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Plasma Applications for Material Modification: From Microelectronics to Biological Materials [Kõva köide]

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  • Formaat: Hardback, 310 pages, kõrgus x laius: 229x152 mm, kaal: 1080 g, 6 Tables, black and white; 48 Illustrations, color; 103 Illustrations, black and white
  • Ilmumisaeg: 24-Sep-2021
  • Kirjastus: Jenny Stanford Publishing
  • ISBN-10: 9814877352
  • ISBN-13: 9789814877350
Teised raamatud teemal:
Plasma Applications for Material Modification: From Microelectronics to Biological MaterialsSuurem pilt
  • Formaat: Hardback, 310 pages, kõrgus x laius: 229x152 mm, kaal: 1080 g, 6 Tables, black and white; 48 Illustrations, color; 103 Illustrations, black and white
  • Ilmumisaeg: 24-Sep-2021
  • Kirjastus: Jenny Stanford Publishing
  • ISBN-10: 9814877352
  • ISBN-13: 9789814877350
Teised raamatud teemal:
Püsilink: https://www.kriso.ee/db/9789814877350.html
Märksõnad:

This book is an up-to-date review of the most important plasma-based techniques for material modification, from microelectronics to biological materials and from fusion plasmas to atmospheric ones. Each its technical chapters is written by long-experienced, internationally recognised researchers. The book provides a deep and comprehensive insight into plasma technology and its associated elemental processes and is illustrated throughout with excellent figures and references to complement each section. Although some of the topics covered can be traced back several decades, care has been taken to emphasize the most recent findings and expected evolution. 

The first time the word ‘plasma’ appeared in print in a scientific text related to the study of electrical discharges in gases was 1928, when Irving Langmuir published his article ‘Oscillations in Ionized Gases’. It was the baptism of the predominant state of matter in the known universe (it is estimated that up to 99% of matter is plasma), although not on earth, where the conditions of pressure and temperature make normal the states of matter (solid, liquid, gas) which, in global terms, are exotic. It is enough to add energy to a solid (in the form of heat or electromagnetic radiation) to go into the liquid state, from which gas is obtained through an additional supply of energy. If we continue adding energy to the gas, we will partially or totally ionise it and reach a new state of matter, plasma, made up of free electrons, atoms and molecules (electrically neutral particles) and ions (endowed with a positive or a negative electric charge).

Preface xi
1 Introduction: Cold Plasmas and Surface Processing 1(16)
F.J. Gordillo
F.L. Tabares
1.1 Types of Plasmas
4(2)
1.2 Cold Plasma in the Industry
6(1)
1.3 Cold Plasma Chemistry
7(1)
1.4 Microelectronics
8(1)
1.5 Surface Treatments with Cold Plasmas
9(2)
1.6 Controlled-Fusion Plasmas
11(2)
1.7 Medical and Biomedical Applications
13(4)
2 Plasma-Enhanced Chemical Vapor Deposition of Thin Films 17(38)
C. Corbella
O. Sanchez
J.M. Albella
2.1 Introduction
17(2)
2.2 Effect of Gas Pressure on the Electrical Discharges between Two Electrodes
19(6)
2.2.1 Paschen's Law
19(4)
2.2.2 Thermal and Low-Temperature Plasma Discharges
23(2)
2.3 Elementary Collisional Processes in Plasma Discharges
25(12)
2.3.1 Elastic and Inelastic Collision Processes
25(6)
2.3.2 Effect of the Discharge Frequency on the Collision Processes
31(10)
2.3.2.1 Discharges at the DC-kHz regimes (ωkHz < ωi < ωe)
31(1)
2.3.2.2 Discharges at the MHz regime (ωi < ωrf < ωe)
32(2)
2.3.2.3 Discharges at the GHz regime (ωi < ωrf almost = to ωe)
34(3)
2.4 LP-PECVD vs. AP-PECVD of Thin Films
37(4)
2.5 PECVD of Thin Films under LP and AP Conditions: Some Examples
41(14)
2.5.1 Carbon-Based Compounds
42(3)
2.5.2 Silicon-Based Compounds
45(2)
2.5.3 Titanium-Based Compounds
47(8)
3 Deposition of Porous Nanocolumnar Thin Films by Magnetron Sputtering 55(52)
R. Alvarez
A.R. Gonzalez-Elipe
A. Palmero
3.1 Introduction to Magnetron Sputtering
55(13)
3.1.1 Nanostructuring Variables during Thin-Film Sputtering Deposition
57(2)
3.1.2 The Sputtering Mechanism
59(3)
3.1.3 Transport of Sputtered Species in the Plasma: Thermalization Degree
62(3)
3.1.4 Reactive Magnetron Sputtering
65(3)
3.2 Plasma-Assisted Deposition of Porous Nanocolumnar Thin Films
68(18)
3.2.1 The Oblique Angle Geometry
68(4)
3.2.2 Process-Control and Growth Mechanism
72(4)
3.2.3 Effect of the Kinetic Energy of the Deposition Species on the Nanocolumnar Growth of Thin Films
76(3)
3.2.4 Influence of Plasma-Nanocolumnar Film Interaction during Growth
79(2)
3.2.5 Reactive Magnetron Sputtering at Oblique Angles
81(2)
3.2.6 Growth of Nanocolumnar Thin Films on Patterned and Rough Substrates
83(3)
3.3 Nanostructure-Related Applications of Porous Nanocolumnar Thin Films
86(21)
3.3.1 Porous Magnetron Sputtered Thin Films
87(4)
3.3.2 Nanostructured Magnetron Sputtered Thin Films
91(6)
3.3.3 Nanostructured Thin Films Deposited on Patterned or Nanostructured Substrates
97(10)
4 Atomic Species Generation by Plasmas 107(70)
Rok Zaplotnik
Gregor Primc
Domen Paul
Miran Mozetic
Janez Kovac
Alenka Vesel
4.1 Introduction
107(22)
4.2 Plasma Sources of Neutral Atoms
129(15)
4.3 Production of O, H, and N Atoms in an Inductively Coupled RF Discharge
144(29)
4.3.1 Oxygen Atoms
146(13)
4.3.2 Hydrogen Atoms
159(8)
4.3.3 Nitrogen Atoms
167(6)
4.4 Conclusions
173(4)
5 Surface Modification by Fusion Plasmas 177(46)
M. Rubel
S. Brezinsek
A. Widdowson
5.1 Introduction
178(1)
5.2 Controlled Thermonuclear Fusion: Reactions and Devices
178(3)
5.3 Fusion Fuel and Reactor Components
181(2)
5.4 Plasma-Facing Wall
183(8)
5.5 Plasma-Wall Interactions
191(2)
5.6 Erosion Processes and Wall Materials
193(13)
5.6.1 Selection of Plasma-Facing Materials
193(2)
5.6.2 Erosion and Deposition
195(11)
5.6.2.1 Erosion-deposition under steady-state conditions
195(8)
5.6.2.2 Erosion under high-power loads and off- normal events
203(2)
5.6.2.3 Neutron-induced effects
205(1)
5.7 Tools for Material Migration Studies
206(6)
5.7.1 Erosion-Deposition Probes and Test Limiters
206(5)
5.7.2 Tracer Techniques
211(1)
5.8 Analysis of Wall Materials
212(5)
5.8.1 Analyzed Species
213(2)
5.8.2 Analysis Methods
215(2)
5.9 Concluding Remarks
217(6)
6 Plasma-Assisted Wall Conditioning of Fusion Devices: A Review 223(36)
F.L. Tabares
D. Tafalla
T. Wauters
6.1 Introduction
223(3)
6.2 Fundamentals of Wall Conditioning by Plasmas
226(4)
6.3 Kinds of Conditioning Plasmas
230(11)
6.3.1 Direct Current Glow Discharge
230(2)
6.3.2 Conditioning Techniques in the Presence of Magnetic Fields
232(2)
6.3.3 RF Conditioning
234(2)
6.3.4 MW Conditioning in Tokamaks
236(2)
6.3.5 High Temperature Plasma for Conditioning Purposes
238(2)
6.3.6 Taylor Discharge Cleaning
240(1)
6.4 Plasma Coating
241(2)
6.5 A Practical Case: Wall Conditioning of the TJ-II Stellarator
243(11)
6.5.1 He Glow Discharge during the First Campaigns of TJ-II
244(3)
6.5.2 Boronization of TJ-II
247(3)
6.5.3 Lithium Coating in TJ-II
250(4)
6.6 The Future: Wall Condition of Reactor-Oriented Fusion Devices
254(5)
7 Cold Atmospheric Pressure Plasma Jets and Their Applications 259(26)
Gheorghe Dinescu
Maximilian Teodorescu
7.1 Introduction
259(4)
7.1.1 Meaning of Cold Plasma
259(2)
7.1.2 Importance of Voltage Frequency, Gas Pressure, and Discharge Electrode Configuration in Plasma Sources Operation
261(2)
7.2 Atmospheric Pressure Plasma Sources: Principles, Design, and Models
263(5)
7.2.1 DBD and DBE Plasma Sources
265(1)
7.2.2 Expanding Plasmas, Plasma Jets
266(2)
7.3 Applications of Atmospheric Pressure Plasma Sources
268(11)
7.3.1 Surface Modification
269(3)
7.3.2 Coating of Surfaces by Deposition with Atmospheric Pressure Plasma Jets
272(1)
7.3.3 Surface Cleaning with Atmospheric Pressure Plasma Jets
273(2)
7.3.4 Atmospheric Pressure Plasma Processing of Liquid Solutions and Dispersions
275(4)
7.3.4.1 Degradation of chemical contaminants in solutions
276(2)
7.3.4.2 Plasma in-liquid processing of nanomaterials
278(1)
7.3.5 Other Applications
279(1)
7.4 Conclusions and Outlook
279(6)
8 Plasma in Odontology 285(18)
Sara Laurencin-Dalicieux
Marie Georgelin-Gurgel
Jean Larribe
Antoine Dubuc
Sarah Cousty
8.1 Introduction
285(1)
8.2 Surface Treatment of Materials or Medical Devices
286(4)
8.2.1 Peri-implant Osseointegration Improved by Plasma Treatment
286(2)
8.2.2 Increasing the Adhesion
288(1)
8.2.3 Plasma Cleaning and Antimicrobial Effect
289(1)
8.3 Direct Application
290(6)
8.3.1 Increasing the Adhesion
290(2)
8.3.2 Antimicrobial Effects
292(1)
8.3.3 Endodontic Applications of Cold Atmospheric Plasmas
292(2)
8.3.3.1 Plasma and disinfection
292(1)
8.3.3.2 Plasma and dentine wall
293(1)
8.3.4 Tooth Bleaching
294(1)
8.3.5 Periodontal Treatment
294(1)
8.3.6 Peri-implantitis Treatment
295(1)
8.4 Discussion and Conclusion
296(7)
Index 303
Francisco Tabarés is full professor at the Fusion National Laboratory, Centro de Investigaciones Energéticas, Medioambientales y Tecnológicas, Spain. He graduated in chemistry from the University Complutense, Madrid (UCM), Spain, in 1977 and obtained a doctoral degree in chemical physics from the same university in 1983. From 1984 to 1986, he was a Fulbright postdoctoral scholar at the University of California, Santa Barbara, USA. He was also assistant professor at the Physical Chemistry Department of the UCM, vice president of the Spanish Vacuum Society, president of the Plasma Physics specialised group of the Spanish Royal Society of Physics and coordinator of the Fusion Plasma division in the Spanish Ministry of Science and Research. He joined the Fusion National Laboratory in 1987, where he has been the leader of the Plasma Wall Interaction team for 33 years. Dr. Tabarés has published more than 200 articles in peer-reviewed journals and written 1 book and 6 book chapters. He has pioneered several research works at the international level, including atomic beambased edge plasma diagnostics and novel plasma-based techniques for the cleaning and tritium control of fusion devices.