Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology....Loe edasi...
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other...Loe edasi...
Vasilis F. Pavlidis, Ioannis Savidis, Eby G. Friedman
(Ilmumisaeg: 03-Jul-2017, Paperback / softback, Kirjastus: Morgan Kaufmann Publishers In, ISBN-13: 9780124105010)
Three-Dimensional Integrated Circuit Design 2e, expands the original with more than 50 new content, adding new the latest developments in modeling, temperature considerations, power management, memory issues, and heterogeneous integration....Loe edasi...
This book unveils how to effectively and optimally design 3D circuits. It covers the necessary design tools for 3D circuits while exploiting the benefits of 3D technology. An overview of physical design challenges with respect to conventional 2D c...Loe edasi...
In a text on the design of three dimensional (3D) integrated circuits and systems, electrical engineers focus on such aspects of 3D integration as 3D circuit and system design, new processes and simulation techniques, alternative communications schem...Loe edasi...
(Ilmumisaeg: 20-Jun-2014, Other digital carrier, Kirjastus: Wiley-VCH Verlag GmbH, ISBN-13: 9783527670109)
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bond...Loe edasi...
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bond...Loe edasi...
(Ilmumisaeg: 25-Nov-2012, Hardback, Kirjastus: Springer-Verlag New York Inc., ISBN-13: 9781441995414)
This book describes a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It provides full details of all key algorithms, for maximum understanding and...Loe edasi...
Ehrenfried Zschech, Riko Radojcic, Valeriy Sukharev, Larry Smith
Sari: AIP Conference Proceedings / Materials Physics and Applications
(Ilmumisaeg: 23-Nov-2011, Paperback / softback, Kirjastus: American Institute of Physics, ISBN-13: 9780735409385)
Scientist and engineers as well as graduate students in the fields of This conference will be of interest to anyone involved in Physics, Electrical Engineering, Materials Science and Engineering, Reliability and Quality Management, both in industry a...Loe edasi...
(Ilmumisaeg: 31-Oct-2008, Paperback / softback, Kirjastus: Morgan Kaufmann Publishers In, ISBN-13: 9780123743435)
With vastly increased complexity and functionality in the nanometer era (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable...Loe edasi...
saadame teile pakkumise kasutatud raamatule, mille hind võib erineda kodulehel olevast hinnast
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume h...Loe edasi...
