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E-raamat: Developments in Surface Contamination and Cleaning, Volume 8: Cleaning Techniques

Edited by (Editor, Reviews of Adhesion and Adhesives, USA), Edited by (National Aeronautics and Space Administration, Houston, TX, USA)
  • Formaat: EPUB+DRM
  • Ilmumisaeg: 19-Nov-2014
  • Kirjastus: William Andrew Publishing
  • Keel: eng
  • ISBN-13: 9780323312714
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Developments in Surface Contamination and Cleaning, Volume 8: Cleaning TechniquesSuurem pilt
  • Formaat: EPUB+DRM
  • Ilmumisaeg: 19-Nov-2014
  • Kirjastus: William Andrew Publishing
  • Keel: eng
  • ISBN-13: 9780323312714
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As device sizes in the semiconductor industries shrink, devices become more vulnerable to smaller contaminant particles, and most conventional cleaning techniques employed in the industry are not effective at smaller scales. The book series Developments in Surface Contamination and Cleaning as a whole provides an excellent source of information on these alternative cleaning techniques as well as methods for characterization and validation of surface contamination. Each volume has a particular topical focus, covering the key techniques and recent developments in the area. Several novel wet and dry surface cleaning methods are addressed in this Volume. Many of these methods have not been reviewed previously, or the previous reviews are dated. These methods are finding increasing commercial application and the information in this book will be of high value to the reader. Edited by the leading experts in small-scale particle surface contamination, cleaning and cleaning control these books will be an invaluable reference for researchers and engineers in R&D, manufacturing, quality control and procurement specification situated in a multitude of industries such as: aerospace, automotive, biomedical, defense, energy, manufacturing, microelectronics, optics and xerography.

This Volume complements other volumes in this series and:

  • provides a state-of-the-art survey and best-practice guidance for scientists and engineers engaged in surface cleaning or handling the consequences of surface contamination
  • addresses the continuing trends of shrinking device size and contamination vulnerability in a range of industries, spearheaded by the semiconductor industry and others
  • covers novel wet and dry surface cleaning methods of increasing commercial importance

Arvustused

"...this excellent series continues to report new cleaning processes in a critical light as well as procedures and protocols for assessing cleanlinessIm not aware of any comparable in-depth treatments in the field of industrial cleaning and for that reason alone, strongly recommend these volumes or individual chapters within them." --Galvanotechnik

Muu info

Provides a state-of-the-art reference for all major areas in surface contamination and cleaning for industries ranging from semiconductor fabrication to space exploration.
Contributors ix
Preface xi
About the Editors xv
1 How Green and Does it Clean: Methodologies for Assessing Cleaning Products for Safety and Performance
1(70)
Jason P. Marshall
Heidi Wilcox
1 Background
2(1)
2 Environmental Concerns
3(1)
3 Green Cleaning
3(3)
4 Regulatory Aspects
6(2)
5 Product Selection
8(1)
6 Green Assessment---What Makes a Product Green?
9(25)
6.1 Pollution Prevention Options Assessment Tool (P20ASys)
10(1)
6.2 Green Screen
11(9)
6.3 Environmental Protection Agency Design for the Environment
20(10)
6.4 Green Seal™ Environmental Standard for Cleaning and Degreasing Agents (GS 34)
30(1)
6.5 Quick Guide for Tools
31(3)
7 Performance Testing/Efficacy Evaluation
34(29)
7.1 Basic Testing Process
36(4)
7.2 Case Studies
40(23)
7.3 Case Study Summary
63(1)
8 Summary
63(8)
Appendix A Contact Information for Cleaning Products and Suppliers
64(3)
Appendix B Contact Information for Soils and Contaminants and Suppliers
67(1)
References
68(3)
2 UV-Ozone Cleaning for Removal of Surface Contaminants
71(34)
Rajiv Kohli
1 Introduction
71(1)
2 Surface Contamination and Cleanliness Levels
72(1)
3 Principles of UV-Ozone Cleaning
73(5)
4 Process Variables
78(1)
4.1 UV Sources
78(1)
4.2 Distance from the Source
78(1)
4.3 Precleaning
78(1)
4.4 Types of Contaminants
79(1)
4.5 Types of Substrates
79(1)
5 Cleaning Systems
79(7)
5.1 Costs
85(1)
6 Advantages and Disadvantages of UV-Ozone Cleaning
86(2)
6.1 Advantages
86(1)
6.2 Disadvantages
87(1)
7 Applications
88(6)
7.1 Semiconductor and Electronics Parts
89(1)
7.2 Cleaning of Reference Masses
90(1)
7.3 Solar Wind Sample Collectors
90(1)
7.4 Metal Surfaces
90(1)
7.5 Glass and Optical Materials
91(1)
7.6 Probe Tips
92(1)
7.7 Decontamination of Incubator Cabinets
92(1)
7.8 Preparation of Samples for Trace Element Analysis
93(1)
7.9 Polymer Surfaces
93(1)
7.10 Textiles and Fabrics
94(1)
8 Summary
94(11)
Acknowledgment
94(1)
Disclaimer
94(1)
References
95(10)
3 Use of Water Ice for Removal of Surface Contaminants
105(40)
Rajiv Kohli
1 Introduction
105(1)
2 Surface Contamination and Surface Cleanliness Levels
106(10)
3 Theoretical Considerations
116(5)
3.1 Phase Behavior
116(1)
3.2 Mechanical Properties
117(2)
3.3 Mechanism of Ice Blasting
119(2)
4 Description of the Process
121(1)
5 Cleaning Systems
122(4)
5.1 Abrasive Medium Addition
126(1)
6 Cost Considerations
126(2)
7 Advantages and Disadvantages
128(1)
7.1 Advantages
128(1)
7.2 Disadvantages
128(1)
8 Applications
129(7)
8.1 Semiconductor Wafer Cleaning
129(1)
8.2 Electronics and Photonics Applications
130(1)
8.3 Automotive Components
130(1)
8.4 Nuclear Applications
131(2)
8.5 Deburring of Components
133(1)
8.6 Recycling and Recovery
134(1)
8.7 Facility Decommissioning
134(1)
8.8 Restoration of Historic Building
134(1)
8.9 Oil Field Equipment Cleaning
135(1)
8.10 Cleaning Pipes
136(1)
9 Summary and Conclusions
136(9)
Acknowledgment
137(1)
Disclaimer
137(1)
References
137(8)
4 Post-CMP Cleaning
145(40)
Manish Keswani
Zhenxing Han
1 Introduction
145(2)
2 Forces on Particulate Contaminants in a Post-CMP Cleaning Process
147(4)
2.1 van der Waals Forces
147(3)
2.2 Double-Layer Interactions
150(1)
3 Types of Post-CMP Cleaning Processes
151(12)
3.1 Batch Cleaning
151(5)
3.2 Single Wafer Cleaning
156(7)
4 Megasonic Cleaning
163(6)
5 Cleaning Chemistries
169(11)
5.1 Silicon Dioxide Post-CMP Cleaning
169(5)
5.2 Tungsten Post-CMP Cleaning
174(1)
5.3 Copper Post-CMP Cleaning
175(5)
6 Summary
180(5)
References
180(5)
5 A Brief Review of the Cleaning Process for Electronic Device Fabrication
185(28)
Mahmood Toofan
Jahansooz Toofan
1 Introduction
186(1)
2 Cleaning of Inorganic Contamination
186(14)
2.1 Neutral Particles
186(1)
2.2 Ionically Bonded Particles
187(3)
2.3 Covalently Bonded Particles
190(6)
2.4 Zeta Potential
196(4)
3 Cleaning of Organic Contaminants
200(1)
4 Effects of Surfactants in Cleaning Solutions
201(2)
5 Wet Cleaning for Removing Trace Metals after Etching Process
203(3)
5.1 Aluminum
204(1)
5.2 Gold
205(1)
5.3 Chromium
205(1)
5.4 Indium Tin Oxide
205(1)
5.5 Titanium Tungsten
205(1)
5.6 Copper
205(1)
5.7 Nickel
206(1)
5.8 Gallium Arsenide
206(1)
6 Silicon Product Wet Etching Process
206(4)
6.1 Silica Isotropic and Anistropic Etching
207(1)
6.2 Silicon Isotropic and Anisotropic Etching Process
207(2)
6.3 Silicon Nitride
209(1)
6.4 Dry Etching Process
209(1)
6.5 Advantages and Disadvantages of Dry Versus Wet Etching
210(1)
7 Summary and Conclusions
210(3)
References
211(2)
Index 213
Dr. Rajiv Kohli is a leading expert with The Aerospace Corporation in contaminant particle behavior, surface cleaning, and contamination control. At the NASA Johnson Space Center in Houston, Texas, he provides technical support for contamination control related to ground-based and manned spaceflight hardware, as well as for unmanned spacecraft. His technical interests are in particle behavior, precision cleaning, solution and surface chemistry, advanced materials and chemical thermodynamics. Dr. Kohli was involved in developing solvent-based cleaning applications for use in the nuclear industry and he also developed an innovative microabrasive system for a wide variety of precision cleaning and micro-processing applications in the commercial industry. He is the senior editor of this book series Developments in Surface Contamination and Cleaning”; the first ten volumes in the series were published in 2008, 2010, 2011, 2012, 2013 (Volumes 5 and 6), 2015 (Volumes 7 and 8), and 2017 (Volumes 9 and 10), respectively. The second edition of Volume 1 was published in 2016. Volume 11 and Volume 12 (this volume) are expected to be published in 2019. Previously, Dr. Kohli co-authored the book Commercial Utilization of Space: An International Comparison of Framework Conditions”, and he has published more than 270 technical papers, articles and reports on precision cleaning, advanced materials, chemical thermodynamics, environmental degradation of materials, and technical and economic assessment of emerging technologies. Dr. Kohli was recognized for his contributions to NASAs Space Shuttle Return to Flight effort with the Public Service Medal, one of the agencys highest awards. Dr. Kashmiri (Kash) Mittal was associated with IBM from 1972 to 1994. Currently, he is teaching and consulting in the areas of adhesion science and technology and in surface contamination and cleaning. He is the founding editor of the Journal of Adhesion Science and Technology and is editor of more than 130 published books, many of them dealing with surface contamination and cleaning. In 2002, the Kash Mittal Award was inaugurated for his extensive efforts and significant contributions to the field of colloid and interface chemistry. Among his numerous awards, Dr. Mittal was awarded the title honoris causa by the Maria Curie-Sklodowska University in Lubin, Poland in 2003. Currently, he is teaching and consulting in the areas of surface contamination and cleaning and in adhesion science and technology.
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