About The Editors |
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Preface A Perspective On Nonvolatile Magnetic Memory Technology |
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xiii | |
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Chapter 1 Basic Spintronic Transport Phenomena |
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1 | (28) |
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1.1 Giant Magnetoresistance |
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2 | (7) |
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1.1.1 Basics of Electronic Transport in Magnetic Materials |
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2 | (3) |
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1.1.2 A Simple Model to Describe GMR: The "Two-Current Model" |
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5 | (2) |
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1.1.3 Discovery of GMR and Early GMR Developments |
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7 | (1) |
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1.1.4 Main Applications of GMR |
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8 | (1) |
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1.2 Tunneling Magnetoresistance |
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9 | (11) |
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1.2.1 Basics of Quantum Mechanical Tunneling |
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10 | (1) |
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1.2.2 First Approach to Tunnel Magnetoresistance: Julliere's Model |
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11 | (3) |
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1.2.3 The Slonczewski Model |
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14 | (1) |
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14 | (1) |
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1.2.3.2 Experimental Observations |
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15 | (1) |
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1.2.3.3 About the TMR Angular Dependence |
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15 | (1) |
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1.2.4 More Complex Models: The Spin Filtering Effect |
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16 | (1) |
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1.2.4.1 Incoherent Tunneling Through an Amorphous (A1203) Barrier |
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16 | (1) |
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1.2.4.2 Coherent Tunneling Through a Crystalline MgO Barrier |
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17 | (2) |
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1.2.5 Bias Dependence of Tunnel Magnetotransport |
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19 | (1) |
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1.3 The Spin-Transfer Phenomenon |
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20 | (9) |
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1.3.1 The Concept and Origin of the Spin-Transfer Effect |
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20 | (1) |
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1.3.1.1 The "In-Plane" Torque |
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20 | (3) |
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1.3.1.2 The "Out-of-Plane" Torque |
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23 | (1) |
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1.3.2 Spin-Transfer-Induced Magnetization Dynamics |
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23 | (1) |
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24 | (1) |
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1.3.2.2 Toward MRAM Based on Spin-Transfer Torque |
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25 | (1) |
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1.3.3 Main Events Concerning Spin-Transfer Advances |
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26 | (1) |
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27 | (2) |
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Chapter 2 Magnetic Properties Of Materials For Mram |
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29 | (26) |
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2.1 Magnetic Tunnel Junctions for MRAM |
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29 | (2) |
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2.2 Magnetic Materials and Magnetic Properties |
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31 | (8) |
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2.2.1 Ferromagnet and Antiferromagnet |
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31 | (2) |
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2.2.2 Demagnetizing Field and Shape Anisotropy |
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33 | (2) |
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2.2.3 Magnetocrystalline Anisotropy, Interface Magnetic Anisotropy, and Perpendicular Magnetic Anisotropy |
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35 | (1) |
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36 | (1) |
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2.2.5 Interlayer Exchange Coupling and Synthetic Antiferromagnetic Structure |
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37 | (1) |
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2.2.6 Spin-Valve Structure |
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38 | (1) |
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2.3 Basic Materials and Magnetotransport Properties |
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39 | (16) |
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2.3.1 Metallic Nonmagnetic Spacer for GMR Spin-Valve |
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39 | (2) |
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2.3.2 Magnetic Tunnel Junction with Amorphous AIO Tunnel Barrier |
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41 | (3) |
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2.3.3 Magnetic Tunnel Junction with Crystalline MgO(0 0 1) Tunnel Barrier |
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44 | (1) |
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2.3.3.1 Epitaxial MTJ with a Single-Crystal MgO(0 0 1) Barrier |
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44 | (2) |
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2.3.3.2 CoFeB/MgO/CoFeB MTJ with a (0 0 1)-Textured MgO Barrier for Device Applications |
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46 | (2) |
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2.3.3.3 Device Applications of MgO-Based MTJs |
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48 | (3) |
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51 | (4) |
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Chapter 3 Micromagnetism Applied To Magnetic Nanostructures |
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55 | (24) |
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Liliana D. Buda-Prejbeanu |
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3.1 Micromagnetic Theory: From Basic Concepts Toward the Equations |
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55 | (12) |
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3.1.1 Free Energy of a Magnetic System |
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56 | (1) |
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56 | (1) |
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3.1.1.2 Magnetocrystalline Anisotropy Energy |
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57 | (1) |
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3.1.1.3 Demagnetizing Energy |
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57 | (3) |
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60 | (1) |
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3.1.2 Magnetically Stable State and Equilibrium Equations |
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61 | (1) |
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3.1.3 Equations of Magnetization Motion |
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62 | (1) |
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3.1.4 Length Scales in Micromagnetism |
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63 | (1) |
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3.1.5 Modification Related to Spin-Transfer Torque Phenomena and Spin-Orbit Coupling |
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64 | (1) |
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3.1.6 Thermal Fluctuations |
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65 | (1) |
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3.1.7 Numerical Micromagnetism |
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66 | (1) |
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3.2 Micromagnetic Configurations in Magnetic Circular Dots |
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67 | (3) |
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3.3 STT-Induced Magnetization Switching: Comparison of Macrospin and Micromagnetism |
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70 | (3) |
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3.4 Example of Magnetization Precessional STT Switching: Role of Dipolar Coupling |
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73 | (6) |
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76 | (3) |
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Chapter 4 Magnetization Dynamics |
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79 | (22) |
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4.1 Landau--Lifshitz--Gilbert Equation |
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79 | (5) |
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79 | (1) |
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4.1.2 Variables in the Equation |
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80 | (1) |
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81 | (1) |
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4.1.3.1 Precessional Term |
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82 | (1) |
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83 | (1) |
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4.2 Small-Angle Magnetization Dynamics |
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84 | (6) |
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4.2.1 LLG for Thin-Film, Magnetized in Plane, Small Angles |
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84 | (1) |
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4.2.2 Ferromagnetic Resonance |
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85 | (2) |
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4.2.3 Tabulated Materials Parameters |
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87 | (1) |
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87 | (1) |
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4.2.3.2 Finite-Size Effects |
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88 | (1) |
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4.2.4 Pulsed Magnetization Dynamics |
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89 | (1) |
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4.3 Large-Angle Dynamics: Switching |
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90 | (5) |
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4.3.1 Quasistatic Limit: Stoner--Wohlfarth Model |
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90 | (3) |
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4.3.2 Thermally Activated Switching |
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93 | (1) |
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4.3.3 Switching Trajectory |
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94 | (1) |
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4.4 Magnetization Switching by Spin-Transfer |
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95 | (6) |
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4.4.1 Additional Terms to the LLG |
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95 | (1) |
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4.4.2 Full-Angle LLG with Spin-Torque |
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96 | (1) |
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97 | (1) |
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97 | (4) |
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Chapter 5 Magnetic Random-Access Memory |
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101 | (64) |
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5.1 Introduction to Magnetic Random-Access Memory (MRAM) |
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101 | (3) |
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5.1.1 Historical Perspective |
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101 | (1) |
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5.1.2 Various Categories of MRAM |
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102 | (2) |
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5.2 Storage Function: MRAM Retention |
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104 | (6) |
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5.2.1 Key Role of the Thermal Stability Factor |
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104 | (2) |
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5.2.2 Thermal Stability Factor for In-Plane and Out-of-Plane Magnetized Storage Layer |
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106 | (4) |
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110 | (2) |
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5.3.1 Principle of Read Operation |
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110 | (1) |
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5.3.2 STT-Induced Disturbance of the Storage Layer Magnetic State During Read |
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111 | (1) |
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5.4 Field-Written MRAM (FIMS-MRAM) |
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112 | (6) |
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5.4.1 Stoner-Wohlfarth MRAM |
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112 | (3) |
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115 | (1) |
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5.4.2.1 Toggle Write Principle |
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115 | (2) |
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5.4.2.2 Improved Write Margin |
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117 | (1) |
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5.4.2.3 Applications of Toggle MRAM |
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117 | (1) |
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5.4.3 Limitation in Downsize Scalability |
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118 | (1) |
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5.5 Spin-Transfer Torque MRAM (STT-MRAM) |
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118 | (17) |
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5.5.1 Principle of STT Writing |
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119 | (3) |
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5.5.2 Considerations of Breakdown, Write, Read Voltage Distributions |
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122 | (1) |
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5.5.3 Influence of STT Write Pulse Duration |
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123 | (1) |
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124 | (1) |
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5.5.4.1 Critical Current for Switching |
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124 | (1) |
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5.5.4.2 Minimization of Critical Current for Writing |
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125 | (3) |
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5.5.5 Out-of-Plane STT-MRAM |
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128 | (2) |
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5.5.5.1 Benefit of Out-of-Plane Configuration in Terms of Write Current |
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130 | (1) |
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5.5.5.2 Trade-off Between Strong Perpendicular Anisotropy and Low Gilbert Damping |
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131 | (1) |
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5.5.5.3 Benefit from Magnetic Metal/Oxide Perpendicular Anisotropy |
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131 | (2) |
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5.5.5.4 Downsize Scalability of Perpendicular STT-MRAM |
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133 | (2) |
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5.6 Thermally-Assisted MRAM (TA-MRAM) |
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135 | (15) |
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5.6.1 Trade-off Between Retention and Writability; General Idea of Thermally-Assisted Writing |
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135 | (1) |
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5.6.2 Self-Heating in MTJ Due to High-Density Tunneling Current |
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136 | (1) |
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136 | (1) |
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5.6.3.1 Write Selectivity Due to a Combination of Heating and Field |
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136 | (2) |
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5.6.3.2 Reduced Power Consumption, Thanks to Low Write Field and Field Sharing |
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138 | (2) |
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5.6.4 TA-MRAM with Soft Reference: Magnetic Logic Unit(MLU) |
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140 | (1) |
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5.6.4.1 Principle of Reading with Soft Reference |
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141 | (2) |
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5.6.4.2 Content-Addressable Memory |
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143 | (1) |
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5.6.5 Thermally-Assisted STT-MRAM |
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144 | (1) |
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5.6.5.1 In-Plane STT Plus TA-MRAM |
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144 | (1) |
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5.6.5.2 Out-of-Plane STT Plus TA-MRAM |
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145 | (5) |
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5.7 Three-Terminal MRAM Devices |
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150 | (3) |
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5.7.1 Field versus Current-Induced Domain Wall Propagation |
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150 | (2) |
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5.7.2 Principle of Writing |
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152 | (1) |
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5.7.3 Advantages and Drawbacks of Three-Terminal Devices |
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153 | (1) |
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5.8 Comparison of MRAM with Other Nonvolatile Memory Technologies |
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153 | (4) |
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5.8.1 MRAM in the International Technology Roadmap for Semiconductors (ITRS) |
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153 | (2) |
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5.8.2 Comparison of MRAM and Redox-RAM |
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155 | (1) |
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5.8.3 Main Applications of MRAM |
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155 | (2) |
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157 | (8) |
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157 | (1) |
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158 | (7) |
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Chapter 6 Magnetic Back-End Technology |
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165 | (34) |
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6.1 Magnetoresistive Random-Access Memory (MRAM) Basics |
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165 | (1) |
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6.2 MRAM Back-End-of-Line Structures |
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166 | (3) |
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166 | (2) |
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6.2.2 Spin-Transfer Torque (STT) MRAM |
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168 | (1) |
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6.2.3 Other Magnetic Memory Device Structures |
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169 | (1) |
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6.3 MRAM Process Integration |
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169 | (18) |
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6.3.1 The Magnetic Tunnel Junction |
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169 | (2) |
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6.3.1.1 Substrate Preparation |
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171 | (1) |
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6.3.1.2 Film Deposition and Anneal |
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172 | (2) |
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6.3.1.3 Device Patterning |
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174 | (5) |
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6.3.1.4 Dielectric Encapsulation |
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179 | (4) |
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6.3.2 Wiring and Packaging |
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183 | (1) |
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6.3.2.1 Ferromagnetic Cladding |
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184 | (2) |
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186 | (1) |
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6.3.3 Processing Cost Considerations |
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186 | (1) |
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6.4 Process Characterization |
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187 | (12) |
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6.4.1 200--300 mm Wafer Blanket Magnetic Films |
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187 | (1) |
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6.4.1.1 Current-in-Plane Tunneling (CIPT) |
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188 | (1) |
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6.4.1.2 Kerr Magnetometry |
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189 | (1) |
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6.4.2 Parametric Test of Integrated Magnetic Devices |
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189 | (1) |
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6.4.2.1 Magnetoresistance versus Resistance and Resistance versus Reciprocal Area |
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190 | (2) |
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6.4.2.2 Breakdown Voltage |
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192 | (2) |
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194 | (1) |
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195 | (1) |
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195 | (4) |
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Chapter 7 Beyond Mram: Nonvolatile Logic-In-Memory Vlsi |
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199 | (32) |
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199 | (4) |
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7.1.1 Memory Hierarchy of Electronic Systems |
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199 | (2) |
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7.1.2 Current Logic VLSI: The Challenge |
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201 | (2) |
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7.2 Nonvolatile Logic-in-Memory Architecture |
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203 | (6) |
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7.2.1 Nonvolatile Logic-in-Memory Architecture Using Magnetic Flip-Flops |
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205 | (2) |
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7.2.2 Nonvolatile Logic-in-Memory Architecture Using MTJ Devices in Combination with CMOS Circuits |
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207 | (2) |
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7.3 Circuit Scheme for Logic-in-Memory Architecture Based on Magnetic Flip-Flop Circuits |
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209 | (5) |
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7.3.1 Magnetic Flip-Flop Circuit |
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209 | (2) |
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211 | (3) |
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7.4 Nonvolatile Full Adder Using MTJ Devices in Combination with MOS Transistors |
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214 | (3) |
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7.5 Content-Addressable Memory |
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217 | (7) |
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7.5.1 Nonvolatile Content-Addressable Memory |
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217 | (3) |
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7.5.2 Nonvolatile Ternary CAM Using MTJ Devices in Combination with MOS Transistors |
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220 | (4) |
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7.6 MTJ-based Nonvolatile Field-Programmable Gate Array |
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224 | (7) |
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227 | (4) |
Appendix Units For Magnetic Properties |
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231 | (2) |
Index |
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