| Preface |
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xiii | |
| Introduction |
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xv | |
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1 | (36) |
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1 | (1) |
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1 | (2) |
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1.2.1 Aerial Image of Contact/Proximity Printing |
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2 | (1) |
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1.2.2 Aerial Image of Projection Printing |
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2 | (1) |
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2 | (1) |
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1.3 Thermal Oxidation of Silicon |
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3 | (1) |
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1.3.1 Local Oxidation of Silicon |
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4 | (1) |
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4 | (2) |
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6 | (2) |
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1.5.1 Mean Free Path, Impingement Rate, and Pumping Speed |
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6 | (1) |
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1.5.2 Regions of Gas Flow |
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7 | (1) |
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1.6 Thin-Film Depositions |
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8 | (9) |
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1.6.1 Deposition by Evaporation |
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8 | (1) |
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1.6.2 Deposition by Sputtering |
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9 | (1) |
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1.6.3 Chemical Vapor Deposition |
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9 | (3) |
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1.6.4 LPCVD Low-Stress Silicon Nitride |
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12 | (3) |
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1.6.5 Amorphous Silicon, Polysilicon, and Epitaxial Silicon Depositions |
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15 | (1) |
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1.6.6 Atomic Layer Deposition and Atomic Layer Etching |
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15 | (2) |
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1.7 Mass Flow Sensing and Control |
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17 | (2) |
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18 | (1) |
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1.8 Electroplating of Metals |
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19 | (1) |
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1.9 Soft Lithography and Its Derivative Technology |
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20 | (2) |
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22 | (5) |
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1.10.1 Direct Bonding between Silicon Wafers |
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22 | (2) |
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1.10.2 Anodic Bonding between Silicon Wafer and Glass Wafer |
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24 | (1) |
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1.10.3 Bonding with Metallic Interlayer |
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25 | (1) |
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1.10.4 Bonding with Insulating Interlayer |
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25 | (1) |
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1.10.5 Bonding Strength Measurement |
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26 | (1) |
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1.11 Flip-Chip Bonding for Electrical Interconnect |
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27 | (3) |
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1.12 Engineered Silicon Substrates |
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30 | (1) |
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31 | (1) |
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32 | (5) |
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37 | (54) |
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37 | (23) |
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2.1.1 Wet Etchants for Silicon Oxide, Silicon Nitride, Aluminum, and Polysilicon |
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38 | (1) |
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2.1.2 Crystallographic Notations |
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39 | (1) |
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2.1.3 Bulk Micromachining of Silicon |
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40 | (4) |
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2.1.4 Micromacruning in (100) and (110) Silicon Wafers |
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44 | (1) |
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2.1.5 Convex Corner and Beam Undercutting |
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45 | (7) |
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2.1.6 Front-to-Backside Alignment |
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52 | (3) |
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2.1.7 Alignment of Pattern to Crystallographic Axes |
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55 | (1) |
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2.1.8 Isotropic Etching of Silicon for Large Spherical Etch Cavity |
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55 | (3) |
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58 | (2) |
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2.2 Surf ace Micromacruning |
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60 | (12) |
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2.2.1 Double-Polysilicon Micromechanical Pin-joint Structures |
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61 | (3) |
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64 | (2) |
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2.2.3 Step Coverage, Selective Etching of Spacer Layer, and Sealing |
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66 | (2) |
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2.2.4 Stiction of Surface-Micromachined Structures |
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68 | (3) |
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2.2.5 Additional Issues of Surface Micromachining |
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71 | (1) |
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2.2.6 Porous Silicon Micromachining |
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71 | (1) |
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72 | (6) |
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72 | (3) |
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2.3.2 Reactive Ion Etching |
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75 | (1) |
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2.3.3 Silicon Reactive Ion Etching and Deep Reactive Ion Etching |
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76 | (2) |
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2.3.4 Dry Silicon Etching with XeF2 |
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78 | (1) |
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78 | (3) |
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81 | (10) |
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3 Transduction Principles |
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91 | (48) |
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3.1 Electrostatic and Capacitive Transduction |
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91 | (11) |
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3.1.1 Electrostatic Comb Drive |
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91 | (3) |
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3.1.2 Electrostatic Micromotors |
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94 | (1) |
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3.1.3 "Pull-in Effect" in Electrostatic Actuation |
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95 | (6) |
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3.1.4 Electrostatic Repulsion Force through Nonvolatile Charge Injection |
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101 | (1) |
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102 | (1) |
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3.2 Electromagnetic Transduction |
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102 | (6) |
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3.2.1 Magnetic Actuation versus Electrostatic Actuation |
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102 | (1) |
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3.2.2 Electromagnetic Actuators |
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103 | (4) |
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3.2.3 Magnetic Field Sensing |
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107 | (1) |
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3.3 Piezoelectric Transduction |
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108 | (13) |
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3.3.1 Piezoelectric Effects |
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108 | (6) |
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3.3.2 Stress and Strain in Piezoelectric Medium |
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114 | (3) |
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3.3.3 Piezoelectric Bimorph |
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117 | (1) |
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3.3.4 Progressive Flexural Wave |
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118 | (1) |
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119 | (2) |
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121 | (6) |
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3.4.1 Electrothermal Actuation |
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121 | (3) |
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3.4.2 Uncooled Infrared Imaging |
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124 | (3) |
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127 | (1) |
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128 | (11) |
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139 | (60) |
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4.1 Electromagnetic Wave Spectrum |
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139 | (2) |
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4.2 Silicon Micromechanical Resonator |
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141 | (4) |
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4.2.1 Resonators at 1-10 MHz |
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141 | (1) |
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4.2.2 Filters Based on Silicon Micromechanical Resonators |
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142 | (1) |
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4.2.3 In Pursuit of GHz Silicon Resonators |
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142 | (3) |
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4.3 Acoustic Wave Resonators and Filters |
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145 | (36) |
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4.3.1 Acoustic Wave Resonator Concept |
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145 | (1) |
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146 | (1) |
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4.3.3 One-Dimensional Mason's Model for Acoustic Resonator |
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147 | (5) |
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4.3.4 Using Mason's Model for Film Bulk Acoustic Resonator with Multiple Layers |
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152 | (5) |
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4.3.5 Incorporating Acoustic Loss in Mason's Model |
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157 | (2) |
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4.3.6 BVD Equivalent Circuit for Acoustic Resonator |
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159 | (7) |
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4.3.7 Spurious Resonant Modes and Wave Dispersion |
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166 | (3) |
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4.3.8 Film Bulk Acoustic Resonator for RF Front-End Filters |
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169 | (12) |
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4.4 Surface Acoustic Wave Filters |
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181 | (3) |
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4.4.1 SAW Generation by Interdigitated Electrodes over Piezoelectric Substrate |
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181 | (2) |
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4.4.2 SAW Filter Components |
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183 | (1) |
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184 | (5) |
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4.5.1 Bulk-Micromachined Silicon-Supported Tunable Capacitor with Mass Structure |
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185 | (1) |
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4.5.2 Bridge-Type Surface-Micromachined Tunable Capacitor |
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186 | (3) |
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189 | (2) |
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191 | (2) |
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193 | (6) |
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199 | (24) |
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5.1 Micromirror Array for Projection Display |
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199 | (10) |
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5.1.1 Digital Light Processing |
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199 | (4) |
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5.1.2 Grating Light Valve |
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203 | (2) |
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5.1.3 Thin-Film Micromirror Array |
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205 | (4) |
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5.2 Micromirrors for Optical Fiber Communication |
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209 | (8) |
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5.2.1 Mechanical Reflection Optical Switch |
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210 | (2) |
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5.2.2 Fabry-Perot Opto-Mechanical Modulator |
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212 | (2) |
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5.2.3 Fabry-Perot Photonic Crystal, Filter, and Interferometer Built with Bragg Reflectors |
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214 | (1) |
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5.2.4 Micromirrors for Optical Cross-Connect |
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215 | (2) |
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217 | (2) |
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219 | (4) |
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6 Mechanics and Inertial Sensors |
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223 | (58) |
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223 | (20) |
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6.1.1 Stress and Strain as Single Indexed Matrix Elements |
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223 | (1) |
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224 | (1) |
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6.1.3 Bending of Isotropic Cantilever |
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225 | (3) |
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6.1.4 Boundary Conditions |
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228 | (3) |
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6.1.5 Equivalent Spring Constants for Common MEMS Structures |
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231 | (3) |
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234 | (9) |
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243 | (12) |
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6.2.1 Mass-Spring-Dashpot and Tensioned String |
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244 | (1) |
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6.2.2 Energy Method (Rayleigh's Method) |
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245 | (3) |
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6.2.3 Vibrations of Beams |
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248 | (3) |
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6.2.4 Vibrations of Plates |
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251 | (4) |
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255 | (10) |
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6.3.1 Spring-Mass-Dashpot as Accelerometer |
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255 | (3) |
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6.3.2 A Bulk-Micromachined Silicon Accelerometer |
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258 | (2) |
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6.3.3 Piezoresistive Readout |
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260 | (1) |
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6.3.4 Piezoelectric Readout |
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261 | (1) |
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262 | (3) |
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265 | (6) |
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265 | (3) |
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6.4.2 Tuning Fork Gyroscope on Quartz |
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268 | (1) |
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6.4.3 Comb-Drive Tuning Fork MEMS Gyroscopes |
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269 | (2) |
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271 | (1) |
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272 | (9) |
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7 Thin-Film Properties, SAW/BAW Sensors, Pressure Sensors, and Microphones |
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281 | (28) |
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7.1 Thin-Film Residual Stress |
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281 | (7) |
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281 | (1) |
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7.1.2 Intrinsic Stress σi |
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282 | (1) |
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7.1.3 Techniques to Control Residual Stress in Thin Films |
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282 | (1) |
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7.1.4 Effects of Residual Stress |
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283 | (1) |
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7.1.5 Stress Measurement Techniques |
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284 | (4) |
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288 | (1) |
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7.2.1 Piezoelectric ZnO Film |
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288 | (1) |
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7.2.2 Piezoelectric AlN Film |
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289 | (1) |
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7.2.3 Ferroelectric Pb(Zr, Ti)O, (PZT) Film |
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289 | (1) |
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7.2.4 Brief Comparison of Piezoelectric Materials |
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289 | (1) |
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7.3 Material Properties Expressed as Tensor |
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289 | (16) |
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7.3.1 Pyroelectricity as First Rank Tensor |
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291 | (1) |
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292 | (1) |
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7.3.3 Piezoelectric Coefficients as Third Rank Tensor |
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293 | (2) |
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7.3.4 Surface Acoustic Wave Vapor Sensing |
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295 | (1) |
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7.3.5 Bulk Acoustic Wave Vapor Sensing |
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296 | (1) |
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7.3.6 Piezoresistivity as Fourth Rank Tensor |
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297 | (1) |
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7.3.7 Piezoresistive Silicon Pressure Sensor |
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298 | (3) |
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7.3.8 Capacitive Silicon Pressure Sensor |
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301 | (1) |
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7.3.9 Capacitive MEMS Microphone |
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301 | (3) |
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7.3.10 Piezoelectric MEMS Microphone |
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304 | (1) |
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305 | (1) |
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305 | (4) |
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8 Microfluidic Systems and Bio-MEMS |
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309 | (30) |
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8.1 Microchannels and Droplet Formation |
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309 | (5) |
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8.1.1 Electrowetting on Dielectrics |
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310 | (2) |
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8.1.2 Liquid Wetting over Structured Surface |
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312 | (2) |
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314 | (2) |
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316 | (4) |
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8.3.1 Valveless Micropumps |
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316 | (2) |
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8.3.2 Micropump Based on Electrostatic Actuation |
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318 | (1) |
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8.3.3 Micropump Based on Piezoelectric Unimorph |
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318 | (2) |
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8.3.4 Passive Capillary Pumping |
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320 | (1) |
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320 | (8) |
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321 | (1) |
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8.4.2 Acoustic Wave Micromixer |
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322 | (6) |
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8.4.3 Passive Mixing in Microchannels |
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328 | (1) |
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328 | (7) |
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329 | (4) |
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8.5.2 MEMS-Based PCR and Single-Cell RT-PCR Systems |
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333 | (2) |
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335 | (2) |
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337 | (2) |
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339 | (28) |
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9.1 Electromagnetic Vibration Energy Harvesting |
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339 | (11) |
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9.1.1 Mechanical Frequency Response of Vibration-Driven Energy Harvester |
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339 | (1) |
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9.1.2 Electromotive Force versus Frequency for Given Input Acceleration |
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340 | (1) |
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9.1.3 Mechanical Power Transfer Ratio |
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341 | (1) |
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9.1.4 Energy Conversion Efficiency |
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342 | (2) |
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9.1.5 Increasing Efficiency in Electromagnetic Energy Harvesters |
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344 | (4) |
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9.1.6 Maximum Power Delivery |
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348 | (2) |
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9.2 Piezoelectric Vibration Energy Harvesting |
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350 | (2) |
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9.2.1 Example: PZT Bimorph-Based Energy Harvester |
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351 | (1) |
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9.2.2 Piezoelectric versus Electromagnetic Energy Conversion |
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352 | (1) |
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9.3 Power Generation from Vibration Associated with Human's Walk |
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352 | (11) |
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9.3.1 Power-Generating Shoe, Knee Cap, and Backpack |
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353 | (1) |
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9.3.2 Challenges in Generating Power from Walking Motion without Loading the Person |
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353 | (1) |
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9.3.3 Magnetic Spring for Resonance at 2--4 Hz |
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354 | (3) |
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9.3.4 Magnet Levitation by Graphite with Resonance at 2--4 Hz |
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357 | (3) |
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9.3.5 Liquid Spring for Resonance at 2--4 Hz |
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360 | (1) |
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9.3.6 Non-resonant Suspension for Vibration Energy over Broad Frequency Range |
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361 | (2) |
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363 | (1) |
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364 | (3) |
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10 Electronic Noises, Interface Circuits, and Oscillators |
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367 | (22) |
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10.1 Input Referred Noise |
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367 | (3) |
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367 | (1) |
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10.1.2 Equivalent Input-Referred Voltage and Current Noise Sources |
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368 | (2) |
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10.2 Voltage Amplifier versus Charge Amplifier for Piezoelectric Sensors |
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370 | (3) |
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372 | (1) |
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10.3 Electromagnetic Interference |
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373 | (1) |
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10.3.1 Noise Reduction through Low-Pass Filter |
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374 | (1) |
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374 | (4) |
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10.5 Design and Analysis of Oscillators Based on Bulk Acoustic-Wave Resonators |
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378 | (8) |
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10.5.1 Colpitts LC Oscillators |
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379 | (2) |
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10.5.2 Pierce BAR Oscillator |
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381 | (2) |
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10.5.3 HBAR-Based 3.6-GHz Oscillator |
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383 | (3) |
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386 | (1) |
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386 | (3) |
| Index |
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389 | |
Lisainfo e-raamatute kohta