This CD-ROM originates from the 2002 IEEE International Reliability Physics Symposium, and is concerned with electron devices. Its contents include: non volatile memory; dielectrics; hot carriers; assembly/packaging; device dielectrics; interconnect...More info...
This CD-ROM originates from the 2002 IEEE International Reliability Physics Symposium, and is concerned with electron devices. Its contents include: non volatile memory; dielectrics; hot carriers; assembly/packaging; device dielectrics; interconnect...More info...
This text originated from the 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference & Workshop, and examines the manufacture of circuits and devices. Topics covered include: advanced meteorology; cost reduction; MEMS technology; time...More info...
This CD-ROM originates from the 18th Symposium on Semiconductor Thermal Measurement and Management, and examines components. It covers topics including: advances in compact models; package and material characterization; system level analysis; and li...More info...
This volume originates from the 18th Symposium on Semiconductor Thermal Measurement and Management and examines components. It covers topics including: advances in compact models; package and material characterization; system level analysis; and liq...More info...
Based on the 2001 Symposium on Radio Frequency Integrated Circuits (RFIC), this volume covers such topics as: wireless transceivers; IC design; integrated modules and functions; high frequency technologies; and RF devices and technology....More info...
This title is out of print. Used copies may be available, but delivery only inside Baltic States
In this volume, representatives of government laboratories and funding agencies discuss research and educational programmes. Examples of industrial activities and interactions with universities and government groups are given....More info...
Based on the 2001 IEEE International Reliability Physics Symposium, this electronic reference covers such topics as: device and process; device dielectrics; assembly and packaging; channel hot carriers; interconnects; ESD and latch-up; process induc...More info...
This title is out of print. Used copies may be available, but delivery only inside Baltic States
This work contains the papers from the International Electron Devices Meeting (IEDM) held in 2000. They explore: design; manufacturing; physics and modelling of semiconductors and other electron devices; novel micromachined devices; smart power tech...More info...
This title is out of print. Used copies may be available, but delivery only inside Baltic States
These papers are taken from the 27th IEEE Photovoltaic Specialists Conference, held in 2000. The papers address: silicon devices and materials; amorphous and nanostructured devices; space cells, space systems and III-V devices; terrestrial modules a...More info...
This text constitutes the proceedings of the 24th International Power Modulator Symposium. It should be useful to power modulation researchers, power conditioning engineering, high power switching designers, and power switching component designers....More info...
This title is out of print. Used copies may be available, but delivery only inside Baltic States
A final report on the IEEE International Integrated Reliability Workshop 2000. It covers: water level; reliability; test and test approaches; identification of reliability; effects; characterization and prediction; models to show; reliability test s...More info...
