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E-book: Advanced Materials and Design for Electromagnetic Interference Shielding

(Laird Technologies, Schaumburg, Illinois, USA)
  • Format: 344 pages
  • Pub. Date: 19-Apr-2016
  • Publisher: CRC Press Inc
  • ISBN-13: 9781420073591
  • Format - PDF+DRM
  • Price: 127,92 €*
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  • Format: 344 pages
  • Pub. Date: 19-Apr-2016
  • Publisher: CRC Press Inc
  • ISBN-13: 9781420073591

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With electromagnetic compliance (EMC) now a major factor in the design of all electronic products, it is crucial to understand how electromagnetic interference (EMI) shielding products are used in various industries. Focusing on the practicalities of this area, Advanced Materials and Design for Electromagnetic Interference Shielding comprehensively introduces the design guidelines, materials selection, characterization methodology, manufacturing technology, and future potential of EMI shielding.

After an overview of EMI shielding theory and product design guidelines, the book extensively reviews the characterization methodology of EMI materials. Subsequent chapters focus on particular EMI shielding materials and component designs, including enclosures, metal-formed gaskets, conductive elastomer and flexible graphite components, conductive foam and ventilation structures, board-level shielding materials, composite materials and hybrid structures, absorber materials, grounding and cable-level shielding materials, and aerospace and nuclear shielding materials. The last chapter presents a perspective on future trends in EMI shielding materials and design.

Offering detailed coverage on many important topics, this indispensable book illustrates the efficiency and reliability of a range of materials and design solutions for EMI shielding.
Preface xiii
Author xv
Electromagnetic Interference Shielding Fundamentals and Design Guide
1(36)
Concepts of Electromagnetic Interference and Electromagnetic Compatibility
1(10)
EMI Problems and Common Concerns
2(1)
EMI Emissions and Controlling Methods
3(1)
Conducted EMI Emission
4(1)
Radiated EMI Emission
5(3)
EMC Regulations and Testing Standards
8(1)
The International Standard
9(1)
FCC Standard
9(1)
European Standard
10(1)
Military Standard
10(1)
EMI Shielding Principles
11(13)
Shielding Effects in the E-Field and H-Field
11(2)
Shielding Effectiveness
13(1)
Absorption Loss
14(1)
Reflection Loss
15(1)
Multiple Reflection Correction Factor
16(2)
Shielding Modeling in Practice
18(1)
Metallic Enclosure
18(1)
EMI Gasket
19(1)
Shield with Apertures
20(3)
Cavity Resonance
23(1)
EMC Design Guidelines and EMI Shielding Methodology
24(11)
Design for EMC
24(3)
Shielding Methods and Materials Selection
27(1)
Shielding Housing and Enclosures
27(2)
Gasketing
29(1)
Integral Assembly
30(1)
Corrosion and Material Galvanic Compatibility
31(1)
Environmental Compliance
32(1)
RoHS Directive
33(1)
WEEE Directive
34(1)
References
35(2)
Characterization Methodology of EMI Shielding Materials
37(30)
Shielding Effectiveness Measurement
37(8)
Testing Methods Based on MIL-STD-285
38(1)
Modified Radiation Method for Shielding Effectiveness Testing Based on MIL-G-83528
39(1)
Dual Mode Stirred Chamber
39(1)
Transverse Electromagnetic (TEM) Cell
40(2)
Circular Coaxial Holder
42(1)
Dual Chamber Test Fixture Based on ASTM ES7-83
42(1)
Transfer Impedance Methods
42(1)
Transfer Impedance of Coaxial Cables
43(1)
Transfer Impedance Method for Shielding Effectiveness Measurement of Conductive Gaskets
43(2)
Electrical and Thermal Conductivities
45(2)
Electrical Conductivity and Contact Resistance
45(1)
Thermal Conductivity
46(1)
Permeability and Permittivity
47(2)
Permeability
47(1)
Permittivity
48(1)
Characterization of Permeability and Permittivity
48(1)
Mechanical Properties
49(3)
Uniaxial Tensile Testing
49(1)
Hardness
50(1)
Poisson's Ratio
50(1)
Stress Relaxation
50(1)
Contact Force
51(1)
Friction Force
52(1)
Permanent Set
52(1)
Surface Finish and Contact Interface Compatibility
52(6)
Corrosion and Oxidation Protection
53(1)
Noble Finish Selection
53(1)
Nonnoble Finishes
54(1)
Solderability of Surface Finishes
55(2)
Effects of Mating Cycles and Operating Environments on Contact Finishes
57(1)
Galvanic Corrosion and Contact Interface Compatibility
58(1)
Formability and Manufacturability
58(4)
Bending Formability
59(1)
Effect of Strain Hardening on Formability
60(1)
Anisotropy Coefficient
61(1)
Springback during Metal Strip Forming
62(1)
Environmental Performance Evaluation
62(3)
Thermal Cycling
63(1)
Thermal Aging
63(1)
Gaseous Testing
63(1)
Pore Corrosion and Fretting Corrosion
63(1)
Temperature and Humidity Testing
64(1)
Dust Sensitivity Test
64(1)
Vibration and Shock Test
65(1)
References
65(2)
EMI Shielding Enclosure and Access
67(22)
Enclosure Design and Materials Selection
67(6)
Magnetic Field Shielding Enclosure
73(5)
Basics of Magnetic Shielding
73(1)
Magnetic Shielding Materials Selection
74(2)
Magnetic Shielding Enclosure Design Consideration
76(2)
Shielding Enclosure Integrity
78(4)
Specialized Materials Used for Shielding Enclosure
82(4)
EMI Gaskets
82(1)
Metal Strip Gaskets
82(1)
Knitted Metal Wire Gaskets
83(1)
Metal-Plated Fabric-over-Foam (FOF)
84(1)
Electrically Conductive Elastomer (ECE) Gaskets
84(1)
Magnetic Screening Materials
84(1)
Shielding Tapes
85(1)
Thermoformable Alloys
85(1)
Honeycomb Materials
85(1)
Painted or Plated Plastic Enclosures
86(1)
Conductive Composite Shielding Materials
86(1)
Summary
86(1)
References
87(2)
Metal-Formed EMI Gaskets and Connectors
89(38)
Introduction
89(1)
Metal Strip Selection and Performance Requirement
90(1)
Copper Beryllium Alloys
91(6)
Phase Constitution and Primary Processing of CuBe Strips
91(4)
Performance and Availability of CuBe Alloys
95(1)
High-Strength Alloys
95(2)
High-Conductivity CuBe Alloys
97(1)
Nickel Beryllium
97(1)
Copper-Nickel-Tin Spinodal Alloys
97(10)
Composition and Physical Properties
97(2)
Strip Gauges and Temper Designations
99(1)
Mechanical Properties and Bending Formability
100(1)
Stress-Relaxation Resistance
101(1)
Heat Treatment and Spinodal Decomposition
101(2)
Surface Cleaning, Plating, and Soldering
103(1)
Elastic Performance
103(1)
Shielding Effectiveness
104(1)
Fatigue Strength
104(1)
Some Considerations to Improve Performance of CuNiSn Gasketing
105(2)
Copper-Titanium Alloy
107(1)
Stainless Steel
108(2)
Other Materials Options
110(3)
Phosphor Bronze
110(1)
Brass
111(1)
Nickel Silver
111(1)
Other High Strength and High Conductive Copper Alloys
112(1)
Design Guideline of Metal Gaskets and Connectors
113(5)
Primary Approaches
114(1)
Some Special Design Options
115(1)
Gasketing Design Guideline
116(2)
Fabrication Process and Types of Metal Gaskets and Connectors
118(4)
Progressive Die Forming
118(1)
Roll Forming
119(1)
Multiple-Slide Stamping
120(1)
Photoetching
120(1)
Typical Part Profiles
120(2)
Mounting Methods and Surface Mating Assurance
122(2)
Summary
124(1)
References
124(3)
Conductive Elastomer and Flexible Graphite Gaskets
127(32)
Introduction
127(1)
Raw Material Selection and Conductive Elastomer Fabrication
128(3)
Base Binder Materials
128(1)
Silicone
128(1)
Fluorosilicone
129(1)
Ethylene Propylene Diene Monomer (EPDM)
129(1)
Fluorocarbon
129(1)
Natural Rubber and Butadiene-Acrylonitrile
129(1)
Conductive Fillers
129(1)
Fabrication of Conductive Elastomer Materials
130(1)
Conduction Mechanism and Processing Optimization of Conductive Elastomer Materials
131(6)
Conduction Mechanism and Process Parameters
131(2)
Appearance Properties and Performance Evaluation
133(1)
Physical and Mechanical Properties
133(2)
Electrical Properties
135(2)
Thermal Properties
137(1)
Conductive Elastomer Gasket Design Guideline
137(9)
Flange Joint Geometry and Unevenness
138(1)
Applied Clamping/Compressive Force and Deformation Range
139(2)
Gasket Profile and Materials Selection
141(4)
Flange Materials and Joint Surface Treatment
145(1)
Conductive Elastomer Gasket Fabrication
146(3)
Extrusion
146(1)
Molding
147(1)
Form-in-Place and Screen Printing
148(1)
Reinforced Shielding Gaskets with Oriented Wires and Metal Meshes
149(1)
Conductive Elastomer Gasket Installation and Application
149(3)
Comparable Flexible Graphite Gaskets
152(5)
Flexible Graphite and Its Properties
153(2)
Fabrication and Application of Flexible Graphite Gaskets
155(2)
Summary
157(1)
References
157(2)
Conductive Foam and Ventilation Structure
159(18)
Introduction
159(1)
Waveguide Aperture and Ventilation Panel
159(6)
Waveguide Aperture and Its Design
160(3)
Materials Selection and Fabrication Options
163(2)
Conductive Foam and Integral Window Structure
165(4)
Conductive Plastic Foam and Vent Panels
165(3)
Integral EMI Window Structure
168(1)
Metallized Fabrics and Fabric-over-Foam
169(6)
Metallized Fabrics
170(1)
Fabric-over-Foam
171(4)
Summary
175(1)
References
175(2)
Board-Level Shielding Materials and Components
177(38)
Introduction
177(1)
Board-Level Shielding Design and Materials Selection
178(7)
Basic Principles of Board Circuit EMC Design
178(1)
PCB Layout
178(1)
Power Decoupling
179(1)
Trace Separation
179(1)
Grounding Techniques
180(1)
Chassis Construction and Cabling
180(1)
Board-Level Shielding Design with Proper Materials Selection
181(4)
Board-Level Shielding Components and Their Manufacturing Technology
185(11)
Metal Cans
186(1)
Single-Piece Shielding Cans
186(3)
Two-Piece Cans
189(1)
Multilevel Shielding and Multicompartment Cans
190(1)
Metal-Coated Thermoform Shields
190(1)
snapSHOT Shield
191(1)
Form/Met Shield
192(4)
Formable Shielding Film
196(1)
Conductive Coating Methods Used for EMI Shielding Components
196(11)
Electroplating
197(1)
Electroless Plating
197(1)
Electrolytic Plating
198(1)
Tin Plating and Tin Whisker Growth in EMI Shielding Systems
199(3)
Immersion Surface Finishes
202(2)
Conductive Paints
204(1)
Vapor Deposition
205(1)
Conductive Coating Application and Design Consideration for EMI Shielding
206(1)
Board-Level Shielding with Enhanced Heat Dissipating
207(4)
Minimizing EMI from Heat Sinks
207(1)
Combination of Board-Level Shielding and Heat Dissipation
207(1)
Thermal Interface Materials (TIMs) for Thermal-Enhanced Board-Level Shielding
208(3)
Summary
211(1)
References
212(3)
Composite Materials and Hybrid Structures for EMI Shielding
215(22)
Introduction
215(1)
Knitted Wire/Elastomer Gaskets
215(6)
Fabrication Process and Materials Selection
216(2)
Knitted Wire Gasket Performance
218(1)
Typical Gasket Types and Mounting Methods
219(2)
EMI Shielding Tapes
221(3)
Conductive Fiber/Whisker Reinforced Composites
224(6)
Materials Selection and Process of Conductive Composites
225(1)
Carbon Fiber/Whisker Reinforced Materials
226(1)
Metal Fiber/Whisker Reinforced Composites
227(2)
Nanofiber Reinforced Polymer Composites
229(1)
Hybrid Flexible Structures for EMI Shielding
230(1)
Electroless Metal Deposition for Reinforcements of Composite Shielding Materials
231(3)
Summary
234(1)
References
234(3)
Absorber Materials
237(20)
Introduction
237(1)
Microwave Absorber Materials
238(7)
Resonant Absorbers
240(1)
Dallenbach Tuned Layer Absorbers
240(1)
Salisbury Screens
241(1)
Jaumann Layers
242(1)
Graded Dielectric Absorbers: Impedance Matching
242(1)
Pyramidal Absorbers
242(1)
Tapered Loading Absorbers
243(1)
Matching Layer Absorbers
244(1)
Cavity Damping Absorbers
244(1)
Anechoic Chambers
245(1)
Antennas
245(1)
Absorber Materials Used in Anechoic Chambers
246(1)
Dielectric Materials for Absorber Applications
246(3)
Electromagnetic Wave Absorbers
249(2)
Absorbing Materials Selection and Absorber Applications
251(2)
Absorbing Materials and Absorber Types
251(1)
Applications
252(1)
Military
252(1)
Commercial
253(1)
Summary
253(1)
References
254(3)
Grounding and Cable-Level Shielding Materials
257(18)
Introduction
257(1)
Cable Assembly and Its EMI Shielding Design
257(4)
Cable-Level Shielding Materials
261(6)
Metallic Shielding
261(2)
Conductive Heat-Shrinkable Shielding
263(1)
Ferrite Shielding Materials
264(3)
Bonding and Grounding
267(4)
Bonding
268(1)
Grounding
269(1)
Shields Grounded at One Point
270(1)
Multigrounded Shields
271(1)
Hybrid Grounding
271(1)
Summary
271(1)
References
272(3)
Special Shielding Materials in Aerospace and Nuclear Industries
275(18)
Introduction
275(1)
Lightweight Shielding Materials for Aerospace Applications
275(6)
Lightweight Radiation Shielding Material
276(1)
Fiber Reinforced Composite Materials
277(2)
Nanomaterials
279(1)
Foam Structures
280(1)
Radiation Shielding for Space Power Systems
281(5)
Neutron Shielding Design and Materials Selection
282(1)
Shielding Materials for Earth Neighborhood Infrastructure
282(1)
Active Electromagnetic Shielding for Space Radiation
283(2)
Optimization of Space Radiation Shielding
285(1)
Nuclear Shielding Materials
286(3)
Summary
289(2)
References
291(2)
Perspectives and Future Trends
293(22)
Introduction
293(1)
Early Design-in for EMC and Optimal Design of EMI Shielding
293(4)
Advanced Materials Selection for EMI Shielding
297(5)
Materials Selection for EMI Shielding Enclosure/Cover/Barrier
298(1)
EMI Gasketing Material Selection
299(2)
Other Shielding Materials Selection
301(1)
Future Trends and Applications
302(9)
EMI Shielding Design Techniques
302(1)
Integrated Circuit-Level Shielding
303(2)
Printed Circuit Board (PCB)-Level Shielding
305(1)
Lightweight Shields for PCB-Level Shielding
305(1)
Mold-in-Place Combination Gaskets for Multicompartment Shields
306(1)
Rotary Form-in-Place Gaskets
307(1)
EMI Shielding Modules or Enclosures
308(1)
Conductive Foam with Z-Axis Conductivity
308(1)
Dent-Resistant Vent Panels
309(1)
Nanocomposite Shielding Materials
309(1)
Ultrasoft Sculpted Fabric-over-Foam
310(1)
Interconnecting Level Shielding
310(1)
EMI Control or Immunity by Software
311(1)
Summary
311(1)
References
312(3)
Index 315
Laird Technologies, Schaumburg, Illinois, USA