1 Introduction and Motivation |
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1.2 SRAM in the Computer Memory Hierarchy |
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1.3 Technology Scaling and SRAM Design and Test |
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1.3.2 Obstacles in SRAM Scaling |
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1.5 SRAM Design and Test Tradeoffs |
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1.5.3 Test Coverage and Test Time |
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2 SRAM Circuit Design and Operation |
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2.3.1 Four-Transistor (4T) SRAM Cell with Polysilicon Resistor Load |
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2.3.2 Six-Transistor (6T) CMOS SRAM Cell |
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2.3.3 Four-Transistor (4T) Loadless SRAM Cell |
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2.4 Cell Layout Considerations |
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2.5 Sense Amplifier and Bit Line Precharge-Equalization |
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2.7 Row Address Decoder and Column MUX |
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2.8 Address Transition Detector |
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2.9 Timing Control Schemes |
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2.9.1 Delay-Line Based Timing Control |
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2.9.2 Replica-Loop Based Timing Control |
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2.9.3 Pipelined Timing Control |
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3 SRAM Cell Stability: Definition, Modeling and Testing |
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3.2 Static Noise Margin of SRAM Cells |
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3.3.1 Inverter V,L, V/H, VOL and VOH |
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3.3.2 Noise Margins NMH and NML with VOL and VOH Defined as Stable Logic Points |
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3.3.3 Noise Margins NMH and NML with VOL and VOH Defined as —1 Slope Points |
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3.3.4 SNM as a Side of the Maximum Square Drawn Between the Inverter Characteristics |
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3.4 Analytical Expressions for SNM Calculation |
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3.4.1 Analytical SNM Expression for a 4T SRAM Cell with Polysilicon Resistor Load |
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3.4.2 Analytical SNM Expression for a 6T SRAM Cell |
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3.4.3 Conclusions from SNM Analytical Expressions |
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3.4.4 Analytical SNM Expression for a Loadless 4T SRAM Cell |
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3.4.4.1 Alpha-Power Law Model |
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3.4.4.2 Analytical SNM Expression Derivation |
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3.4.4.3 Finding VOH and VIL |
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3.4.4.4 Finding VOL and VIH |
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3.4.4.5 SNM Expression for 4T Loadless SRAM Cell |
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3.4.4.6 Simulation Results vs. the Analytical Expression |
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3.5 SRAM Cell Stability Sensitivity Factors |
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3.5.1 SRAM SNM and Process Parameter Variations |
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3.5.2 SRAM SNM and Non-catastrophic Defects |
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3.5.2.1 SNM vs. Non-catastrophic Breaks and Bridges |
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3.5.3 SRAM SNM and Operating Voltages Variation |
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3.6 SRAM Cell Stability Fault Model |
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3.7 SRAM Cell Stability Detection Concept |
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3.8 March Tests and Stability Fault Detection in SRAMs |
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3.8.3 Coupling Fault Detection |
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4 Traditional SRAM Fault Models and Test Practices |
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4.2 Traditional Fault Models |
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4.3 Traditional SRAM Test Practices |
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4.3.2.1 Burn-In Test (BI) |
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4.3.2.3 Limitations of /Div Testing in Scaled Technologies |
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4.3.3 Design For Test Techniques |
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4.3.3.1 Built-In Self Test |
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5 Techniques for Detection of SRAM Cells with Stability Faults |
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5.2 Classification of SRAM Cell Stability Test Techniques |
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5.3 Passive SRAM Cell Stability Test Techniques |
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5.3.1 Data Retention Test |
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5.4 Active SRAM Cell Stability Test Techniques |
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5.4.1 Active Techniques with a Single Test Stress Level |
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5.4.1.1 Soft Defect Detection |
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5.4.1.2 Weak Write Test Mode |
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5.4.1.3 Integrated Weak Write Test Mode |
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5.4.1.4 Word Line Driver Underdrive During a Write Operation |
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5.4.1.5 Soft Defect Detection-II (SDD-II) Technique |
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5.4.1.6 No Write Recovery Test Mode |
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5.4.1.7 Word Line Voltage Overdrive During a Read Operation |
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5.4.2 Active Techniques with Programmable Test Stress Levels |
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5.4.2.1 Short Write Test Mode |
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5.4.2.2 Programmable Weak Write Test Mode |
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5.4.2.3 Programmable Integrated Weak Write Test Mode |
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5.4.2.4 Programmable Read Current Ratio Technique with a Pass Transistor Technique |
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5.4.2.5 Programmable Read Current Ratio Technique with Floating Bit Lines |
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5.4.2.6 Programmable Word Line Pulsing Technique |
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6 Soft Errors in SRAMs: Sources, Mechanisms and Mitigation Techniques |
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6.3 Sources of Soft Errors |
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6.3.2 Neutron-Induced '0B Fission |
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6.3.3 High-Energy Cosmic Rays |
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6.4 Soft Errors and Defects in the Pull-Up Path of a Cell |
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6.5 Soft Error Mitigation Techniques |
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6.5.1 Error Detection and Correction |
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6.5.1.2 Error Correction Codes |
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6.5.1.3 Circuit and/or System Redundancy |
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6.5.2 Removing Radiation Sources or Reducing Their Intensity |
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6.5.3 Increasing the Capacitance of the Storage Nodes |
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6.5.4 Inserting Resistors in the Feedback Loop of an SRAM Cell |
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6.6 Leakage-Reduction Techniques and the SER |
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References |
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Index |
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