Preface |
|
xxi | |
In the Classroom |
|
xxvii | |
Acknowledgments |
|
xxix | |
Contributors |
|
xxxi | |
About the Editors |
|
xxxv | |
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1 | (40) |
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Importance of System-on-Chip Testing |
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2 | (6) |
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5 | (1) |
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Reliability and System Availability |
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6 | (2) |
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8 | (12) |
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Boundary Scan (IEEE 1149.1 Standard) |
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9 | (2) |
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Boundary Scan Extension (IEEE 1149.6 Standard) |
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11 | (2) |
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Boundary-Scan Accessible Embedded Instruments (IEEE P1687) |
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13 | (1) |
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Core-Based Testing (IEEE 1500 Standard) |
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13 | (4) |
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Analog Boundary Scan (IEEE 1149.4 Standard) |
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17 | (3) |
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20 | (4) |
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24 | (6) |
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25 | (2) |
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Network-on-Chip Processor |
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27 | (3) |
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30 | (3) |
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30 | (1) |
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New Fault Models and Advanced Techniques |
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31 | (1) |
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Yield and Reliability Enhancement |
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32 | (1) |
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Nanotechnology Testing Aspects |
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33 | (1) |
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33 | (8) |
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36 | (1) |
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36 | (5) |
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Digital Test Architectures |
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41 | (82) |
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41 | (2) |
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43 | (14) |
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44 | (1) |
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44 | (2) |
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46 | (1) |
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47 | (1) |
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48 | (2) |
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Low-Power Scan Architectures |
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50 | (1) |
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Reduced-Voltage Low-Power Scan Design |
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50 | (1) |
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Reduced-Frequency Low-Power Scan Design |
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50 | (1) |
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Multi-Phase or Multi-Duty Low-Power Scan Design |
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50 | (1) |
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Bandwidth-Matching Low-Power Scan Design |
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51 | (1) |
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Hybrid Low-Power Scan Design |
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52 | (1) |
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At-Speed Scan Architectures |
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52 | (5) |
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57 | (19) |
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58 | (1) |
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Self-Testing Using MISR and Parallel SRSG (STUMPS) |
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58 | (1) |
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Concurrent Built-In Logic Block Observer (CBILBO) |
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59 | (2) |
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Coverage-Driven Logic BIST Architectures |
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61 | (1) |
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Weighted Pattern Generation |
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61 | (1) |
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62 | (2) |
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64 | (1) |
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65 | (1) |
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Low-Power Logic BIST Architectures |
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66 | (1) |
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Low-Transition BIST Design |
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66 | (1) |
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Test-Vector-Inhibiting BIST Design |
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67 | (1) |
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Modified LFSR Low-Power BIST Design |
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67 | (1) |
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At-Speed Logic BIST Architectures |
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68 | (1) |
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68 | (2) |
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70 | (3) |
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73 | (2) |
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75 | (1) |
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76 | (21) |
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Circuits for Test Stimulus Compression |
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77 | (1) |
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Linear-Decompression-Based Schemes |
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77 | (4) |
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Broadcast-Scan-Based Schemes |
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81 | (4) |
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85 | (2) |
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Circuits for Test Response Compaction |
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87 | (1) |
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88 | (4) |
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92 | (1) |
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Mixed Time and Space Compaction |
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93 | (1) |
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Low-Power Test Compression Architectures |
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94 | (1) |
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95 | (2) |
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Random-Access Scan Design |
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97 | (9) |
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Random-Access Scan Architectures |
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98 | (2) |
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Progressive Random-Access Scan Design |
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100 | (1) |
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Shift-Addressable Random-Access Scan Design |
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101 | (2) |
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Test Compression RAS Architectures |
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103 | (2) |
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At-Speed RAS Architectures |
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105 | (1) |
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106 | (1) |
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106 | (17) |
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110 | (1) |
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111 | (12) |
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123 | (48) |
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123 | (1) |
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Fundamentals of Fault Tolerance |
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124 | (5) |
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125 | (1) |
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Mean Time to Failure (MTTF) |
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126 | (1) |
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127 | (1) |
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127 | (2) |
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Fundamentals of Coding Theory |
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129 | (13) |
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129 | (6) |
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135 | (1) |
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135 | (1) |
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136 | (1) |
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136 | (1) |
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137 | (5) |
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142 | (21) |
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142 | (1) |
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142 | (4) |
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146 | (2) |
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148 | (2) |
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150 | (1) |
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150 | (1) |
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Multiple Sampling of Outputs |
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151 | (1) |
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152 | (1) |
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153 | (1) |
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153 | (7) |
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160 | (3) |
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163 | (2) |
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165 | (1) |
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165 | (6) |
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168 | (1) |
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168 | (3) |
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System/Network-on-Chip Test Architectures |
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171 | (54) |
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172 | (3) |
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System-on-Chip (SOC) Testing |
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175 | (17) |
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175 | (2) |
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Wrapper Design and Optimization |
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177 | (2) |
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TAM Design and Optimization |
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179 | (2) |
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181 | (4) |
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Modular Testing of Mixed-Signal SOCs |
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185 | (3) |
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Modular Testing of Hierarchical SOCs |
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188 | (3) |
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Wafer-Sort Optimization for Core-Based SOCs |
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191 | (1) |
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Network-on-Chip (NOC) Testing |
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192 | (17) |
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192 | (2) |
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Testing of Embedded Cores |
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194 | (1) |
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Reuse of On-Chip Network for Testing |
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194 | (2) |
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196 | (1) |
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Test Access Methods and Test Interface |
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197 | (1) |
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Efficient Reuse of Network |
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198 | (4) |
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Power-Aware and Thermal-Aware Testing |
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202 | (1) |
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Testing of On-Chip Networks |
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203 | (1) |
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Testing of Interconnect Infrastructures |
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203 | (2) |
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205 | (3) |
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Testing of Network Interfaces and Integrated System Testing |
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208 | (1) |
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Design and Test Practice: Case Studies |
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209 | (6) |
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SOC Testing for PNX8550 System Chip |
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210 | (2) |
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NOC Testing for a High-End TV System |
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212 | (3) |
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215 | (1) |
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216 | (9) |
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217 | (1) |
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217 | (8) |
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225 | (38) |
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226 | (9) |
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226 | (1) |
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227 | (3) |
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Yield and Quality Challenges |
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230 | (3) |
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233 | (2) |
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235 | (7) |
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Mechanical Probing Techniques |
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235 | (2) |
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Electrical Probing Techniques |
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237 | (3) |
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240 | (2) |
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242 | (4) |
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242 | (3) |
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Loopback Techniques: DFT and DSP |
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245 | (1) |
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Test of Embedded Components |
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246 | (11) |
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247 | (3) |
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250 | (1) |
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251 | (2) |
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253 | (1) |
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253 | (1) |
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Test of Analog, Mixed-Signal, and RF Dies |
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254 | (1) |
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255 | (2) |
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257 | (1) |
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257 | (6) |
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258 | (1) |
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258 | (5) |
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263 | (44) |
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263 | (2) |
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265 | (4) |
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266 | (1) |
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266 | (1) |
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266 | (2) |
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Faster-Than-At-Speed Testing |
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268 | (1) |
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269 | (7) |
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269 | (1) |
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270 | (1) |
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270 | (1) |
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270 | (1) |
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Defect-Based Delay Fault Models |
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271 | (5) |
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276 | (1) |
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277 | (3) |
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Transition Fault Simulation |
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277 | (1) |
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Gate/Line Delay Fault Simulation |
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277 | (1) |
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Path-Delay Fault Simulation |
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278 | (1) |
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Defect-Based Delay Fault Model Simulation |
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278 | (2) |
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Delay Fault Test Generation |
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280 | (8) |
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Transition/Inline Fault ATPG |
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280 | (2) |
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282 | (1) |
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282 | (1) |
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K Longest Paths per Gate (KLPG) ATPG |
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283 | (5) |
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Pseudo-Functional Testing to Avoid Over-Testing |
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288 | (6) |
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290 | (1) |
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291 | (1) |
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291 | (2) |
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293 | (1) |
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294 | (1) |
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295 | (12) |
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299 | (1) |
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300 | (7) |
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307 | (44) |
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307 | (2) |
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Energy and Power Modeling |
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309 | (4) |
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310 | (1) |
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311 | (1) |
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Test-Power Modeling and Evaluation |
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312 | (1) |
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313 | (3) |
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314 | (1) |
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314 | (1) |
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315 | (1) |
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316 | (12) |
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316 | (2) |
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ATPG and X-Filling Techniques |
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318 | (2) |
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Low-Power Test Vector Compaction |
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320 | (1) |
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321 | (1) |
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322 | (2) |
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Scan Architecture Modification |
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324 | (2) |
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326 | (2) |
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Low-Power Built-in Self-Test |
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328 | (7) |
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328 | (1) |
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329 | (1) |
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Low-Power Test Pattern Generators |
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330 | (1) |
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331 | (1) |
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332 | (2) |
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Power-Aware Test Scheduling |
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334 | (1) |
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Low-Power Test Data Compression |
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335 | (4) |
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336 | (1) |
|
Linear-Decompression-Based Schemes |
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336 | (1) |
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Broadcast-Scan-Based Schemes |
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337 | (2) |
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|
339 | (2) |
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341 | (1) |
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342 | (9) |
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344 | (1) |
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344 | (7) |
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Coping with Physical Failures, Soft Errors, and Reliability Issues |
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351 | (72) |
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352 | (2) |
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354 | (16) |
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Basic Concept of Integrity Loss |
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354 | (2) |
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Sources of Integrity Loss |
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356 | (1) |
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356 | (2) |
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|
358 | (1) |
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358 | (2) |
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Integrity Loss Sensors/Monitors |
|
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360 | (1) |
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|
360 | (1) |
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Power Supply Noise Monitor |
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|
361 | (1) |
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Noise Detector (ND) Sensor |
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362 | (1) |
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Integrity Loss Sensor (ILS) |
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362 | (1) |
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363 | (1) |
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364 | (1) |
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365 | (1) |
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365 | (2) |
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367 | (1) |
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368 | (2) |
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Manufacturing Defects, Process Variations, and Reliability |
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370 | (16) |
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370 | (1) |
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371 | (1) |
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372 | (6) |
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378 | (1) |
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379 | (2) |
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Redundancy and Memory Repair |
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381 | (1) |
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Process Sensors and Adaptive Design |
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382 | (1) |
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383 | (1) |
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383 | (2) |
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385 | (1) |
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386 | (16) |
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Sources of Soft Errors and SER Trends |
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387 | (3) |
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390 | (1) |
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390 | (4) |
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Error-Resilient Microarchitectures |
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394 | (4) |
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398 | (4) |
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Defect and Error Tolerance |
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402 | (5) |
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404 | (1) |
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405 | (2) |
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407 | (1) |
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407 | (16) |
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409 | (1) |
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|
409 | (14) |
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Design for Manufacturability and Yield |
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423 | (40) |
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423 | (3) |
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426 | (1) |
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427 | (3) |
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428 | (1) |
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429 | (1) |
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430 | (3) |
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433 | (12) |
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435 | (4) |
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439 | (2) |
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Yield Variation over Time |
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441 | (3) |
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444 | (1) |
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|
445 | (4) |
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|
445 | (1) |
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Deterministic versus Random Variability |
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446 | (2) |
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Variability versus Defectivity |
|
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448 | (1) |
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449 | (1) |
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449 | (7) |
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450 | (2) |
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452 | (1) |
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452 | (1) |
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452 | (2) |
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Example DRC-Based Metrics for DFM |
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454 | (2) |
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456 | (1) |
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457 | (6) |
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458 | (1) |
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|
459 | (4) |
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Design for Debug and Diagnosis |
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463 | (42) |
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463 | (5) |
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What Are Debug and Diagnosis? |
|
|
464 | (1) |
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465 | (1) |
|
IC-Level Debug and Diagnosis |
|
|
465 | (1) |
|
Silicon Debug versus Defect Diagnosis |
|
|
466 | (1) |
|
Design for Debug and Diagnosis |
|
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467 | (1) |
|
Logic Design for Debug and Diagnosis (DFD) Structures |
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468 | (8) |
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|
468 | (1) |
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469 | (2) |
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Observation Points with Multiplexers |
|
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471 | (1) |
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Array Dump and Trace Logic Analyzer |
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472 | (1) |
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473 | (2) |
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Partitioning, Isolation, and De-featuring |
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475 | (1) |
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476 | (1) |
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|
476 | (11) |
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477 | (1) |
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478 | (1) |
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|
478 | (1) |
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|
479 | (4) |
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|
483 | (1) |
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Infrared Emission Microscopy (IREM) |
|
|
483 | (2) |
|
Picosecond Imaging Circuit Analysis (PICA) |
|
|
485 | (1) |
|
Time Resolved Emissions (TRE) |
|
|
486 | (1) |
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|
487 | (3) |
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|
487 | (1) |
|
Layout-Database-Driven Navigation System |
|
|
488 | (1) |
|
Spare Gates and Spare Wires |
|
|
489 | (1) |
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|
490 | (2) |
|
Physical DFD for Pico-Probing |
|
|
490 | (1) |
|
|
491 | (1) |
|
Physical DFD for FIB and Probing |
|
|
492 | (1) |
|
Diagnosis and Debug Process |
|
|
492 | (6) |
|
Diagnosis Techniques and Strategies |
|
|
495 | (1) |
|
Silicon Debug Process and Flow |
|
|
496 | (1) |
|
Debug Techniques and Methodology |
|
|
497 | (1) |
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|
498 | (1) |
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|
499 | (6) |
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|
500 | (1) |
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|
500 | (5) |
|
Software-Based Self-Testing |
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|
505 | (44) |
|
|
|
|
506 | (1) |
|
Software-Based Self-Testing Paradigm |
|
|
507 | (3) |
|
|
508 | (1) |
|
Comparison with Structural BIST |
|
|
509 | (1) |
|
Processor Functional Fault Self-Testing |
|
|
510 | (6) |
|
|
510 | (2) |
|
Functional-Level Fault Models |
|
|
512 | (1) |
|
Test Generation Procedures |
|
|
513 | (1) |
|
Test Generation for Register Decoding Fault |
|
|
513 | (1) |
|
Test Generation for Instruction Decoding and Control Fault |
|
|
514 | (1) |
|
Test Generation for Data Transfer and Storage Function |
|
|
515 | (1) |
|
Test Generation for Data Manipulation Function |
|
|
516 | (1) |
|
Test Generation Complexity |
|
|
516 | (1) |
|
Processor Structural Fault Self-Testing |
|
|
516 | (14) |
|
|
516 | (1) |
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|
516 | (1) |
|
|
517 | (1) |
|
|
518 | (1) |
|
Instruction-Imposed I/O Constraint Extraction |
|
|
518 | (1) |
|
Constrained Component Test Generation |
|
|
519 | (2) |
|
|
521 | (1) |
|
|
522 | (1) |
|
Test Program Synthesis Using Virtual Constraint Circuits (VCCs) |
|
|
523 | (3) |
|
|
526 | (1) |
|
Functionally Untestable Delay Faults |
|
|
526 | (1) |
|
|
527 | (1) |
|
|
528 | (1) |
|
Functional Random Instruction Testing |
|
|
529 | (1) |
|
|
530 | (3) |
|
Challenges to SBST-Based Processor Diagnosis |
|
|
530 | (1) |
|
Diagnostic Test Program Generation |
|
|
531 | (2) |
|
Testing Global Interconnect |
|
|
533 | (3) |
|
Maximum Aggressor (MA) Fault Model |
|
|
533 | (1) |
|
Processor-Based Address and Data Bus Testing |
|
|
534 | (1) |
|
|
534 | (1) |
|
|
535 | (1) |
|
Processor-Based Functional MA Testing |
|
|
536 | (1) |
|
Testing Nonprogrammable Cores |
|
|
536 | (2) |
|
|
538 | (1) |
|
|
538 | (1) |
|
|
538 | (3) |
|
Instruction-Level DFT Concept |
|
|
538 | (1) |
|
|
539 | (2) |
|
Test Optimization Instructions |
|
|
541 | (1) |
|
DSP-Based Analog/Mixed-Signal Component Testing |
|
|
541 | (2) |
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|
543 | (1) |
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|
544 | (5) |
|
|
545 | (1) |
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|
545 | (4) |
|
Field Programmable Gate Array Testing |
|
|
549 | (42) |
|
|
|
549 | (9) |
|
|
550 | (4) |
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|
554 | (2) |
|
|
556 | (2) |
|
|
558 | (4) |
|
External Testing and Built-in Self-Test |
|
|
559 | (1) |
|
Online and Offline Testing |
|
|
560 | (1) |
|
Application Dependent and Independent Testing |
|
|
561 | (1) |
|
BIST of Programmable Resources |
|
|
562 | (21) |
|
|
563 | (4) |
|
Programmable Logic Blocks |
|
|
567 | (3) |
|
|
570 | (1) |
|
|
571 | (4) |
|
|
575 | (3) |
|
|
578 | (5) |
|
Embedded Processor-Based Testing |
|
|
583 | (2) |
|
|
585 | (1) |
|
|
586 | (5) |
|
|
587 | (1) |
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|
587 | (4) |
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|
591 | (62) |
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|
|
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|
592 | (1) |
|
MEMS Testing Considerations |
|
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593 | (1) |
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Test Methods and Instrumentation for MEMS |
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594 | (15) |
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595 | (1) |
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596 | (2) |
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Material Property Measurements |
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598 | (1) |
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Failure Modes and Analysis |
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599 | (1) |
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600 | (7) |
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607 | (2) |
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609 | (5) |
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610 | (1) |
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611 | (3) |
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614 | (2) |
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616 | (4) |
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617 | (1) |
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618 | (2) |
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620 | (5) |
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620 | (1) |
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621 | (1) |
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622 | (3) |
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Testing Digital Microfluidic Biochips |
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|
625 | (8) |
|
Overview of Digital Microfluidic Biochips |
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626 | (1) |
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627 | (1) |
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628 | (3) |
|
Application to a Fabricated Biochip |
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631 | (2) |
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633 | (10) |
|
Overview of DFT and BIST Techniques |
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633 | (4) |
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637 | (6) |
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643 | (1) |
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644 | (9) |
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|
646 | (1) |
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|
646 | (7) |
|
High-Speed I/O Interfaces |
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|
653 | (50) |
|
|
|
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|
654 | (3) |
|
High-Speed I/O Architectures |
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657 | (11) |
|
Global Clock I/O Architectures |
|
|
657 | (1) |
|
Source Synchronous I/O Architectures |
|
|
658 | (2) |
|
Embedded Clock I/O Architectures |
|
|
660 | (1) |
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661 | (1) |
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|
662 | (4) |
|
Jitter, Noise, and Bit-Error-Rate Interactions |
|
|
666 | (2) |
|
Testing of I/O Interfaces |
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|
668 | (12) |
|
Testing of Global Clock I/O |
|
|
669 | (1) |
|
Testing of Source Synchronous I/O |
|
|
669 | (2) |
|
Testing of Embedded Clock High-Speed Serial I/O |
|
|
671 | (1) |
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671 | (2) |
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|
673 | (2) |
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|
675 | (2) |
|
|
677 | (1) |
|
System-Level Bit-Error-Rate Estimation |
|
|
678 | (1) |
|
Tester Apparatus Considerations |
|
|
678 | (2) |
|
|
680 | (10) |
|
|
681 | (2) |
|
High-Speed Serial-Link Loopback Testing |
|
|
683 | (3) |
|
|
686 | (4) |
|
System-Level Interconnect Testing |
|
|
690 | (4) |
|
Interconnect Testing with Boundary Scan |
|
|
690 | (1) |
|
Interconnect Testing with High-Speed Boundary Scan |
|
|
691 | (2) |
|
Interconnect Built-in Self-Test |
|
|
693 | (1) |
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|
694 | (1) |
|
|
695 | (1) |
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|
696 | (7) |
|
|
697 | (1) |
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|
697 | (6) |
|
Analog and Mixed-Signal Test Architectures |
|
|
703 | (42) |
|
|
|
|
704 | (1) |
|
Analog Functional Testing |
|
|
705 | (15) |
|
Frequency Response Testing |
|
|
705 | (2) |
|
|
707 | (2) |
|
Signal-to-Noise Ratio Testing |
|
|
709 | (1) |
|
|
710 | (2) |
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|
712 | (3) |
|
Noise in Phase-Locked Loops |
|
|
715 | (1) |
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716 | (2) |
|
|
718 | (1) |
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|
718 | (1) |
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|
719 | (1) |
|
Analog and Mixed-Signal Test Architectures |
|
|
720 | (4) |
|
Defect-Oriented Mixed-Signal BIST Approaches |
|
|
724 | (3) |
|
FFT-Based Mixed-Signal BIST |
|
|
727 | (6) |
|
|
727 | (2) |
|
|
729 | (1) |
|
FFT-Based BIST Architecture |
|
|
729 | (1) |
|
FFT-Based Output Response Analysis |
|
|
730 | (1) |
|
FFT-Based Test Pattern Generation |
|
|
731 | (2) |
|
Direct Digital Synthesis BIST |
|
|
733 | (6) |
|
DOS-Based BIST Architecture |
|
|
734 | (2) |
|
Frequency Response Test and Measurement |
|
|
736 | (2) |
|
Linearity Test and Measurement |
|
|
738 | (1) |
|
SNR and Noise Figure Measurement |
|
|
739 | (1) |
|
|
739 | (1) |
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|
740 | (5) |
|
|
741 | (1) |
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|
741 | (4) |
|
|
745 | (46) |
|
|
|
|
746 | (4) |
|
|
746 | (2) |
|
|
748 | (2) |
|
Key Specifications for RF Systems |
|
|
750 | (26) |
|
|
750 | (1) |
|
|
751 | (1) |
|
|
752 | (1) |
|
|
753 | (2) |
|
|
755 | (1) |
|
|
755 | (1) |
|
|
756 | (1) |
|
|
756 | (1) |
|
|
756 | (1) |
|
Characterization Test and Production Test |
|
|
757 | (1) |
|
|
757 | (1) |
|
Time Required for Testing |
|
|
758 | (1) |
|
|
758 | (1) |
|
Circuit-Level Specifications |
|
|
758 | (1) |
|
|
759 | (1) |
|
Harmonics and Third-Order Intercept Point (IP3) |
|
|
759 | (4) |
|
1-dB Compression Point (P_ldB) |
|
|
763 | (1) |
|
Total Harmonic Distortion (THD) |
|
|
763 | (1) |
|
|
764 | (1) |
|
|
765 | (2) |
|
Sensitivity and Dynamic Range |
|
|
767 | (1) |
|
|
768 | (1) |
|
|
768 | (1) |
|
Adjacent Channel Power Ratio |
|
|
769 | (1) |
|
System-Level Specifications |
|
|
770 | (1) |
|
|
770 | (1) |
|
|
771 | (1) |
|
|
772 | (1) |
|
|
773 | (1) |
|
|
774 | (2) |
|
Test Hardware: Tester and DIB/PIB |
|
|
776 | (3) |
|
Repeatability and Accuracy |
|
|
779 | (3) |
|
Industry Practices for High-Volume Manufacturing |
|
|
782 | (3) |
|
|
783 | (1) |
|
|
784 | (1) |
|
|
785 | (1) |
|
|
786 | (5) |
|
|
787 | (1) |
|
|
788 | (3) |
|
Testing Aspects of Nanotechnology Trends |
|
|
791 | (42) |
|
|
|
|
|
792 | (2) |
|
Resonant Tunneling Diodes and Quantum-Dot Cellular Automata |
|
|
794 | (13) |
|
Testing Threshold Networks with Application to RTDs |
|
|
795 | (4) |
|
Testing Majority Networks with Application to QCA |
|
|
799 | (8) |
|
Crossbar Array Architectures |
|
|
807 | (8) |
|
Hybrid Nanoscale/CMOS Structures |
|
|
810 | (1) |
|
|
810 | (3) |
|
|
813 | (2) |
|
|
815 | (5) |
|
Simultaneous Configuration and Test |
|
|
817 | (3) |
|
Carbon Nanotube (CNT) Field Effect Transistors |
|
|
820 | (6) |
|
Imperfection-Immune Circuits for Misaligned CNTs |
|
|
820 | (4) |
|
Robust Circuits for Metallic CNTs |
|
|
824 | (2) |
|
|
826 | (7) |
|
|
826 | (1) |
|
|
827 | (6) |
Index |
|
833 | |