E-raamat: Design Guidelines for Surface Mount Technology

Preface
Chapter 1 SMD Essentials Designing with SMD Substrate
Configurations Mixed Prints Automated SMD Placement Machines
Soldering Techniques Footprint Definition Footprints for Wave
Soldering The "Shadow Effect" Footprint Orientation Solder
Thieves Placement Inaccuracy Dummy Tracks for Adhesive Application
Footprints for Reflow Soldering Solder Cream Applications
Screen Printing Floating Footprint Dimensions Layout
Considerations Component Pitch Solder Land/Via Hole Relationship
Solder Land/Component Lead Relationship Placemant Machine Restrictions
Substrate Population Test Points CAD Systems for SMD Substrate
Layout CAE/CAD/CAM Interaction
Chapter 2 Space Planning and Interface
Standards for SMT Components Component Packaging Options Component
Selection Guidelines Passive Devices: Monolithic Capacitors
Tantalum Capacitors Resistors for SMT Resistor Networks
Potentiometer for SMT Active Devices ICs for SMT Small Outline
(SO) ICs Plastic Chip Carriers and Quad Packages Ceramic ICs
Connectors and Interface for SMT Assembly Heat Seal Compression
Assembly Considerations Estimating Total Component Area Optimizing
Component Placement Component Orientation Utilizing Both Sides of
Substrate Thermal Considerations Power Dissipation Thermal
Resistance Junction Temperature (Tj) Factors Affecting ?JA
Package Considerations Thermal Resistance Measurements Test Method
TSP Calibration Thermal Resistance Measurement Test Ambient
?JC Tests Data Presentation Thermal Calculations System
Considerations Using Leaded Devices (SO, SOL, & PLCC) Compliant
Layer Matching TCE Substrate Types Conclusion
Chapter 3
Specifying Materials for Substrates Common Substrate Materials
Fabrication and Material Planning Providing for Assembly Automation
Design Rules and Layout Guidelines Plated through-Holes Multilayer
and Fine Line Construction Surface Mount and Via Holes Computer
Aided Design and Via Holes Solder Mask on PC Boards Using SMT
Plating Process for SMT High Tech Materials for Military Applications
Specifying Copper Clad Invar Materials for Copper Clad Invar/Polyamide
Commercial SMD Packages Military Packages Special Package
Outlines Bar Code Labeling Footprints
Chapter 4 SMD Assembly
Process Solders for SMD Applications Fluxing and Cleaning
Types of Flux Flux Types Solder Applications Curing Solder
Paste The Reflow Process Cleaning after Reflow Soldering
Assembly Methods Assembly Options for SMDs Adhesive Applications
and Curing Physical Characteristics Adhesive Application
Pin-Transfer Screen-Printing Pressure Syringe Adhesive Dot
Height Criteria Dummy Tracks Solder Land Contamination MELF
Component Placement Adhesive Curing Curing by Heat/Time Plus
Catalyst Curing by Catalytic Action Alone Anaerobic and UV Assisted
Curing Fluxing and Cleaning Fluxes Types of Flux Organic
Soluble Fluxes Non-Activated Rosin (R) Flux Rosin, Mildly Activated
(RMS) Flux Rosin, Activated (RA) Flux Water Soluble Fluxes
Water Soluble Fluxes with Inorganic Salts Water Soluble Fluxes with
Organic Salts Water Soluble Fluxes with Organic Acids Solder Creams
Flux Selection Application of Flux Foam Fluxing Wave
Fluxing Spray Fluxing Flux Density Pre-Heating
Post-Soldering Cleaning Polar Contaminants Non-Polar Contaminants
Solvents Solvent Cleaning Aqueous Cleaning Conformal
Coatings Conclusions Solder Joint Criteria Inspection
Defect Classification Soldering Defects Drawbridging Adhesive
Contamination Blow Holes General Solder Joint Criteria Good
Wetting Sound Smooth Surface Correct Amount of Solder SMD
Joint Assessment Leadless SMDs SMDs with Few Short Leads SO IC
Packages VSO IC Packages PLCC with J-Leads Chip Carriers with
Metallized Castellation Inspection Systems Component and Substrate
Solderability Aspects of Solderability Protective Coatings
Fusible Coatings: Electro-Plated Tin/Lead Solder Coating Solder
Land Contamination
Chapter 5 Contact (Footprint) Design Designing for
Producibility Component Spacing Discrete Component Contact Design
Preferred Component Orientation Commercial IC Footprint Planning:
SOIC, PCC, and QUAD Lead Packages Ceramic IC Packages Contact
Design for Other SMT Products: DIP and SIP Module Design Chip Carrier
Design Building Contact (Footprint) Libraries for SMT Contact
Geometry for Chip Components Optional Wave Solder Contact Geometry for
Chip Components Tantalum Capacitor Contact Geometry MELF Component
Contact Geometry SOT-23 Contact ACT Geometry SOT-89 Contact
Geometry Plastic Chip Carrier (PCC) Contact Geometry Small Outline
Contact Geometry
Chapter 6 Component Spacing for SMT Basic
Considerations Placement Accuracy Requirements Placement Techniques
Trace-to-Trace Guidelines Contact (Footprint) to Via Pad
Solder Mask for Solder Control Automatic Assembly and Testing Mixed
Technology, Through-hole and Surface Mounted Component-to-Board Edge
Requirement
Chapter 7 Artwork Generation Footprint (Contact) Pattern for
Passive Devices Footprint Planning for Active (IC) Components
Hand-Taped Artmaster Preparation Tape and Reel Computer-Aided
Design Autorouting SMT Preparing for Future Assembly Methods
CAD Applications
Chapter 8 PCB Design Considerations Printed Circuit
Board Design Board Considerations Component Location Objectives
Component Selection Lead Diameter Considerations Board Holder
Design Workboard Holder Considerations Rotary Workboard Holder
Design Automatic Board Handling Workboard Holders Programming
Considerations Insertion Machine Pattern Program Format Board Error
Correction Axial Lead Component Insertion Component Input Taping
Considerations Axial Lead Sequencing Insertion Center
Considerations Lead Form and Tooling Printed Circuit Board
Thickness Versus Body Diameter Hole Diameter Requirements Component
Body Configuration Location Considerations Clinch Patterns
Pattern Program Considerations Radial Lead Component Insertion
Taping Considerations Tape Splicing Specification Hole Diameter
Requirements Hole Span Considerations Board Sizing Considerations
Location Considerations Uninsertable Area Cut and Clinch Patterns
Pattern Program Considerations Insertion Reference Point
Optimum Pattern Programming Special Programming Considerations Appendix
I Surface Mount Equipment, Supplies, and Services Appendix II Surface Mount
Device Bibliography Index