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1 | (4) |
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4 | (1) |
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2 Demand for Power Electronic Systems and Radio-Frequency Applications |
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5 | (20) |
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2.1 Semiconductors in Integrated Power Electronics and Radio Frequency Amplifiers |
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5 | (7) |
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2.1.1 Impact on Integrated Energy Conversion Systems |
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6 | (3) |
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2.1.2 Impact on Information Technologies |
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9 | (3) |
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2.2 Integrated Power Electronic and Radio-Frequency Applications |
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12 | (5) |
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2.2.1 Switch-Mode Power Supplies for DC-to-DC Conversion |
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12 | (1) |
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2.2.2 Motor Control and Drive Inverters for DC-to-AC Conversion |
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13 | (1) |
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2.2.3 Power Amplifiers for Mobile Communication Base Stations and Handhelds |
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13 | (2) |
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2.2.4 Transceivers for Wireless-LAN Communication |
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15 | (2) |
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2.3 Requirements for Power Electronic and RF Amplifier Systems |
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17 | (8) |
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17 | (1) |
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2.3.2 Size and Weight of Equipment |
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17 | (1) |
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18 | (1) |
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18 | (1) |
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19 | (1) |
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20 | (1) |
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2.3.7 Switching Frequency |
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20 | (1) |
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21 | (1) |
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2.3.9 Comparsion of Requirements |
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21 | (1) |
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22 | (3) |
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3 Power Electronic and RF Amplifier Circuits |
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25 | (16) |
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3.1 Circuits for Energy Conversion and Control |
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25 | (5) |
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3.1.1 Switch-Mode Converter Circuits |
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26 | (1) |
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3.1.2 Benefits and Drawbacks of Switch-Mode Conversion |
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27 | (1) |
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3.1.3 Direct-Current Conversion and Solid-State Rectification: Buck and Boost Converters |
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28 | (1) |
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3.1.4 Power Inverters: Half and Full Bridge Topologies |
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29 | (1) |
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3.2 Circuits for RF Amplifiers |
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30 | (7) |
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3.2.1 Amplifier Fundamentals |
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31 | (4) |
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35 | (2) |
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3.3 Application-Specific Requirements for Power Transistors |
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37 | (2) |
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3.4 Summary of Power Semiconductor Device Requirements |
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39 | (2) |
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39 | (2) |
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4 Power Semiconductor Devices in Power Electronic Applications |
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41 | (34) |
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4.1 Introduction to Power Semiconductor Devices |
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41 | (5) |
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4.2 Trade-Offs and Figures-of-Merit for Power Semiconductor Devices |
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46 | (21) |
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4.2.1 Static Power Losses: On-State Resistance and Blocking Voltage |
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47 | (10) |
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4.2.2 Dynamic Losses: Device Capacitances and Switching Frequency |
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57 | (5) |
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4.2.3 Switching Frequency and Transistor Gain |
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62 | (2) |
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4.2.4 Switching Frequency and Output Power |
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64 | (2) |
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4.2.5 Power Densities and Long Term Stability |
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66 | (1) |
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4.2.6 Design and Development of LDMOS Transistors in Smart Power ICs |
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66 | (1) |
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4.3 Fundamental Device Topologies of Lateral Power Semiconductor Devices |
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67 | (2) |
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4.3.1 Lateral Power MOSFETs in Smart-Power ICs |
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67 | (1) |
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4.3.2 LDMOS Transistors Optimized for Radio-Frequency Applications |
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68 | (1) |
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4.4 Aspects of Integration of Power Transistors in ICs |
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69 | (2) |
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4.4.1 Advantages of LDMOS Transistors in Integrated Circuits |
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69 | (1) |
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4.4.2 Limitations and Drawbacks of LDMOS Transistors in Integrated Circuits |
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70 | (1) |
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4.5 Safe Operating Area for Lateral Power Transistors |
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71 | (1) |
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4.6 More-Moore and More-than-Moore Integration Methodology in Smart-Power ICs and RF Amplifier Technologies |
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72 | (3) |
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73 | (2) |
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5 Modern MOS-Based Power Device Technologies in Integrated Circuits |
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75 | (30) |
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5.1 History of Lateral Power Transistor Development |
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75 | (3) |
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5.2 LDMOS Transistors for Smart Power ICs |
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78 | (14) |
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5.2.1 Low Drift Region Resistance with "Reduced Surface Field" |
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79 | (9) |
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5.2.2 Quasi-vertical Power Devices and Deep Trench Isolation in Integrated Circuits |
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88 | (1) |
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88 | (2) |
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5.2.4 High-Side Switching Capability |
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90 | (1) |
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5.2.5 Implementation of RESURF-Based Technologies in Smart Power IC Processing Technologies |
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91 | (1) |
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5.3 LDMOS Transistors for Radio-Frequency Applications |
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92 | (6) |
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93 | (1) |
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93 | (2) |
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5.3.3 Design Considerations for RF Transistors in Integrated Circuits |
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95 | (2) |
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5.3.4 LDMOS Transistors in Silicon-on-Insulator Technology |
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97 | (1) |
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5.4 State-of-the-Art in Smart-Power IC and RF Amplifier Technologies |
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98 | (7) |
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99 | (6) |
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6 Lateral Power Transistors with Charge Compensation Patterns |
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105 | (28) |
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6.1 Concept of Charge Compensation Patterns for Superjunction Devices |
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105 | (5) |
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6.2 Processing Technology for Charge Compensation Patterns |
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110 | (3) |
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6.3 Device Designs with Charge Compensation |
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113 | (11) |
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6.3.1 Fundamental Device Design |
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113 | (1) |
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6.3.2 Substrate-Assisted Depletion Effects |
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114 | (2) |
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6.3.3 Charge-Balancing Technologies in Junction Isolated Devices |
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116 | (6) |
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6.3.4 Charge-Balancing Technologies in Dielectric-Isolated Devices |
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122 | (1) |
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6.3.5 Charge Compensation Patterns Beyond CMOS Technology |
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123 | (1) |
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6.3.6 Comparison of Superjunction LDMOS Transistor Designs |
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124 | (1) |
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6.4 Electrical Properties of Charge Compensated Lateral Power Transistors |
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124 | (5) |
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6.4.1 Reduction of On-State Resistance |
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126 | (1) |
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6.4.2 Impact on Device Capacitances |
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126 | (3) |
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6.5 Feasibility of Integration into Smart-Power ICs and RF Circuits |
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129 | (4) |
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130 | (3) |
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7 Lateral Power Transistors with Trench Patterns |
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133 | (20) |
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7.1 Contribution of Channel Resistance to Total Device Resistance in Lateral Power Transistors |
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133 | (3) |
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7.2 LDMOS Device Designs for Smart-Power ICs Utilizing Trench Patterns |
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136 | (7) |
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7.2.1 Increased Channel Width Using FinFET Topology |
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137 | (1) |
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7.2.2 Shallow Trench Isolation for Trench Gate Transistors |
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138 | (1) |
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7.2.3 Vertical Channels Using Trench Gates |
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139 | (2) |
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7.2.4 Quasi-vertical Transistors Using Trench Gates |
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141 | (1) |
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7.2.5 Trench Gate Designs Beyond CMOS Technology |
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141 | (2) |
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7.2.6 Comparison of Trench Pattern Designs for Power Electronic Applications |
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143 | (1) |
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7.3 RF LDMOS Device Designs Utilizing Trench Patterns |
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143 | (4) |
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7.3.1 Shallow Trench Isolation |
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145 | (1) |
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7.3.2 Trench Sinker for Cell Length Reduction |
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146 | (1) |
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7.3.3 Comparison of Trench Pattern Designs for RF Applications |
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146 | (1) |
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7.4 Electrical Properties Under Static and Dynamic Device Operation |
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147 | (1) |
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7.5 Limitations and Feasibility of Integration into Smart-Power ICs and RF Circuits |
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148 | (5) |
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149 | (4) |
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8 Lateral Power Transistors Combining Planar and Trench Gate Topologies |
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153 | (24) |
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8.1 Device Concepts for Combination of Planar and Trench Gates |
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153 | (6) |
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8.1.1 Continuous Trench Gate Integrated LDMOS |
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153 | (2) |
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8.1.2 Intermitted Trench Gate Integrated LDMOS |
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155 | (3) |
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8.1.3 Verification of Manufacturability |
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158 | (1) |
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8.2 Electrical Properties Under Static and Dynamic Device Operation |
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159 | (15) |
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8.2.1 On-State Resistance |
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159 | (4) |
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163 | (3) |
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8.2.3 Avalanche Ruggedness |
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166 | (2) |
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8.2.4 Drawbacks Under Operation as High-Side Switches |
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168 | (2) |
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8.2.5 Switching Losses Under High Power Operation |
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170 | (2) |
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8.2.6 Switching Losses Under High Frequency Operation |
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172 | (2) |
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8.3 Integration Consideration for Smart-Power ICs |
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174 | (3) |
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175 | (2) |
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9 Lateral Power Transistors on Wide Bandgap Semiconductors |
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177 | (32) |
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9.1 Lateral Silicon Carbide Transistors on 4H Polytype |
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178 | (16) |
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9.1.1 Material Properties of 4H Silicon Carbide |
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178 | (6) |
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9.1.2 Progress on Silicon Carbide MeSFETs and MOSFETs |
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184 | (7) |
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9.1.3 Technological Limitations for 4H-SiC Devices |
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191 | (1) |
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9.1.4 Smart-Power ICs on Silicon Carbide |
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192 | (2) |
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9.2 High Electron Mobility Transistors on Gallium Nitride |
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194 | (9) |
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9.2.1 Mobility and Two-Dimensional Electron Gas |
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195 | (2) |
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9.2.2 Performance of High Electron Mobility Transistors |
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197 | (4) |
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9.2.3 Technological Limitations of GaN Devices |
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201 | (1) |
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9.2.4 GaN-Based MMICs and Class-S Power Amplifiers |
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202 | (1) |
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9.2.5 Integration Consideration for GaN in Smart-Power ICs |
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202 | (1) |
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9.3 Lateral Power Transistors on Wide Bandgap Semiconductors Fabricated in Integrated Circuits |
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203 | (6) |
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203 | (6) |
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10 Summary of Integration Concepts for LDMOS Transistors |
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209 | (12) |
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10.1 Integration Density and Figures-of-Merit |
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209 | (4) |
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10.1.1 Devices for Power Electronic Systems |
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209 | (2) |
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10.1.2 Devices for Radio-Frequency Amplifiers |
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211 | (2) |
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10.2 Process Complexity and Cost |
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213 | (2) |
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10.3 Application-Specific Suitability |
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215 | (2) |
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10.3.1 Switch Mode Power Supplies |
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215 | (1) |
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10.3.2 Radio Frequency Amplifiers |
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216 | (1) |
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10.4 Evolution of Smart-Power ICs and RF Amplifiers |
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217 | (4) |
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219 | (2) |
| Index |
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221 | |