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E-book: System-on-Chip Test Architectures: Nanometer Design for Testability

(Auburn University, Auburn, AL, U.S.A.), (University of Texas, Austin, TX, U.S.A.), (SynTest Technologies, Inc., Sunnyvale, CA, USA)
  • Format: PDF+DRM
  • Series: Systems on Silicon
  • Pub. Date: 28-Jul-2010
  • Publisher: Morgan Kaufmann Publishers In
  • Language: eng
  • ISBN-13: 9780080556802
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  • Format: PDF+DRM
  • Series: Systems on Silicon
  • Pub. Date: 28-Jul-2010
  • Publisher: Morgan Kaufmann Publishers In
  • Language: eng
  • ISBN-13: 9780080556802
Other books in subject:

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Modern electronics testing has a legacy of more than 40 years. The introduction of new technologies, especially nanometer technologies with 90nm or smaller geometry, has allowed the semiconductor industry to keep pace with the increased performance-capacity demands from consumers. As a result, semiconductor test costs have been growing steadily and typically amount to 40% of today's overall product cost.

This book is a comprehensive guide to new VLSI Testing and Design-for-Testability techniques that will allow students, researchers, DFT practitioners, and VLSI designers to master quickly System-on-Chip Test architectures, for test debug and diagnosis of digital, memory, and analog/mixed-signal designs.

KEY FEATURES
* Emphasizes VLSI Test principles and Design for Testability architectures, with numerous illustrations/examples.
* Most up-to-date coverage available, including Fault Tolerance, Low-Power Testing, Defect and Error Tolerance, Network-on-Chip (NOC) Testing, Software-Based Self-Testing, FPGA Testing, MEMS Testing, and System-In-Package (SIP) Testing, which are not yet available in any testing book.
* Covers the entire spectrum of VLSI testing and DFT architectures, from digital and analog, to memory circuits, and fault diagnosis and self-repair from digital to memory circuits.
* Discusses future nanotechnology test trends and challenges facing the nanometer design era; promising nanotechnology test techniques, including Quantum-Dots, Cellular Automata, Carbon-Nanotubes, and Hybrid Semiconductor/Nanowire/Molecular Computing.
* Practical problems at the end of each chapter for students.

More info

The comprehensive guide to modern system-on-chip testing and design for testability from bestselling author L.-T Wang!
Preface xxi
In the Classroom xxvii
Acknowledgments xxix
Contributors xxxi
About the Editors xxxv
Introduction
1(40)
Laung-Terng (L.-T.) Wang
Charles E. Stroud
Nur A. Touba
Importance of System-on-Chip Testing
2(6)
Yield and Reject Rate
5(1)
Reliability and System Availability
6(2)
Basics of SOC Testing
8(12)
Boundary Scan (IEEE 1149.1 Standard)
9(2)
Boundary Scan Extension (IEEE 1149.6 Standard)
11(2)
Boundary-Scan Accessible Embedded Instruments (IEEE P1687)
13(1)
Core-Based Testing (IEEE 1500 Standard)
13(4)
Analog Boundary Scan (IEEE 1149.4 Standard)
17(3)
Basics of Memory Testing
20(4)
SOC Design Examples
24(6)
BioMEMS Sensor
25(2)
Network-on-Chip Processor
27(3)
About This Book
30(3)
DFT Architectures
30(1)
New Fault Models and Advanced Techniques
31(1)
Yield and Reliability Enhancement
32(1)
Nanotechnology Testing Aspects
33(1)
Exercises
33(8)
Acknowledgments
36(1)
References
36(5)
Digital Test Architectures
41(82)
Laung-Terng (L.-T.) Wang
Introduction
41(2)
Scan Design
43(14)
Scan Architectures
44(1)
Muxed-D Scan Design
44(2)
Clocked-Scan Design
46(1)
LSSD Scan Design
47(1)
Enhanced-Scan Design
48(2)
Low-Power Scan Architectures
50(1)
Reduced-Voltage Low-Power Scan Design
50(1)
Reduced-Frequency Low-Power Scan Design
50(1)
Multi-Phase or Multi-Duty Low-Power Scan Design
50(1)
Bandwidth-Matching Low-Power Scan Design
51(1)
Hybrid Low-Power Scan Design
52(1)
At-Speed Scan Architectures
52(5)
Logic Built-In Self-Test
57(19)
Logic BIST Architectures
58(1)
Self-Testing Using MISR and Parallel SRSG (STUMPS)
58(1)
Concurrent Built-In Logic Block Observer (CBILBO)
59(2)
Coverage-Driven Logic BIST Architectures
61(1)
Weighted Pattern Generation
61(1)
Test Point Insertion
62(2)
Mixed-Mode BIST
64(1)
Hybrid BIST
65(1)
Low-Power Logic BIST Architectures
66(1)
Low-Transition BIST Design
66(1)
Test-Vector-Inhibiting BIST Design
67(1)
Modified LFSR Low-Power BIST Design
67(1)
At-Speed Logic BIST Architectures
68(1)
Single-Capture
68(2)
Skewed-Load
70(3)
Double-Capture
73(2)
Industry Practices
75(1)
Test Compression
76(21)
Circuits for Test Stimulus Compression
77(1)
Linear-Decompression-Based Schemes
77(4)
Broadcast-Scan-Based Schemes
81(4)
Comparison
85(2)
Circuits for Test Response Compaction
87(1)
Space Compaction
88(4)
Time Compaction
92(1)
Mixed Time and Space Compaction
93(1)
Low-Power Test Compression Architectures
94(1)
Industry Practices
95(2)
Random-Access Scan Design
97(9)
Random-Access Scan Architectures
98(2)
Progressive Random-Access Scan Design
100(1)
Shift-Addressable Random-Access Scan Design
101(2)
Test Compression RAS Architectures
103(2)
At-Speed RAS Architectures
105(1)
Concluding Remarks
106(1)
Exercises
106(17)
Acknowledgments
110(1)
References
111(12)
Fault-Tolerant Design
123(48)
Nur A. Touba
Introduction
123(1)
Fundamentals of Fault Tolerance
124(5)
Reliability
125(1)
Mean Time to Failure (MTTF)
126(1)
Maintainability
127(1)
Availability
127(2)
Fundamentals of Coding Theory
129(13)
Linear Block Codes
129(6)
Unidirectional Codes
135(1)
Two-Rail Codes
135(1)
Berger Codes
136(1)
Constant Weight Codes
136(1)
Cyclic Codes
137(5)
Fault Tolerance Schemes
142(21)
Hardware Redundancy
142(1)
Static Redundancy
142(4)
Dynamic Redundancy
146(2)
Hybrid Redundancy
148(2)
Time Redundancy
150(1)
Repeated Execution
150(1)
Multiple Sampling of Outputs
151(1)
Diverse Recomputation
152(1)
Information Redundancy
153(1)
Error Detection
153(7)
Error Correction
160(3)
Industry Practices
163(2)
Concluding Remarks
165(1)
Exercises
165(6)
Acknowledgments
168(1)
References
168(3)
System/Network-on-Chip Test Architectures
171(54)
Chunsheng Liu
Krishnendu Chakrabarty
Wen-Ben Jone
Introduction
172(3)
System-on-Chip (SOC) Testing
175(17)
Modular Testing of SOCs
175(2)
Wrapper Design and Optimization
177(2)
TAM Design and Optimization
179(2)
Test Scheduling
181(4)
Modular Testing of Mixed-Signal SOCs
185(3)
Modular Testing of Hierarchical SOCs
188(3)
Wafer-Sort Optimization for Core-Based SOCs
191(1)
Network-on-Chip (NOC) Testing
192(17)
NOC Architectures
192(2)
Testing of Embedded Cores
194(1)
Reuse of On-Chip Network for Testing
194(2)
Test Scheduling
196(1)
Test Access Methods and Test Interface
197(1)
Efficient Reuse of Network
198(4)
Power-Aware and Thermal-Aware Testing
202(1)
Testing of On-Chip Networks
203(1)
Testing of Interconnect Infrastructures
203(2)
Testing of Routers
205(3)
Testing of Network Interfaces and Integrated System Testing
208(1)
Design and Test Practice: Case Studies
209(6)
SOC Testing for PNX8550 System Chip
210(2)
NOC Testing for a High-End TV System
212(3)
Concluding Remarks
215(1)
Exercises
216(9)
Acknowledgments
217(1)
References
217(8)
SIP Test Architectures
225(38)
Philippe Cauvet
Michel Renovell
Serge Bernard
Introduction
226(9)
SIP Definition
226(1)
SIP Examples
227(3)
Yield and Quality Challenges
230(3)
Test Strategy
233(2)
Bare Die Test
235(7)
Mechanical Probing Techniques
235(2)
Electrical Probing Techniques
237(3)
Reliability Screens
240(2)
Functional System Test
242(4)
Path-Based Testing
242(3)
Loopback Techniques: DFT and DSP
245(1)
Test of Embedded Components
246(11)
SIP Test Access Port
247(3)
Interconnections
250(1)
Digital and Memory Dies
251(2)
Analog and RF Components
253(1)
Test Equipment Issues
253(1)
Test of Analog, Mixed-Signal, and RF Dies
254(1)
MEMS
255(2)
Concluding Remarks
257(1)
Exercises
257(6)
Acknowledgments
258(1)
References
258(5)
Delay Testing
263(44)
Duncan M. (Hank) Walker
Michael S. Hsiao
Introduction
263(2)
Delay Test Application
265(4)
Enhanced Scan
266(1)
Muxed-D Scan
266(1)
Scan Clocking
266(2)
Faster-Than-At-Speed Testing
268(1)
Delay Fault Models
269(7)
Transition Fault Model
269(1)
Inline-Delay Fault Model
270(1)
Gate-Delay Fault Model
270(1)
Path-Delay Fault Model
270(1)
Defect-Based Delay Fault Models
271(5)
Delay Test Sensitization
276(1)
Delay Fault Simulation
277(3)
Transition Fault Simulation
277(1)
Gate/Line Delay Fault Simulation
277(1)
Path-Delay Fault Simulation
278(1)
Defect-Based Delay Fault Model Simulation
278(2)
Delay Fault Test Generation
280(8)
Transition/Inline Fault ATPG
280(2)
Gate-Delay Fault ATPG
282(1)
Path-Delay Fault ATPG
282(1)
K Longest Paths per Gate (KLPG) ATPG
283(5)
Pseudo-Functional Testing to Avoid Over-Testing
288(6)
Computing Constraints
290(1)
Pair-Wise Constraints
291(1)
Multiliteral Constraints
291(2)
Constrained ATPG
293(1)
Concluding Remarks
294(1)
Exercises
295(12)
Acknowledgments
299(1)
References
300(7)
Low-Power Testing
307(44)
Patrick Girard
Xiaoqing Wen
Nur A. Touba
Introduction
307(2)
Energy and Power Modeling
309(4)
Basics of Circuit Theory
310(1)
Terminology
311(1)
Test-Power Modeling and Evaluation
312(1)
Test Power Issues
313(3)
Thermal Effects
314(1)
Noise Phenomena
314(1)
Miscellaneous Issues
315(1)
Low-Power Scan Testing
316(12)
Basics of Scan Testing
316(2)
ATPG and X-Filling Techniques
318(2)
Low-Power Test Vector Compaction
320(1)
Shift Control Techniques
321(1)
Scan Cell Ordering
322(2)
Scan Architecture Modification
324(2)
Scan Clock Splitting
326(2)
Low-Power Built-in Self-Test
328(7)
Basics of Logic BIST
328(1)
LFSR Tuning
329(1)
Low-Power Test Pattern Generators
330(1)
Vector Filtering BIST
331(1)
Circuit Partitioning
332(2)
Power-Aware Test Scheduling
334(1)
Low-Power Test Data Compression
335(4)
Coding-Based Schemes
336(1)
Linear-Decompression-Based Schemes
336(1)
Broadcast-Scan-Based Schemes
337(2)
Low-Power RAM Testing
339(2)
Concluding Remarks
341(1)
Exercises
342(9)
Acknowledgments
344(1)
References
344(7)
Coping with Physical Failures, Soft Errors, and Reliability Issues
351(72)
Laung-Terng (L.-T.) Wang
Mehrdad Nourani
T. M. Mak
Introduction
352(2)
Signal Integrity
354(16)
Basic Concept of Integrity Loss
354(2)
Sources of Integrity Loss
356(1)
Interconnects
356(2)
Power Supply Noise
358(1)
Process Variations
358(2)
Integrity Loss Sensors/Monitors
360(1)
Current Sensor
360(1)
Power Supply Noise Monitor
361(1)
Noise Detector (ND) Sensor
362(1)
Integrity Loss Sensor (ILS)
362(1)
Jitter Monitor
363(1)
Process Variation Sensor
364(1)
Readout Architectures
365(1)
BIST-Based Architecture
365(2)
Scan-Based Architecture
367(1)
PV-Test Architecture
368(2)
Manufacturing Defects, Process Variations, and Reliability
370(16)
Fault Detection
370(1)
Structural Tests
371(1)
Defect-Based Tests
372(6)
Functional Tests
378(1)
Reliability Stress
379(2)
Redundancy and Memory Repair
381(1)
Process Sensors and Adaptive Design
382(1)
Process Variation Sensor
383(1)
Thermal Sensor
383(2)
Dynamic Voltage Scaling
385(1)
Soft Errors
386(16)
Sources of Soft Errors and SER Trends
387(3)
Coping with Soft Errors
390(1)
Fault Tolerance
390(4)
Error-Resilient Microarchitectures
394(4)
Soft Error Mitigation
398(4)
Defect and Error Tolerance
402(5)
Defect Tolerance
404(1)
Error Tolerance
405(2)
Concluding Remarks
407(1)
Exercises
407(16)
Acknowledgments
409(1)
References
409(14)
Design for Manufacturability and Yield
423(40)
Robert C. Aitken
Introduction
423(3)
Yield
426(1)
Components of Yield
427(3)
Yield Models
428(1)
Yield and Repair
429(1)
Photolithography
430(3)
DFM and DFY
433(12)
Photolithography
435(4)
Critical Area
439(2)
Yield Variation over Time
441(3)
DFT and DFM/DFY
444(1)
Variability
445(4)
Sources of Variability
445(1)
Deterministic versus Random Variability
446(2)
Variability versus Defectivity
448(1)
Putting It All Together
449(1)
Metrics for DFX
449(7)
The Ideal Case
450(2)
Potential DFY Metrics
452(1)
Critical Area
452(1)
RET-Based Metrics
452(2)
Example DRC-Based Metrics for DFM
454(2)
Concluding Remarks
456(1)
Exercises
457(6)
Acknowledgments
458(1)
References
459(4)
Design for Debug and Diagnosis
463(42)
T. M. Mak
Srikanth Venkataraman
Introduction
463(5)
What Are Debug and Diagnosis?
464(1)
Where Is Diagnosis Used?
465(1)
IC-Level Debug and Diagnosis
465(1)
Silicon Debug versus Defect Diagnosis
466(1)
Design for Debug and Diagnosis
467(1)
Logic Design for Debug and Diagnosis (DFD) Structures
468(8)
Scan
468(1)
Observation-Only Scan
469(2)
Observation Points with Multiplexers
471(1)
Array Dump and Trace Logic Analyzer
472(1)
Clock Control
473(2)
Partitioning, Isolation, and De-featuring
475(1)
Reconfigurable Logic
476(1)
Probing Technologies
476(11)
Mechanical Probing
477(1)
Injection-Based Probing
478(1)
E-beam Probing
478(1)
Laser Voltage Probing
479(4)
Emission-Based Probing
483(1)
Infrared Emission Microscopy (IREM)
483(2)
Picosecond Imaging Circuit Analysis (PICA)
485(1)
Time Resolved Emissions (TRE)
486(1)
Circuit Editing
487(3)
Focused Ion Beam
487(1)
Layout-Database-Driven Navigation System
488(1)
Spare Gates and Spare Wires
489(1)
Physical DFD Structures
490(2)
Physical DFD for Pico-Probing
490(1)
Physical DFD for E-Beam
491(1)
Physical DFD for FIB and Probing
492(1)
Diagnosis and Debug Process
492(6)
Diagnosis Techniques and Strategies
495(1)
Silicon Debug Process and Flow
496(1)
Debug Techniques and Methodology
497(1)
Concluding Remarks
498(1)
Exercises
499(6)
Acknowledgments
500(1)
References
500(5)
Software-Based Self-Testing
505(44)
Jiun-Lang Huang
Kwang-Ting (Tim) Cheng
Introduction
506(1)
Software-Based Self-Testing Paradigm
507(3)
Self-Test Flow
508(1)
Comparison with Structural BIST
509(1)
Processor Functional Fault Self-Testing
510(6)
Processor Model
510(2)
Functional-Level Fault Models
512(1)
Test Generation Procedures
513(1)
Test Generation for Register Decoding Fault
513(1)
Test Generation for Instruction Decoding and Control Fault
514(1)
Test Generation for Data Transfer and Storage Function
515(1)
Test Generation for Data Manipulation Function
516(1)
Test Generation Complexity
516(1)
Processor Structural Fault Self-Testing
516(14)
Test Flow
516(1)
Test Preparation
516(1)
Self-Testing
517(1)
Stuck-At Fault Testing
518(1)
Instruction-Imposed I/O Constraint Extraction
518(1)
Constrained Component Test Generation
519(2)
Test Program Synthesis
521(1)
Processor Self-Testing
522(1)
Test Program Synthesis Using Virtual Constraint Circuits (VCCs)
523(3)
Delay Fault Testing
526(1)
Functionally Untestable Delay Faults
526(1)
Constraint Extraction
527(1)
Test Program Generation
528(1)
Functional Random Instruction Testing
529(1)
Processor Self-Diagnosis
530(3)
Challenges to SBST-Based Processor Diagnosis
530(1)
Diagnostic Test Program Generation
531(2)
Testing Global Interconnect
533(3)
Maximum Aggressor (MA) Fault Model
533(1)
Processor-Based Address and Data Bus Testing
534(1)
Data Bus Testing
534(1)
Address Bus Testing
535(1)
Processor-Based Functional MA Testing
536(1)
Testing Nonprogrammable Cores
536(2)
Preprocessing Phase
538(1)
Core Test Phase
538(1)
Instruction-Level DFT
538(3)
Instruction-Level DFT Concept
538(1)
Testability Instructions
539(2)
Test Optimization Instructions
541(1)
DSP-Based Analog/Mixed-Signal Component Testing
541(2)
Concluding Remarks
543(1)
Exercises
544(5)
Acknowledgments
545(1)
References
545(4)
Field Programmable Gate Array Testing
549(42)
Charles E. Stroud
Overview of FPGAs
549(9)
Architecture
550(4)
Configuration
554(2)
The Testing Problem
556(2)
Testing Approaches
558(4)
External Testing and Built-in Self-Test
559(1)
Online and Offline Testing
560(1)
Application Dependent and Independent Testing
561(1)
BIST of Programmable Resources
562(21)
Logic Resources
563(4)
Programmable Logic Blocks
567(3)
Input/Output Cells
570(1)
Specialized Cores
571(4)
Diagnosis
575(3)
Interconnect Resources
578(5)
Embedded Processor-Based Testing
583(2)
Concluding Remarks
585(1)
Exercises
586(5)
Acknowledgments
587(1)
References
587(4)
MEMS Testing
591(62)
Ramesh Ramadoss
Robert Dean
Xingguo Xiong
Introduction
592(1)
MEMS Testing Considerations
593(1)
Test Methods and Instrumentation for MEMS
594(15)
Electrical Test
595(1)
Optical Test Methods
596(2)
Material Property Measurements
598(1)
Failure Modes and Analysis
599(1)
Mechanical Test Methods
600(7)
Environmental Testing
607(2)
RF MEMS Devices
609(5)
RF MEMS Switches
610(1)
RF MEMS Resonators
611(3)
Optical MEMS Devices
614(2)
Fluidic MEMS Devices
616(4)
MEMS Pressure Sensor
617(1)
MEMS Humidity Sensor
618(2)
Dynamic MEMS Devices
620(5)
MEMS Microphone
620(1)
MEMS Accelerometer
621(1)
MEMS Gyroscope
622(3)
Testing Digital Microfluidic Biochips
625(8)
Overview of Digital Microfluidic Biochips
626(1)
Fault Modeling
627(1)
Test Techniques
628(3)
Application to a Fabricated Biochip
631(2)
DFT and BIST for MEMS
633(10)
Overview of DFT and BIST Techniques
633(4)
MEMS BIST Examples
637(6)
Concluding Remarks
643(1)
Exercises
644(9)
Acknowledgments
646(1)
References
646(7)
High-Speed I/O Interfaces
653(50)
Mike Peng Li
T. M. Male
Kwang-Ting (Tim) Cheng
Introduction
654(3)
High-Speed I/O Architectures
657(11)
Global Clock I/O Architectures
657(1)
Source Synchronous I/O Architectures
658(2)
Embedded Clock I/O Architectures
660(1)
Jitter Components
661(1)
Jitter Separation
662(4)
Jitter, Noise, and Bit-Error-Rate Interactions
666(2)
Testing of I/O Interfaces
668(12)
Testing of Global Clock I/O
669(1)
Testing of Source Synchronous I/O
669(2)
Testing of Embedded Clock High-Speed Serial I/O
671(1)
Transmitter
671(2)
Channel or Medium
673(2)
Receiver
675(2)
Reference Clock
677(1)
System-Level Bit-Error-Rate Estimation
678(1)
Tester Apparatus Considerations
678(2)
DFT-Assisted Testing
680(10)
AC Loopback Testing
681(2)
High-Speed Serial-Link Loopback Testing
683(3)
Testing the Equalizers
686(4)
System-Level Interconnect Testing
690(4)
Interconnect Testing with Boundary Scan
690(1)
Interconnect Testing with High-Speed Boundary Scan
691(2)
Interconnect Built-in Self-Test
693(1)
Future Challenges
694(1)
Concluding Remarks
695(1)
Exercises
696(7)
Acknowledgments
697(1)
References
697(6)
Analog and Mixed-Signal Test Architectures
703(42)
F. Foster Dai
Charles E. Stroud
Introduction
704(1)
Analog Functional Testing
705(15)
Frequency Response Testing
705(2)
Linearity Testing
707(2)
Signal-to-Noise Ratio Testing
709(1)
Quantization Noise
710(2)
Phase Noise
712(3)
Noise in Phase-Locked Loops
715(1)
In-Band PLL Phase Noise
716(2)
Out-Band PLL Phase Noise
718(1)
Optimal Loop Setting
718(1)
DAC Nonlinearity Testing
719(1)
Analog and Mixed-Signal Test Architectures
720(4)
Defect-Oriented Mixed-Signal BIST Approaches
724(3)
FFT-Based Mixed-Signal BIST
727(6)
FFT
727(2)
Inverse FFT
729(1)
FFT-Based BIST Architecture
729(1)
FFT-Based Output Response Analysis
730(1)
FFT-Based Test Pattern Generation
731(2)
Direct Digital Synthesis BIST
733(6)
DOS-Based BIST Architecture
734(2)
Frequency Response Test and Measurement
736(2)
Linearity Test and Measurement
738(1)
SNR and Noise Figure Measurement
739(1)
Concluding Remarks
739(1)
Exercises
740(5)
Acknowledgments
741(1)
References
741(4)
RF Testing
745(46)
Soumendu Bhattacharya
Abhijit Chatterjee
Introduction
746(4)
RF Basics
746(2)
RF Applications
748(2)
Key Specifications for RF Systems
750(26)
Test Instrumentation
750(1)
Spectrum Analyzer
751(1)
Network Analyzer
752(1)
Noise Figure Meter
753(2)
Phase Meter
755(1)
Test Flow in Industry
755(1)
Design and Fabrication
756(1)
Characterization Test
756(1)
Production Test
756(1)
Characterization Test and Production Test
757(1)
Accuracy
757(1)
Time Required for Testing
758(1)
Cost of Testing
758(1)
Circuit-Level Specifications
758(1)
Gain
759(1)
Harmonics and Third-Order Intercept Point (IP3)
759(4)
1-dB Compression Point (P_ldB)
763(1)
Total Harmonic Distortion (THD)
763(1)
Gain Flatness
764(1)
Noise Figure
765(2)
Sensitivity and Dynamic Range
767(1)
Local Oscillator Leakage
768(1)
Phase Noise
768(1)
Adjacent Channel Power Ratio
769(1)
System-Level Specifications
770(1)
I-Q Mismatch
770(1)
Error Vector Magnitude
771(1)
Modulation Error Ratio
772(1)
Bit Error Rate
773(1)
Structure of RF Systems
774(2)
Test Hardware: Tester and DIB/PIB
776(3)
Repeatability and Accuracy
779(3)
Industry Practices for High-Volume Manufacturing
782(3)
Test Cost Analysis
783(1)
Key Trends
784(1)
Concluding Remarks
785(1)
Exercises
786(5)
Acknowledgments
787(1)
References
788(3)
Testing Aspects of Nanotechnology Trends
791(42)
Mehdi B. Tahoori
Niraj K. Jha
R. Iris Bahar
Introduction
792(2)
Resonant Tunneling Diodes and Quantum-Dot Cellular Automata
794(13)
Testing Threshold Networks with Application to RTDs
795(4)
Testing Majority Networks with Application to QCA
799(8)
Crossbar Array Architectures
807(8)
Hybrid Nanoscale/CMOS Structures
810(1)
The nanoPLA
810(3)
Molecular CMOS (CMOL)
813(2)
Built-in Self-Test
815(5)
Simultaneous Configuration and Test
817(3)
Carbon Nanotube (CNT) Field Effect Transistors
820(6)
Imperfection-Immune Circuits for Misaligned CNTs
820(4)
Robust Circuits for Metallic CNTs
824(2)
Concluding Remarks
826(7)
Acknowledgments
826(1)
References
827(6)
Index 833


Laung-Terng Wang, Ph.D., is founder, chairman, and chief executive officer of SynTest Technologies, CA. He received his EE Ph.D. degree from Stanford University. A Fellow of the IEEE, he holds 18 U.S. Patents and 12 European Patents, and has co-authored/co-edited two internationally used DFT textbooks- VLSI Test Principles and Architectures (2006) and System-on-Chip Test Architectures (2007).