Imaging Modes
125(1)
Contact Mode AFM
125(1)
Noncontact Mode AFM
126(1)
TappingMode AFM
126(1)
Torsion Resonance Mode (TRMode) AFM
127(1)
Secondary AFM Imaging Modes
127(1)
Lateral Force Microscopy (LFM)
127(2)
Phase Imaging
129(1)
Magnetic Force Microscopy (MFM)
129(1)
Conductive AFM (CAFM)
130(1)
Electric Force Microscopy (EFM) and Surface Potential Imaging
131(1)
Force Modulation Imaging
132(1)
Scanning Capacitance Microscopy (SCM)
132(1)
Scanning Spreading Resistance Microscopy (SSRM)
133(1)
Tunneling AFM (TUNA)
133(1)
AFM Nonimaging Modes
134(1)
Applications of AFM for Microcomponent Inspection --- a Case Study
134(6)
Atomic Force Profilometer (AFP) --- a Combination of AFM and Stylus Profiler
140(2)
Optical Metrology Complementary to AFM
142(1)
Conclusions and Outlook
142(3)
References
143(2)
Optical Profiling Techniques for MEMS Measurement
145(18)
Klaus Korner
Aiko Ruprecht
Tobias Wiesendanger
Introduction
145(1)
Principles of Confocal Microscopy
145(11)
Confocal Point Sensors
145(5)
Confocal Microscopes
150(1)
Measuring with Confocal Microscopes
151(2)
MEMS Measurement Applications
153(3)
Principle of Microscopic Depth-Scanning Fringe Projection (DSFP)
156(4)
Introduction
156(1)
Intensity Model
156(2)
Experimental Realization
158(2)
Conclusion
160(3)
References
161(2)
Grid and Moire Methods for Micromeasurements
163(38)
Anand Asundi
Bing Zhao
Huimin Xie
Introduction
163(1)
Grid or Grating Fabrication Methods
164(3)
Photoresist
164(1)
Moving Point Source Holographic Interferometer [ 8,9]
165(1)
Electron Beam Lithography [ 5,6]
165(1)
Focused Ion Beam (FIB) Milling [ 10]
166(1)
Micro-Moire Interferometer
167(7)
Principle
167(2)
Fiber-Optic Micro-Moire Interferometer [ 12]
169(2)
Application in Microelectronic Packaging
171(2)
Conclusion
173(1)
Moire Methods Using High-Resolution Microscopy
174(8)
Electron Beam Moire Method [ 5,6]
174(1)
AFM Moire Method [ 13]
175(1)
SEM Scanning Moire Method [ 14]
176(1)
FIB Moire Method [ 10]
177(1)
TEM Moire Method [ 15]
178(1)
Applications
179(3)
Conclusion
182(1)
Microscopic Grid Methods
182(15)
Introduction
182(2)
Grid Line Pattern Analysis Methods with the FT Method
184(1)
Spatial Resolution
185(1)
Sensitivity
186(1)
Accuracy
187(1)
Grid Line Pattern Analysis Method with Phase-Shifting Method
188(1)
Grid Diffraction Method
188(3)
Applications
191(6)
Conclusions
197(4)
References
198(3)
Grating Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents
201(16)
Leszek Salbut
Introduction
201(1)
Principle of Grating Interferometry
202(2)
Waveguide Grating Interferometry
204(3)
Concept of Waveguide Grating Interferometer Head
204(3)
Modified WGI for 3-D Components of Displacement Vector Measurements
207(1)
Measurement System
207(2)
SG Technology
209(1)
Exemplary Applications of WGI
210(4)
Material Constants Determination
210(1)
Polycrystalline Materials Analysis
210(1)
Semiconductor Microlaser Matrix Testing
210(2)
Electronic Packaging
212(2)
Conclusions
214(3)
References
215(2)
Interference Microscopy Techniques for Microsystem Characterization
217(28)
Alain Bosseboeuf
Sylvain Petitgrand
Introduction
218(1)
Interference Microscopes
218(4)
Principle of Operation
218(1)
Light Sources
219(1)
Interferometers
219(1)
Interference Microscopes with OPD Modulation
220(1)
Interference Microscopes with Wavelength Modulation
221(1)
Interference Microscopes with Direct Phase Modulation
221(1)
Spectrally Resolved Interference Microscopes
221(1)
Modeling of Two-Beam Homodyne Interference Microscopes
222(2)
Two-Beam Interferometry with Monochromatic Illumination
222(1)
Two-Beam Interferometry with Broadband Illumination
223(1)
Two-Beam Interference Microscopy
223(1)
Static Measurements by Interference Microscopy
224(2)
Surface Profiling by Monochromatic Interference Microscopy
224(1)
Surface Profiling by Low-Coherence Interferometry
225(1)
Performance and Issues of Interference Microscopy
226(5)
Edge Effects
226(1)
Measurements on Heterogeneous Surfaces
226(2)
Film Thickness Mapping
228(3)
Spectral Reflectivity Mapping
231(1)
Applications of Interferometric Profilometers in the MEMS Field
231(2)
Dynamic Measurements by Interference Microscopy
233(7)
Introduction
233(1)
Interferometric Signal in the Dynamic Case
233(2)
Vibration Measurements by Stroboscopic Interference Microscopy
235(3)
Vibration Measurements by Time-Averaged Interference Microscopy
238(2)
Applications of Dynamic Interference Microscopy in the MEMS Field
240(1)
Conclusion
240(5)
Acknowledgments
240(1)
References
240(5)
Measuring MEMS in Motion by Laser Doppler Vibrometry
245(48)
Christian Rembe
Georg Siegmund
Heinrich Steger
Michael Wortge
Introduction
246(1)
Laser Doppler Effect and Its Interferometric Detection
247(4)
Laser Doppler Effect
247(2)
Shot Noise in Detection of Light
249(1)
Interferometric Detection
250(1)
Wavefront Aberrations and Laser Speckle
250(1)
Techniques of Laser Doppler Vibrometry
251(11)
Optical Arrangements
251(1)
Homodyne and Heterodyne Detection Techniques
252(2)
Signal Processing
254(1)
Fundamental Relationships of Doppler Modulation
254(1)
Analog Decoding Techniques
255(1)
Digital Demodulation by the Arctangent Phase Method
256(3)
Data Acquisition
259(3)
Full-Field Vibrometry
262(1)
Scanning Vibrometer
262(1)
Operating Deflection Shapes
263(1)
Measuring on Microscopic Structures
263(7)
Optical Arrangements
263(3)
3-D Techniques
266(2)
Ranges and Limits
268(2)
Resolution and Accuracy
270(9)
Noise-Limited Resolution
270(4)
Measurement Accuracy and Calibration of Laser Doppler Vibrometers
274(1)
General Aspects
274(1)
Mechanical Comparison Calibration
275(1)
Calibration by Means of Synthetic Doppler Signals
276(1)
Calibration Based on Bessel Functions
277(1)
Influences on Measurement Accuracy
278(1)
Combination with Other Techniques
279(3)
Examples
282(7)
Dual Mode MEMS Mirror
282(1)
Cantilever Beam Acceleration Sensor
283(1)
Out-of-Plane Analysis
284(3)
In-Plane Analysis
287(2)
Conclusion and Outlook
289(4)
References
290(3)
An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-of-Plane Deformations of MEMS and MOEMS
293(32)
Christophe Gorecki
Michal Jozwik
Patrick Delobelle
Introduction
293(1)
Interferometric Platform Architecture and Principle of Operation
294(2)
Optomechanical Characterization of Membranes by ``Pointwise'' Deflection Method
296(12)
Composition and Atomic Density of SiOxNy Thin Films
297(3)
Mechanical Properties of SiOxNy Thin Films
300(2)
Experimental Results
302(6)
Mechanical Expertise of Scratch Drive Actuators via Interferometric Measurement of Out-of-Plane Microdisplacements
308(6)
SDA Operation
309(1)
Experimental Results
310(4)
Dynamic Evaluation of Active MOEMS by Interferometry Using Stroboscopic Technique
314(7)
Introduction
314(1)
Dynamic Characterization of Active Membranes
314(3)
Dynamic Characterization of Torsional Micromirrors
317(4)
General Conclusion and Outlook
321(4)
Acknowledgments
321(1)
References
321(4)
Optoelectronic Holography for Testing Electronic Packaging and MEMS
325(26)
Cosme Furlong
Introduction
325(2)
Overview of MEMS Fabrication Processes
327(2)
Mechanical Properties of Silicon
328(1)
Optoelectronic Holography
329(4)
Optoelectronic Holography Microscope (OEHM)
329(1)
Static Mode
330(1)
Time-Averaged Mode
331(2)
Representative Applications
333(14)
Testing of NIST Traceable Gauges
333(1)
Study and Characterization of MEMS Accelerometers
334(4)
Testing at the Wafer Level
338(3)
Inspection Procedure
341(1)
High-Resolution Stitching
342(1)
Measurement and Simulation of SMT Components
343(1)
Computational Modeling
343(2)
Computational and OEH Results
345(2)
Summary
347(4)
Acknowledgments
348(1)
References
349(2)
Digital Holography and Its Application in MEMS/MOEMS Inspection
351(76)
Wolfgang Osten
Pietro Ferraro
Introduction
352(1)
Theory and Basic Principle of Digital Holography (DH)
353(11)
Digital Recording and Reconstruction of Wavefronts
353(5)
Reconstruction Principles in DH
358(1)
The Fresnel Approximation
358(2)
Numerical Reconstruction by the Convolution Approach
360(1)
Numerical Reconstruction by the Lensless Fourier Approach
361(1)
Numerical Reconstruction by the Phase-Shifting Approach
362(1)
Influences of Discretization
363(1)
Digital Holographic Interferometry
364(11)
Basic Principles
364(2)
Holographic Displacement Measurement
366(2)
Holographic Shape Measurement
368(1)
Two-Source-Point Method
368(2)
Two-Wavelength Method
370(2)
Direct and Absolute Phase Measurement
372(3)
Advantages of DH
375(1)
Digital Holographic Microscopy (DHM)
375(16)
Optical Setup in DHM
376(2)
Compensation of Aberrations in DH
378(1)
Removing Aberrations by Determining a Phase Mask in the Image Reconstruction Plane
378(3)
First Method: Removing the Circular Fringe Carrier from a Recording Hologram with Phase-Shifting Method
381(1)
Second Method: Formerly a Double-Exposure Technique
382(2)
Third Method: Digital Adjustment by Successive Approximations
384(1)
Comparison among the Methods and Discussion of Results
384(1)
Focus Tracking in DHM
385(4)
Controlling Size Independently of Distance and Wavelength
389(2)
The Application of DH to the Investigation of Microcomponents
391(31)
Experimental Prerequisites for the Investigation of Microcomponents
391(1)
The Loading of Microcomponents
392(2)
The Handling and Preparation of Microcomponents
394(1)
The Observation and Evaluation of Microcomponents
395(1)
Investigation of Objects with Technical Surfaces
395(1)
Combined Shape and Displacement Measurement of Small Objects using DH
395(2)
The Determination of Material Parameters of Microcomponents using DH
397(8)
Investigation of Microcomponents with Optical Surfaces
405(1)
Testing Silicon MEMS Structures
405(4)
Thermal Load Testing of MEMS
409(5)
Microlens Testing
414(8)
Conclusion
422(5)
References
422(5)
Speckle Metrology for Microsystem Inspection
427(32)
Roland Hofling
Petra Aswendt
Introduction
427(1)
Basics
428(15)
Properties of Speckles in Imaging Systems
428(3)
Extracting Information from Speckle Patterns
431(1)
Classification of Speckle Signals for Metrology
432(2)
Evaluation Techniques for Signal Extraction
434(8)
Optical Arrangements for Speckle Interferometry
442(1)
Applications
443(13)
Quality Assurance on Wafer Level
443(3)
Characterization of Operational Behavior
446(1)
Visible Light Interferometry for a Wide Scale
446(6)
DUV-Interferometry for Improved Resolution
452(4)
Conclusion
456(3)
References
457(2)
Spectroscopic Techniques for MEMS Inspection
459(24)
Ingrid De Wolf
Introduction
459(1)
Raman Spectroscopy (RS)
460(12)
Principle
460(1)
Instrumentation
461(2)
Application to Microsystems
463(1)
Stress
463(8)
Coatings
471(1)
Spectroscopic Ellipsometry (SE)
472(2)
Principle
472(1)
Applications to MEMS
472(2)
Dual-Beam Spectroscopy (DBS)
474(2)
Principle
474(1)
Applications to MEMS
474(2)
X-Ray Photoelectron Spectroscopy (XPS)
476(1)
Principle
476(1)
Applications to MEMS
476(1)
High-Resolution Electron Energy Loss Spectroscopy (HREELS)
476(2)
Principle
476(1)
Applications to MEMS
477(1)
Auger Electron Spectroscopy (AES)
478(1)
Principle
478(1)
Applications to MEMS
478(1)
Brillouin Scattering (BS)
479(1)
Principle
479(1)
Applications to MEMS
479(1)
Conclusions
479(4)
References
480(3)
Index 483


Osten, Wolfgang