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E-raamat: Area Array Packaging Handbook: Manufacturing and Assembly

  • Formaat: 1000 pages
  • Ilmumisaeg: 26-Nov-2001
  • Kirjastus: McGraw-Hill Professional
  • Keel: eng
  • ISBN-13: 9780071500654
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Area Array Packaging Handbook: Manufacturing and AssemblySuurem pilt
  • Formaat: 1000 pages
  • Ilmumisaeg: 26-Nov-2001
  • Kirjastus: McGraw-Hill Professional
  • Keel: eng
  • ISBN-13: 9780071500654
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This book covers area array packaging at the cutting-edge. This is the first book to bring BGA, CSP, and Flip Chip together - teaching design, application, and manufacturing how-tos. As pagers, cell phones, and other portable electronics shrink while demand for features and functions grows, the need for better, faster, smaller, cooler high-density interconnects (HDI) becomes more critical. "The Area Array Packaging Handbook" brings you the details you need on this rapidly expanding field in microelectronics packaging.Filled with hands-on, leading edge information engineers need for day-to-day decision making, "Area Array Packaging Handbook" is an unbeatable resource for success in today's fast-paced world of HDI. Look for these highlights inside: the hottest technologies in electronics packaging - BGA, CSP, and Flip Chip - all in one reference; details on MEMs technology; pros and cons of each technology in various applications; solutions for difficult packaging ramifications of HDI design concepts; detailed coverage of critical reliability and testing issues; help with design, materials, and manufacturing processes; problem-solving approaches to conception, construction, assembly, and applications; world-class expert contributors; and, 400 illustrations. It covers advances, applications, concepts, design, economics, opimization, equipment, future, technology, materials, processes, and productivity.
Forword Section 1: Packaging Concepts and Design
Chapter 1: Introduction to Electronic Packaging
Chapter 2: Electronics Industry Overview
Chapter 3: Trends/Drivers in the Electronics Manufacturing Industry
Chapter 4: Area Array Packaging
Chapter 5: Stacked/3D Packages
Chapter 6: Compliant IC Packaging
Chapter 7: Flip Chip Technology
Chapter 8: Options in High-Density Part Cleaning
Chapter 9: MEMS Packaging and Assembly Challenges
Chapter 10: Ceramic Ball and Column Grid Array Overview Section 2: Materials
Chapter 11: Polyer Packaging Materials: Adhesives, Encapsulants, and Underfills
Chapter 12: Hermetic Packaging Systems: Adhesive and Getter
Chapter 13: Area Array Solder Spheres, Pastes, and Fluxes
Chapter 14: Modern Solder and Solder Paste
Chapter 15: Lead-Free Systems and Process Implications
Chapter 16: Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder? Section 3: Equipment and Processes
Chapter 17: Next-Generation Flip Chip Materials and Processes
Chapter 18: Flip Chip Assembly and Underfilling
Chapter 19: BGA and CSP Rework: What is Involved?
Chapter 20: BGA Assembly Reliability
Chapter 21: Die Attach and Rework
Chapter 22: Liquid Encapsulation Equipment and Processes
Chapter 23: Molding for Area Array Packages
Chapter 24: Screen Printing and Stenciling
Chapter 25: Criteria for Placement and Processing of Advanced Packages
Chapter 26: Ovens in Electronics
Chapter 27: Process Development, Control, and Organization Section 4: Economics and Productivity
Chapter 28: Metrics: The Key to Productivity
Chapter 29: Cost Estimating for Electronic Assembly Section 5: Future
Chapter 30: The Future of Electronic Packaging
Chapter 31: The Future of SMT Process Equipment Index
Ken Gilleo, Ph.D., General Technologist for Cookson Electronics, is a widely respected expert on microelectronics packaging. The author of Handbook of Flexible Circuitry and Polymer Thick Film, as well as over 260 professional journal articles on packaging, circuitry, and materials, he holds 35 U.S. patents and currently serves on the board of directors of the SMTA (Surface Mount Technology Association).
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