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E-raamat: Lateral Power Transistors in Integrated Circuits

  • Formaat: PDF+DRM
  • Sari: Power Systems
  • Ilmumisaeg: 08-Oct-2014
  • Kirjastus: Springer International Publishing AG
  • Keel: eng
  • ISBN-13: 9783319005003
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  • Formaat: PDF+DRM
  • Sari: Power Systems
  • Ilmumisaeg: 08-Oct-2014
  • Kirjastus: Springer International Publishing AG
  • Keel: eng
  • ISBN-13: 9783319005003
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The book summarizes and compares recent advancements in the development of novel lateral power transistors (LDMOS devices) for integrated circuits in power electronic applications.

In its first part, the book motivates the necessity for lateral power transistors by a top-down approach: First, it presents typical energy conversion applications in modern industrial, automotive and consumer electronics. Next, it introduces common circuit topologies suitable for these applications, and discusses the feasibility for monolithic integration. Finally, the combination of power and logic functionality on a single chip is motivated and the requirements and limitations for the power semiconductor devices are deduced.

The second part describes the evolution of lateral power transistors over the past decades from the simple pin-type concept to double-acting RESURF topologies. It describes the principle of operation for these LDMOS devices and discusses limitations of lateral power devices. Moreover, figures-of-merit are presented which can be used to evaluate the performance of the novel lateral power transistors described in this book with respect to the LDMOS devices.

In the last part, [ ..] the fundamental physical concepts including charge compensation and trench gate topologies are discussed. Also, the status of research in LDMOS devices on silicon carbide is presented. Advantages and drawbacks for each of these integration approaches are summarized, and the feasibility with respect to power electronic applications is evaluated.



This book details and compares recent advancements in the development of novel lateral power transistors (LDMOS devices) for integrated circuits in power electronic applications. It includes the state-of-the-art concept of double-acting RESURF topologies.
1 Introduction
1(4)
References
4(1)
2 Demand for Power Electronic Systems and Radio-Frequency Applications
5(20)
2.1 Semiconductors in Integrated Power Electronics and Radio Frequency Amplifiers
5(7)
2.1.1 Impact on Integrated Energy Conversion Systems
6(3)
2.1.2 Impact on Information Technologies
9(3)
2.2 Integrated Power Electronic and Radio-Frequency Applications
12(5)
2.2.1 Switch-Mode Power Supplies for DC-to-DC Conversion
12(1)
2.2.2 Motor Control and Drive Inverters for DC-to-AC Conversion
13(1)
2.2.3 Power Amplifiers for Mobile Communication Base Stations and Handhelds
13(2)
2.2.4 Transceivers for Wireless-LAN Communication
15(2)
2.3 Requirements for Power Electronic and RF Amplifier Systems
17(8)
2.3.1 Energy Efficiency
17(1)
2.3.2 Size and Weight of Equipment
17(1)
2.3.3 Power Density
18(1)
2.3.4 Reliability
18(1)
2.3.5 Time-to-Market
19(1)
2.3.6 System Cost
20(1)
2.3.7 Switching Frequency
20(1)
2.3.8 Ruggedness
21(1)
2.3.9 Comparsion of Requirements
21(1)
References
22(3)
3 Power Electronic and RF Amplifier Circuits
25(16)
3.1 Circuits for Energy Conversion and Control
25(5)
3.1.1 Switch-Mode Converter Circuits
26(1)
3.1.2 Benefits and Drawbacks of Switch-Mode Conversion
27(1)
3.1.3 Direct-Current Conversion and Solid-State Rectification: Buck and Boost Converters
28(1)
3.1.4 Power Inverters: Half and Full Bridge Topologies
29(1)
3.2 Circuits for RF Amplifiers
30(7)
3.2.1 Amplifier Fundamentals
31(4)
3.2.2 Amplifier Classes
35(2)
3.3 Application-Specific Requirements for Power Transistors
37(2)
3.4 Summary of Power Semiconductor Device Requirements
39(2)
References
39(2)
4 Power Semiconductor Devices in Power Electronic Applications
41(34)
4.1 Introduction to Power Semiconductor Devices
41(5)
4.2 Trade-Offs and Figures-of-Merit for Power Semiconductor Devices
46(21)
4.2.1 Static Power Losses: On-State Resistance and Blocking Voltage
47(10)
4.2.2 Dynamic Losses: Device Capacitances and Switching Frequency
57(5)
4.2.3 Switching Frequency and Transistor Gain
62(2)
4.2.4 Switching Frequency and Output Power
64(2)
4.2.5 Power Densities and Long Term Stability
66(1)
4.2.6 Design and Development of LDMOS Transistors in Smart Power ICs
66(1)
4.3 Fundamental Device Topologies of Lateral Power Semiconductor Devices
67(2)
4.3.1 Lateral Power MOSFETs in Smart-Power ICs
67(1)
4.3.2 LDMOS Transistors Optimized for Radio-Frequency Applications
68(1)
4.4 Aspects of Integration of Power Transistors in ICs
69(2)
4.4.1 Advantages of LDMOS Transistors in Integrated Circuits
69(1)
4.4.2 Limitations and Drawbacks of LDMOS Transistors in Integrated Circuits
70(1)
4.5 Safe Operating Area for Lateral Power Transistors
71(1)
4.6 More-Moore and More-than-Moore Integration Methodology in Smart-Power ICs and RF Amplifier Technologies
72(3)
References
73(2)
5 Modern MOS-Based Power Device Technologies in Integrated Circuits
75(30)
5.1 History of Lateral Power Transistor Development
75(3)
5.2 LDMOS Transistors for Smart Power ICs
78(14)
5.2.1 Low Drift Region Resistance with "Reduced Surface Field"
79(9)
5.2.2 Quasi-vertical Power Devices and Deep Trench Isolation in Integrated Circuits
88(1)
5.2.3 Field Plates
88(2)
5.2.4 High-Side Switching Capability
90(1)
5.2.5 Implementation of RESURF-Based Technologies in Smart Power IC Processing Technologies
91(1)
5.3 LDMOS Transistors for Radio-Frequency Applications
92(6)
5.3.1 Source Sinker
93(1)
5.3.2 Ground Shield
93(2)
5.3.3 Design Considerations for RF Transistors in Integrated Circuits
95(2)
5.3.4 LDMOS Transistors in Silicon-on-Insulator Technology
97(1)
5.4 State-of-the-Art in Smart-Power IC and RF Amplifier Technologies
98(7)
References
99(6)
6 Lateral Power Transistors with Charge Compensation Patterns
105(28)
6.1 Concept of Charge Compensation Patterns for Superjunction Devices
105(5)
6.2 Processing Technology for Charge Compensation Patterns
110(3)
6.3 Device Designs with Charge Compensation
113(11)
6.3.1 Fundamental Device Design
113(1)
6.3.2 Substrate-Assisted Depletion Effects
114(2)
6.3.3 Charge-Balancing Technologies in Junction Isolated Devices
116(6)
6.3.4 Charge-Balancing Technologies in Dielectric-Isolated Devices
122(1)
6.3.5 Charge Compensation Patterns Beyond CMOS Technology
123(1)
6.3.6 Comparison of Superjunction LDMOS Transistor Designs
124(1)
6.4 Electrical Properties of Charge Compensated Lateral Power Transistors
124(5)
6.4.1 Reduction of On-State Resistance
126(1)
6.4.2 Impact on Device Capacitances
126(3)
6.5 Feasibility of Integration into Smart-Power ICs and RF Circuits
129(4)
References
130(3)
7 Lateral Power Transistors with Trench Patterns
133(20)
7.1 Contribution of Channel Resistance to Total Device Resistance in Lateral Power Transistors
133(3)
7.2 LDMOS Device Designs for Smart-Power ICs Utilizing Trench Patterns
136(7)
7.2.1 Increased Channel Width Using FinFET Topology
137(1)
7.2.2 Shallow Trench Isolation for Trench Gate Transistors
138(1)
7.2.3 Vertical Channels Using Trench Gates
139(2)
7.2.4 Quasi-vertical Transistors Using Trench Gates
141(1)
7.2.5 Trench Gate Designs Beyond CMOS Technology
141(2)
7.2.6 Comparison of Trench Pattern Designs for Power Electronic Applications
143(1)
7.3 RF LDMOS Device Designs Utilizing Trench Patterns
143(4)
7.3.1 Shallow Trench Isolation
145(1)
7.3.2 Trench Sinker for Cell Length Reduction
146(1)
7.3.3 Comparison of Trench Pattern Designs for RF Applications
146(1)
7.4 Electrical Properties Under Static and Dynamic Device Operation
147(1)
7.5 Limitations and Feasibility of Integration into Smart-Power ICs and RF Circuits
148(5)
References
149(4)
8 Lateral Power Transistors Combining Planar and Trench Gate Topologies
153(24)
8.1 Device Concepts for Combination of Planar and Trench Gates
153(6)
8.1.1 Continuous Trench Gate Integrated LDMOS
153(2)
8.1.2 Intermitted Trench Gate Integrated LDMOS
155(3)
8.1.3 Verification of Manufacturability
158(1)
8.2 Electrical Properties Under Static and Dynamic Device Operation
159(15)
8.2.1 On-State Resistance
159(4)
8.2.2 Breakdown Voltage
163(3)
8.2.3 Avalanche Ruggedness
166(2)
8.2.4 Drawbacks Under Operation as High-Side Switches
168(2)
8.2.5 Switching Losses Under High Power Operation
170(2)
8.2.6 Switching Losses Under High Frequency Operation
172(2)
8.3 Integration Consideration for Smart-Power ICs
174(3)
References
175(2)
9 Lateral Power Transistors on Wide Bandgap Semiconductors
177(32)
9.1 Lateral Silicon Carbide Transistors on 4H Polytype
178(16)
9.1.1 Material Properties of 4H Silicon Carbide
178(6)
9.1.2 Progress on Silicon Carbide MeSFETs and MOSFETs
184(7)
9.1.3 Technological Limitations for 4H-SiC Devices
191(1)
9.1.4 Smart-Power ICs on Silicon Carbide
192(2)
9.2 High Electron Mobility Transistors on Gallium Nitride
194(9)
9.2.1 Mobility and Two-Dimensional Electron Gas
195(2)
9.2.2 Performance of High Electron Mobility Transistors
197(4)
9.2.3 Technological Limitations of GaN Devices
201(1)
9.2.4 GaN-Based MMICs and Class-S Power Amplifiers
202(1)
9.2.5 Integration Consideration for GaN in Smart-Power ICs
202(1)
9.3 Lateral Power Transistors on Wide Bandgap Semiconductors Fabricated in Integrated Circuits
203(6)
References
203(6)
10 Summary of Integration Concepts for LDMOS Transistors
209(12)
10.1 Integration Density and Figures-of-Merit
209(4)
10.1.1 Devices for Power Electronic Systems
209(2)
10.1.2 Devices for Radio-Frequency Amplifiers
211(2)
10.2 Process Complexity and Cost
213(2)
10.3 Application-Specific Suitability
215(2)
10.3.1 Switch Mode Power Supplies
215(1)
10.3.2 Radio Frequency Amplifiers
216(1)
10.4 Evolution of Smart-Power ICs and RF Amplifiers
217(4)
References
219(2)
Index 221