(Ilmumisaeg: 30-Nov-2016, EPUB+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781315351797)
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most...Loe edasi...
(Ilmumisaeg: 30-Nov-2016, PDF+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781498745536)
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most re...Loe edasi...
