Ingliskeelsed e-raamatud

• • 1. E-raamat: Interconnect Reliability in Advanced Memory Device Packaging [e-raamat]

  • Chong Leong, Gan, Chen-Yu, Huang
  • Sari: Springer Series in Reliability Engineering
  • (Ilmumisaeg: 28-Apr-2023, PDF+DRM, Kirjastus: Springer International Publishing AG, ISBN-13: 9783031267086)
  • This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and t... Loe edasi...

  • Hind: 222,29 €
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• • 2. E-raamat: Interconnect Reliability in Advanced Memory Device Packaging [e-raamat]

  • Chong Leong, Gan, Chen-Yu, Huang
  • Sari: Springer Series in Reliability Engineering
  • (Ilmumisaeg: 28-Apr-2023, EPUB+DRM, Kirjastus: Springer International Publishing AG, ISBN-13: 9783031267086)
  • This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and t... Loe edasi...

  • Hind: 222,29 €
  • Lisa ostukorvi
  • või lisa soovinimekirja

  

  Kiirvaade