1 Introduction |
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1 | (6) |
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2 | (5) |
2 Short range optical interconnection |
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7 | (26) |
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2.1 Why optical interconnection? |
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7 | (4) |
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2.1.1 Electrical and Optical Interconnection - Similarities |
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8 | (1) |
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2.1.2 Electrical and Optical Interconnection - Differences |
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9 | (2) |
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2.2 Characteristics of light |
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11 | (1) |
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12 | (4) |
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12 | (1) |
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12 | (4) |
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2.3.3 Plastic optical fibers |
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16 | (1) |
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2.4 High intensity light sources |
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16 | (2) |
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17 | (1) |
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2.4.2 Light Emitting Diodes (LEDs) |
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18 | (1) |
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2.5 Photodetectors - introduction |
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18 | (6) |
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2.5.1 Ideal photodetector |
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19 | (1) |
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2.5.2 Absorption of light in silicon |
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20 | (4) |
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2.6 High-speed optical receivers in CMOS for λ = 850 nm-literature overview |
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24 | (9) |
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2.6.1 Using standard CMOS technology |
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24 | (3) |
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2.6.2 CMOS technology modification |
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27 | (6) |
3 CMOS photodiodes for λ = 850 nm |
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33 | (46) |
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34 | (4) |
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3.2 Bandwidth of photodiodes in CMOS |
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38 | (32) |
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3.2.1 Intrinsic (physical) bandwidth |
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38 | (23) |
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3.2.2 Comparison between simulations and measurements |
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61 | (4) |
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3.2.3 N+/p-substrate diode |
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65 | (1) |
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3.2.4 P+/nwell/p-substrate photodiode with low-resistance substrate in adjoined-well technology |
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66 | (4) |
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3.3 Intrinsic (physical) photodiode bandwidth |
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70 | (2) |
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3.4 Extrinsic (electrical) photodiode bandwidth |
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72 | (3) |
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75 | (1) |
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3.6 Summary and conclusions |
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75 | (4) |
4 High data-rates with CMOS photodiodes |
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79 | (26) |
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79 | (2) |
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4.2 Transimpedance amplifier design |
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81 | (5) |
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4.2.1 Transimpedance amplifiers and extrinsic bandwidth |
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82 | (1) |
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4.2.2 Impact of noise: BER |
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83 | (1) |
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84 | (2) |
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86 | (2) |
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88 | (3) |
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4.5 Robustness on spread and temperature |
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91 | (4) |
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95 | (7) |
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4.6.1 Circuit details and measurement setup |
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95 | (2) |
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4.6.2 Optical receiver performance without equalizer |
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97 | (1) |
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4.6.3 Optical receiver performance with equalizer |
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97 | (2) |
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4.6.4 Robustness of the pre-amplifier: component spread |
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99 | (1) |
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4.6.5 Robustness of the pre-amplifier: diode spread |
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100 | (2) |
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102 | (3) |
5 Bulk CMOS photodiodes for λ = 400 nm |
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105 | (18) |
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106 | (1) |
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5.2 Finger nwell/p-substrate diode in adjoined-well technology |
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107 | (2) |
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5.3 Finger n+/nwell/p-substrate diode |
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109 | (6) |
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5.3.1 Time domain measurements |
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113 | (2) |
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5.4 Finger n+/p-substrate photodiode in separate-well technology |
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115 | (1) |
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5.5 Finger p+/nwell/p-substrate in adjoined-well technology |
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116 | (2) |
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5.5.1 Time domain measurements |
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117 | (1) |
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118 | (1) |
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119 | (4) |
6 Polysilicon photodiode |
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123 | (20) |
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6.1 High-speed lateral polydiode |
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123 | (11) |
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6.1.1 Pulse response of the poly photodiode |
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127 | (3) |
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6.1.2 Diffusion current outside the depletion region |
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130 | (1) |
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6.1.3 Frequency characterization of the polysilicon photodiode |
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131 | (3) |
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6.2 Noise in polysilicon photodiodes |
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134 | (1) |
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6.2.1 Dark leakage current in the polysilicon diode |
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134 | (1) |
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6.3 Time domain measurements |
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135 | (3) |
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6.4 Quantum efficiency and sensitivity |
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138 | (1) |
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139 | (4) |
7 CMOS photodiodes: generalized |
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143 | (16) |
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143 | (2) |
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7.2 Generalization of CMOS photodiodes |
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145 | (1) |
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7.3 Device layer - photocurrent amplitude |
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146 | (9) |
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7.3.1 Device layer - photocurrent bandwidth |
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146 | (2) |
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7.3.2 Substrate current-photocurrent amplitude |
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148 | (2) |
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7.3.3 Substrate current-photocurrent bandwidth |
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150 | (2) |
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7.3.4 Depletion region current |
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152 | (1) |
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7.3.5 Depletion region - photocurrent bandwidth |
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153 | (1) |
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153 | (2) |
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155 | (1) |
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7.5 Summary and Conclusions |
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156 | (3) |
8 Conclusions |
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159 | |
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159 | |