E-raamat: Design of 3D Integrated Circuits and Systems

In a text on the design of three dimensional (3D) integrated circuits and systems, electrical engineers focus on such aspects of 3D integration as 3D circuit and system design, new processes and simulation techniques, alternative communications schemes for 3D circuits and systems, applying novel materials, and understanding thermal challenges to restrict power dissipation and improve performance. Among the topics are wafer-level 3D integrated circuits for advanced complementary metal-oxide semiconductors integration, emerging interconnect technology for 3D networks-on-chip, and low-power testing. The material could be useful to researchers, designers, and graduate students. Annotation ©2015 Ringgold, Inc., Portland, OR (protoview.com) Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity.Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text:Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-waferDiscusses the use of interposer technology and the role of Through-Silicon Vias (TSVs)Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs)Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applicationsDescribes large-scale integration testing and state-of-the-art low-power testing solutionsComplete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systemsis a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.