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E-raamat: Handbook of Moire Measurement

Edited by C.A. Walker

Formaat: 501 pages
Ilmumisaeg: 01-Dec-2003
Kirjastus: Institute of Physics Publishing
Keel: eng
ISBN-13: 9781000687408

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Formaat: 501 pages
Ilmumisaeg: 01-Dec-2003
Kirjastus: Institute of Physics Publishing
Keel: eng
ISBN-13: 9781000687408

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Since its development in the late 1970s, the Moiré Fringe method has become a standard technique for measuring the behavior of materials and structures. Edited by one of the technique's co-inventors, this book brings together extended case studies from experts in the field. Emphasizing applications to real situations, the book presents a very reada

Since its development in the late 1970s, the Moiré Fringe method has become a standard technique for the measurement of the behavior of materials and structures. Edited by one of the co-inventors of the technique, the Handbook of Moiré Measurement brings together a series of extended case studies from recognized experts in the field. The emphasis is on the application of the method to real situations, and presents a very readable account of the technique from the point of view of the user. As an introduction to the Moiré technique and its variants, this book will be of interest to readers at all levels, but is particularly suitable for undergraduates and graduate students in physics, materials science, and structural and mechanical engineering.

Introduction

(2)

C A Walker

A brief history of the moire method

(1)

References

(1)

Strain Measurements at the Limit---the Moire Microscope

(46)

Nonlinear analysis of interferometric moire fringes

(13)

T W Shield

Example fringe data reduction

(5)

References

(1)

Microscopic moire interferometry

(7)

Bongtae Han

Immersion interferometer

(1)

Optical configuration

(1)

Four-beam immersion interferometer

(1)

Mechanical configuration

(2)

Fringe shifting and O/DFM method

(1)

References

(1)

Localized thermal strains in electronic interconnections by microscopic moire interferometry

(9)

Bongtae Han

Specimen preparation

(1)

Thin small outline package

(1)

Leadless chip carrier

(2)

Effect of underfill encapsulation on flip chip solder bump

(4)

Plated through hole

(1)

References

(1)

Titanium in elastic tension: micromechanical deformation

(8)

Bongtae Han

Introduction

(1)

Specimen and loading fixture

(1)

Experimental procedure and fringe patterns

(2)

Anomalous strains along the grain boundaries

(2)

Discussion

(1)

References

(2)

Micromechanical thermal deformation of unidirectional boron/aluminum composite

(7)

Bongtae Han

Experimental procedure and fringe patterns

(1)

Analysis and results

(3)

Discussion

(1)

References

(1)

Fracture Mechanics

(72)

Assessment of the shape of crack-tip plastic zones as a function of applied load

(5)

C A Walker

Peter M MacKenzie

Introduction

(1)

Experimental details

(1)

Measurement of Von Mises yield locus

(1)

Discussion of results

(1)

Conclusions

(1)

References

(1)

Deformation around fatigue cracks from moire fringe measurement

(10)

Gianni Nicoletto

Introduction

(1)

Basic crack-tip models

(1)

Stationary crack under monotonic loading

(1)

Stationary crack under cyclic loading

(1)

Experimental details

(1)

Fatigue crack-tip deformation

(1)

Local yielding

(1)

Non-singular stresses

(1)

Cyclic plasticity

(1)

Local mode-mixity

(1)

Summary

(1)

Acknowledgment

(1)

References

(2)

Applications of moire to cellulosic (paper and wood) and concrete materials

(8)

R E Rowlands

Introduction

(1)

Analyses

(1)

Bolted wood connections

(2)

Fracture of linerboard

(1)

Fracture processes in concrete

(2)

Summary

(1)

References

(1)

Mixed-mode stress intensity factors in finite, edge-cracked orthotropic plates

(15)

C A Walker

Jamasri

Introduction

(1)

Notation

(1)

Theoretical analysis

(1)

Displacement fields around the crack-tip

(2)

Mixed-mode fracture analysis

(2)

Experiments

(1)

Specimen preparation

(1)

Specimen testing

(1)

Analysis of the results

(1)

Moire patterns

(1)

Calculation of stress intensity factors

(1)

Discussion and conclusions

(3)

Acknowledgments

(1)

Appendix: Theory of the numerical approach for solving the characteristic of the biharmonic equation

(2)

References

(2)

A hybrid experimental/computational approach to the assessment of crack growth criteria in composite laminates

(14)

C A Walker

M Jam

Notation

(1)

Introduction

(1)

Crack growth criteria---theoretical background

(1)

Crack growth criterion in use---the experimental problem

(1)

Outline assessment method

(4)

Experimental procedure

(1)

Finite element modelling

(2)

Validation of the finite element model

(1)

Stress intensity factors from the closed form solution (isotropic material assumption)

(1)

Comparison with experimental data

(1)

Discussion of the computational results

(2)

Conclusion

101

(1)

References

101

(2)

Experimental and computational assessment of the T* fracture parameter during creep relaxation

103

(7)

C A Walker

Peter M MacKenzie

Introduction

103

(1)

T* integral fracture parameter

104

(1)

Integration path

104

(1)

Experimental procedure

104

(2)

Fringe analysis

106

(1)

Results

106

(3)

References

109

(1)

Moire interferometry and crack closure

110

(11)

Peter M MacKenzie

Introduction

110

(1)

Crack closure

110

(1)

Moire interferometry

110

(1)

Example applications

111

(1)

Specimens

111

(1)

Controlled crack development

111

(2)

Grating limitations

113

(1)

Crack closure effects revealed in moire interferograms

113

(5)

Conclusions

118

(1)

References

119

(2)

Electronic Packaging

121

(56)

Determination of effective coefficients of thermal expansion (CTE) of electronic packaging components

123

(11)

Yifan Guo

Introduction

123

(1)

Definitions of effective CTE

123

(2)

Procedures of CTE determination

125

(1)

High-temperature replication of specimen gratings

125

(1)

Real-time measurements of the thermal expansion

125

(1)

Application I: evaluation of thin small outline packages

125

(3)

Application II: plastic ball grid array package

128

(2)

Application III: CTE as a function of temperature

130

(2)

Conclusions

132

(1)

References

132

(2)

Determinations of thermal strains in solder joints: an application in electric packaging

134

(11)

Yifan Guo

Introduction

134

(1)

CBGA packages

135

(1)

Moire experiments

136

(1)

Thermal deformations in CBGA

136

(4)

Thermal strain analysis

140

(1)

Conclusions

141

(2)

References

143

(2)

Thermomechanical behaviour of two-phase solder column connection under highly accelerated thermal cycle

145

(8)

Bongtae Han

Specimen geometry

145

(1)

Experimental procedure and fringe patterns

145

(5)

Analysis and discussions

150

(1)

Deformed shape

150

(1)

Accumulated permanent deformation

151

(1)

References

152

(1)

Verification of numerical models used in microelectronics product development

153

(7)

Bongtae Han

Ceramic ball grid array package assembly

154

(2)

Bleed layer on power laminate

156

(2)

Discussion

158

(1)

References

159

(1)

Analysis of residual stresses in a die-attaching adhesive

160

(11)

A S Voloshin

Introduction

160

(1)

Experiment

161

(3)

Results

164

(5)

Conclusions

169

(1)

References

169

(2)

Characterization of thermomechanical behaviour of a flip-chip plastic ball grid array package assembly

171

(6)

Bongtae Han

Flip-chip plastic ball grid assembly

171

(1)

Grating replication for complex geometry

172

(1)

Bithermal loading

172

(2)

Result and implication

174

(1)

References

175

(2)

Complex Shapes

177

(60)

Strain gauge verification by moire

179

(6)

Peter G Ifju

The objective

179

(2)

The experiment

181

(3)

References

184

(1)

A high-precision calibration of electrical resistance strain gauges by moire interferometry

185

(10)

Robert B Watson

Introduction

185

(1)

The challenge

186

(1)

The high-sensitivity moire solution

186

(1)

Assessment of measurement system accuracy

187

(2)

Experimental procedure

189

(2)

Results

191

(2)

Refinements

193

(1)

References

193

(2)

Interlaminar deformation along the cylindrical surface of a hole in laminated composites

195

(12)

Raymond G Boeman

Introduction

195

(1)

Experimental procedures

196

(2)

Results---straight boundary free edge

198

(1)

Results---cylindrical surface of the hole

199

(1)

Tangential strains in hole at 90°

200

(1)

Transverse strains in hole at θ = 90°

201

(2)

Summary

203

(1)

Acknowledgments

204

(1)

References

205

(2)

Interlaminar deformation along the cylindrical surface of a hole in laminated composite tensile specimens

207

(14)

David H Mollenhauer

Introduction

207

(1)

Fringe patterns

207

(2)

Experimental procedure

209

(4)

Results

213

(7)

References

220

(1)

Thick laminated composites in compression: free-edge effects on a ply-by-ply basis

221

(9)

Yifan Guo

Introduction

221

(1)

In-plane compression

222

(3)

Interlaminar compression

225

(3)

Laminate properties

228

(1)

Conclusions

228

(1)

References

229

(1)

Loading effects in composite beam specimens

230

(7)

Peter G Ifju

References

234

(3)

Elastic--Plastic Hole Expansion

237

(18)

Elastic--plastic hole expansion: an experimental and theoretical investigation

239

(11)

C A Walker

Jim McKelvie

Jim Hyzer

Introduction

239

(1)

Residual stress measurement

239

(1)

Moire interferometry

239

(1)

Hole-drilling method

240

(1)

Dissection method

240

(1)

Experimental investigation

241

(1)

Expansion of a hole in a quasi-infinite plate

241

(3)

Expansion of a hole in a thick cylinder and simple lug geometry

244

(5)

Conclusion

249

(1)

References

249

(1)

Roller expansion of tubes in a tube-plate

250

(5)

C A Walker

Jim McKelvie

Introduction

250

(1)

Experimental procedure

251

(2)

References

253

(2)

Hybrid Mechanics

255

(14)

Some applications of high sensitivity moire interferometry

257

(6)

C Ruiz

Introduction

257

(1)

Interferometric study of dovetail joints

257

(1)

Application to the study of cracks

258

(4)

References

262

(1)

Hybridizing moire with analytical and numerical techniques: differentiating moire measured displacements to obtain strains

263

(6)

R E Rowlands

Introduction

263

(1)

Analyses

264

(1)

General comments

264

(1)

Splines and regression analysis

264

(1)

Finite-element concepts

264

(3)

Summary

267

(1)

References

267

(2)

Residual Stresses

269

(28)

Automated moire interferometry for residual stress determination in engineering objects

271

(16)

Matgorzata Kujawinska

Leszek Satbut

Introduction

271

(1)

Objects of measurements

272

(1)

Railway rail

272

(2)

Laser beam weldment

274

(1)

Experimental set-up and procedure

274

(4)

Experimental results and discussion

278

(1)

Residual strain determination for railway rails

278

(1)

Residual stress determination in laser beam welds

279

(5)

Conclusions

284

(1)

References

285

(2)

Determination of thermal stresses near a bimaterial interface

287

(7)

Judy D Wood

Experimental procedure

287

(1)

Extracting the coefficients of thermal expansion

288

(3)

Separation of thermal strains and stress-induced strains

291

(1)

Results

291

(2)

References

293

(1)

Interior strains by a hybrid 3d photoelasticity/moire interferometry technique

294

(3)

C W Smith

Frozen stress photoelasticity

294

(1)

The hybrid method

295

(1)

References

295

(2)

High Temperature Effects and Thermal Strains

297

(22)

Moire interferometry using grating photography and optical processing

299

(12)

Gary Cloud

Case study: whole-field strain analysis to 1370 °C

299

(1)

Problem characteristics

299

(1)

Moire interferometry with optical Fourier processing

300

(1)

Outline of the technique

301

(1)

Gratings

302

(2)

Grating photography

304

(2)

Optical Fourier processing

306

(3)

Data processing

309

(1)

Closure

309

(1)

References

310

(1)

Heat-resistant gratings for moire interferometry

311

(8)

Colin Forno

Introduction

311

(1)

Basic grating procedure

312

(1)

Detailed preparation

313

(1)

Polishing-induced stresses

314

(1)

Optical system aberrations

315

(1)

Annealing studies

315

(1)

High-temperature studies

316

(1)

References

317

(2)

Micromechanics and Contact Problems

319

(54)

Grid method for damage analysis of ductile materials

321

(21)

Jin Fang

Introduction

321

(1)

Gratings and experiments

322

(1)

Specimens and zero-thickness gratings

322

(1)

Quasi-static loading and impulsive loading

322

(3)

Image processing of deformed gratings

325

(1)

Determination of strain by cross grid

325

(2)

Displacement determination by Fourier transform

327

(4)

Some analyses of void damage

331

(1)

Interaction between the neighbouring voids

331

(6)

Flow localization and ductile failure of ligaments

337

(3)

Remarks

340

(1)

Acknowledgment

340

(1)

References

340

(2)

A contact problem

342

(19)

Jin Fang

Introduction

342

(1)

The in-plane contact of two bodies

343

(3)

Contact deformation measured by moire interferometry

346

(1)

Moire interferometry for displacement patterns

346

(1)

A polarized shearing method for derivative patterns

347

(4)

An incoherent technique for gradient patterns

351

(3)

The hybrid solution of the contact stresses

354

(5)

Remarks

359

(1)

References

359

(2)

Moire interferometry for measurement of strain near mechanical fasteners in composites

361

(12)

Gary Cloud

Case study: Whole-field measurement of strain concentrations in composites

361

(1)

Approaches to design

362

(1)

Design, construction and alignment of interferometer

363

(4)

Specimen gratings

367

(1)

Recording fringes

368

(1)

Data reduction

368

(1)

Closing remarks

368

(2)

References

370

(3)

Out-Of-Plane Deformation, Flatness and Shape Measurement

373

(52)

Shadow moire interferometry applied to composite column buckling

375

(4)

Peter G Ifju

Xiaokai Niu

Melih Papila

References

378

(1)

Shadow moire interferometry with enhanced sensitivity by optical/digital fringe multiplication

379

(8)

Bongtae Han

Optical configuration and fringe shifting

380

(1)

Optical/digital fringe multiplication (O/DFM)

381

(1)

Applications

381

(1)

Warpage of electronic device

381

(3)

Pre-buckling behaviour of an aluminium channel

384

(2)

References

386

(1)

Shadow moire interferometry with a phase-stepping technique applied to thermal warpage measurement of modern electronic packages

387

(10)

Yinyan Wang

Introduction

387

(1)

Application of phase stepping to shadow moire fringe patterns

388

(2)

Phase calculation

390

(1)

On-line measurement of thermal warpage of modern electronic packages

391

(1)

The experimental system

391

(1)

Normalization of the sample position

392

(1)

Application examples

392

(1)

A PBGA through a heating--cooling cycle

392

(2)

Analysis of a BGA and its seating printed wire board

394

(1)

Conclusion

395

(1)

References

396

(1)

On-line system for measuring the flatness of large steel plates using projection moire

397

(11)

Jussi Paakkari

Motivation

397

(1)

Measurement specifications

398

(1)

Design of the flatness measurement system

398

(1)

System overview

398

(1)

Optomechanical design of the measurement unit

399

(4)

Image analysis software

403

(1)

Performance

404

(1)

Quality of the moire signal

404

(1)

Calibration

404

(1)

Repeatability and depth resolution of flatness measurement

404

(2)

Other performance values

406

(1)

Conclusion

406

(1)

Acknowledgments

407

(1)

References

407

(1)

Optical triangular profilometry: unified calibration

408

(9)

Anand Asundi

Zhou Wensen

Projection ray tracing

408

(2)

Image ray tracing

410

(1)

Choice

411

(1)

Spot inspection

412

(2)

Single-line system

414

(1)

Projection grating system

415

(1)

References

416

(1)

Grating diffraction method

417

(8)

Anand Asundi

Bing Zhao

A strain microscope with grating diffraction method

419

(2)

Grating diffraction strain sensor

421

(2)

References

423

(2)

Real Time and Dynamic Moire

425

(60)

Real-time video moire topography

427

(15)

Joris J J Dirckx

Willem F Decraemer

Introduction

427

(1)

Theory of fringe formation

427

(1)

Modulation and demodulation

427

(2)

Shape and deformation measurement

429

(1)

Fringe characteristics and fringe enhancement

429

(1)

Apparatus

430

(1)

Optical set-up

430

(1)

Electronic image processing

431

(1)

Measurement results

432

(1)

Adjustment and calibration

432

(1)

Measuring resolution

433

(2)

Application example: measurements on the eardrum

435

(4)

Discussion and conclusions

439

(2)

References

441

(1)

Tensile impact delamination of a cross-ply interface studied by moire photography

442

(13)

L G Melin

J C Thesken

S Nilsson

L R Benckert

Introduction

442

(1)

Experimental methods

443

(1)

Optical set-up

443

(2)

Tensile split-Hopkinson bar

445

(1)

Specimen design and manufacturing

446

(1)

Procedure

447

(1)

Fringe analysis

447

(1)

Results

447

(4)

Discussion and conclusions

451

(1)

Acknowledgments

452

(1)

References

453

(2)

Real-time moire image processing

455

(30)

M Bruynooghe

Introduction

455

(1)

Experimental set-up for real-time defect detection

456

(1)

Moire image data

457

(1)

Inverse moire image data

457

(1)

Moire data acquisition by the phase shifting technique

458

(3)

Fringe skeletonizing

461

(1)

Moire image enhancement and subsampling

462

(1)

Extraction of bright fringes by image segmentation and constrained contour modelling

463

(3)

The skeletonizing of dark fringes and background

466

(2)

Extraction of dark fringes by a graph technique

468

(1)

Experimental results

468

(1)

Defect detection by hit/miss transform

469

(1)

Optical and digital methods for real-time processing of moire images by morphological hit/miss transform

470

(1)

Experimental results

471

(2)

Defect detection by multi-dimensional statistical analysis

473

(1)

Multi-dimensional statistical analysis of the results of optical correlation experiments

473

(1)

Factorial correspondence analysis

474

(1)

Analysis of phase moire images by correspondence analysis

475

(1)

Rules and decision areas for supervised defect detection

476

(1)

Experimental results

476

(6)

Conclusion

482

(1)

References

482

(3)

A Micro-scale strain measurement: limitations due to restrictions inherent in optical systems and phase-stepping routines

485

(14)

James McKelvie

Introduction

485

(1)

The fringe structure

486

(2)

Phase-shifting

487

(1)

Displacement versus strain sensitivity

487

(1)

The optical limits

488

(6)

Under ideal conditions

488

(4)

With non-ideal conditions

492

(1)

How then to proceed?

493

(1)

The recording and analysis systems

494

(4)

Conclusions

498

(1)

References

498

(1)

Index

499

CA Walker Department of Mechanical Engineering, University of Strathclyde, UK

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