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ix | |
Woodhead Publishing Series in Electronic and Optical Materials |
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xi | |
Foreword |
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xv | |
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1 | (10) |
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1 | (1) |
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1.2 The focus of the book |
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1 | (2) |
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1.3 Reliability science and engineering fundamentals (Chapters 2--4) |
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3 | (3) |
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1.4 Reliability methods in component and system development (Chapters 5--9) |
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6 | (2) |
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1.5 Reliability modelling and testing in specific applications (Chapters 10 and 11) |
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8 | (1) |
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9 | (2) |
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10 | (1) |
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2 Reliability and stupidity: mistakes in reliability engineering and how to avoid them |
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11 | (16) |
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11 | (1) |
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2.2 Common mistakes in reliability engineering |
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12 | (12) |
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24 | (3) |
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24 | (3) |
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3 Physics-of-failure (PoF) methodology for electronic reliability |
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27 | (16) |
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27 | (1) |
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27 | (2) |
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29 | (3) |
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3.4 PoF reliability assessment |
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32 | (2) |
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3.5 Applications of PoF to ensure reliability |
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34 | (3) |
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3.6 Summary and areas of future interest |
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37 | (6) |
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38 | (5) |
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4 Modern instruments for characterizing degradation in electrical and electronic equipment |
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43 | (20) |
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43 | (1) |
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4.2 Destructive techniques |
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43 | (9) |
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4.3 Nondestructive techniques |
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52 | (5) |
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4.4 In situ measurement techniques |
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57 | (4) |
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61 | (2) |
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62 | (1) |
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5 Reliability building of discrete electronic components |
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63 | (20) |
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63 | (1) |
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63 | (4) |
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5.3 Failure risks and possible corrective actions |
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67 | (11) |
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5.4 Effect of electrostatic discharge on discrete electronic components |
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78 | (1) |
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79 | (4) |
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79 | (4) |
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6 Reliability of optoelectronics |
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83 | (32) |
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83 | (1) |
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6.2 Overview of optoelectronics reliability |
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84 | (1) |
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6.3 Approaches and recent developments |
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85 | (5) |
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6.4 Case study: reliability of buried heterostructure (BH) InP semiconductor lasers |
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90 | (8) |
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6.5 Reliability extrapolation and modeling |
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98 | (3) |
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6.6 Electrostatic discharge (ESD) and electrical overstress (EOS) |
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101 | (8) |
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109 | (6) |
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110 | (5) |
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7 Reliability of silicon integrated circuits |
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115 | (28) |
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115 | (1) |
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7.2 Reliability characterization approaches |
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116 | (2) |
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7.3 Integrated circuit (IC) wear-out failure mechanisms |
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118 | (15) |
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7.4 Summary and conclusions |
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133 | (10) |
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135 | (1) |
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135 | (8) |
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8 Reliability of emerging nanodevices |
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143 | (26) |
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8.1 Introduction to emerging nanodevices |
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143 | (3) |
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8.2 Material and architectural evolution of nanodevices |
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146 | (2) |
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8.3 Failure mechanisms in nanodevices |
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148 | (12) |
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8.4 Reliability challenges: opportunities and issues |
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160 | (3) |
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8.5 Summary and conclusions |
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163 | (6) |
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163 | (6) |
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9 Design considerations for reliable embedded systems |
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169 | (26) |
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169 | (1) |
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170 | (3) |
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9.3 Reliable design principles |
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173 | (7) |
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9.4 Low-cost reliable design |
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180 | (7) |
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9.5 Future research directions |
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187 | (3) |
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190 | (5) |
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190 | (5) |
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10 Reliability approaches for automotive electronic systems |
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195 | (20) |
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195 | (1) |
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10.2 Circuit reliability challenges for the automotive industry |
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195 | (1) |
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10.3 Circuit reliability checking for the automotive industry |
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196 | (4) |
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10.4 Using advanced electronic design automation (EDA) tools |
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200 | (8) |
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10.5 Case studies and examples |
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208 | (4) |
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212 | (3) |
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212 | (1) |
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212 | (3) |
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11 Reliability modeling and accelerated life testing for solar power generation systems |
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215 | (36) |
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215 | (1) |
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215 | (3) |
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218 | (4) |
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222 | (4) |
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11.5 Accelerated life testing (ALT) |
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226 | (12) |
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11.6 ALT example: how to craft a thermal cycling ALT plan for SnAgCu (SAC) solder failure mechanism |
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238 | (5) |
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11.7 How to craft a temperature, humidity, and bias ALT plan for CMOS metallization corrosion |
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243 | (4) |
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11.8 Developments and opportunities |
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247 | (1) |
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248 | (1) |
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11.10 Sources of further information |
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248 | (3) |
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248 | (3) |
Index |
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251 | |