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E-raamat: Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing

(Flextronics International, formerly called Solectron), (National Institute of Standards and Technology), , (Motorola, Inc.),
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  • Ilmumisaeg: 05-Oct-2007
  • Kirjastus: Wiley-IEEE Press
  • Keel: eng
  • ISBN-13: 9780470171462
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Lead-Free Electronics: iNEMI Projects Lead to Successful ManufacturingSuurem pilt
  • Formaat: PDF+DRM
  • Ilmumisaeg: 05-Oct-2007
  • Kirjastus: Wiley-IEEE Press
  • Keel: eng
  • ISBN-13: 9780470171462
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Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
Preface xi
Ronald W. Gedney
Contributors xiii
Introduction 1(1)
Jasbir Bath
Carol A. Handwerker
Lead-Free Assembly Project
2(1)
Alloy Group
3(2)
Process Group
5(1)
Component Group
6(1)
Reliability Group
6(1)
Follow-On Projects/Work
7(2)
Alloy Selection
9(38)
Carol A. Handwerker
Ursula Kattner
Kilwon Moon
Jasbir Bath
Edwin Bradley
Polina Snugovsky
Introduction
9(2)
Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin--Lead Eutectic Solder
11(5)
Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability
16(25)
R&D Issues Remaining in Lead-Free Solder Implementation
41(1)
Summary
42(5)
References
43(4)
Review and Analysis of Lead-Free Solder Material Properties
47(78)
Jean-Paul Clech
Introduction
47(1)
Tin--Lead Properties and Models
48(16)
Tin--Silver Properties and Creep Data
64(20)
Tin--Silver--Copper Properties and Creep Data
84(19)
Alloy Comparisons
103(1)
General Conclusions/Recommendations
104(21)
Appendix A: Tin--Silver Creep Data
107(8)
Appendix B: Tin--Silver--Copper Creep Data
115(3)
Acknowledgments
118(1)
References
118(7)
Lead-Free Solder Paste Technology
125(58)
Ning-Cheng Lee
Introduction
125(1)
Materials
126(10)
Rheology
136(8)
Applications
144(1)
Reflow Soldering
145(17)
Microstructures of Reflowed Joints
162(3)
Challenges of Lead-Free Reflow Soldering
165(12)
Summary
177(6)
References
177(6)
Impact of Elevated Reflow Temperatures on Component Performance
183(28)
Richard D. Parker
Jack McCullen
Nick Lycoudes
R. J. Arvikar
Introduction to Component ``Lead-Free'' Issues
183(1)
Moisture/Reflow Impact on Packaged Integrated Circuits
184(1)
Impact of Increased Solder Peak Reflow Temperatures on Moisture Sensitivity Level Ratings
185(6)
Impact of Increased Solder Peak Reflow Temperatures
191(7)
Observations on Profiling for the Lead-Free Reflow Processes
198(2)
IC Package Improvement Options for Better Package MSL at Higher Lead-Free Solder Reflow Temperatures
200(3)
Frequency Control Products
203(3)
``Lead-Free'' Cost Impact on Components
206(1)
Packaging Identification of Lead-free Packaged ICs
207(2)
Conclusions
209(2)
Acknowledgments
210(1)
References
210(1)
Lead-Free Assembly Reliability---General
211(46)
Edwin Bradley
Introduction
211(2)
Basic Physical Properties of Solder
213(4)
Creep Deformation
217(1)
Thermal Fatigue
218(15)
Creep Rupture
233(2)
Isothermal (Mechanical) Fatigue
235(3)
Out-of-Plane Bending
238(3)
Impact/Shock Loading
241(7)
Effect of Rework on Reliability
248(1)
High-Temperature Operating Life (HTOL)
249(1)
Electrochemical Migration
249(1)
Tin Whiskering
250(1)
Tin Pest
250(1)
Summary
251(6)
Acknowledgments
251(1)
References
251(6)
Lead-Free Assembly Reliability: iNEMI Evaluation and Results
257(30)
Elizabeth Benedetto
John Sohn
Reliability Team Goals
257(1)
Reliability Test Matrix
258(1)
Component-Paste-Board Finish Combinations
259(1)
Components
260(1)
Test Vehicles
261(2)
Pre-Test/Post-Assembly Information
263(1)
CTE Determination: Component and Boards
264(1)
Thermal Cycling Conditions
265(1)
Failure Criteria
266(1)
Thermal Cycle Relative Performance
267(1)
Failure Data, Analysis Packages
267(1)
Weibull Analyses
268(1)
Post-Cycling Failure Analysis
269(13)
Bend Testing
282(2)
Electrochemical Migration Testing [ 36, 37]
284(1)
iNEMI Team Conclusions
284(1)
Overall Summary, Conclusions
284(1)
ASTM Test Methods
285(2)
References
285(2)
Tin Whiskers: Mitigation Strategies and Testing
287(32)
Heidi L. Reynolds
C. J. Lee
Joe Smetana
Introduction
287(3)
Mitigation Strategies
290(8)
Tin Whisker Test Development
298(17)
Summary
315(4)
Acknowledgments
316(1)
References
316(3)
Lead-Free Reflow and Rework
319(66)
Jasbir Bath
Introduction
319(1)
Printability of Lead-Free Solder Pastes
320(9)
Soak Versus Ramp Temperature Profiles
329(3)
Effect of Peak Temperature Versus Reflow Performance
332(10)
Effect of Reflow Atmosphere on Solderability of Lead-Free Solder
342(2)
Convection Versus IR Reflow Ovens
344(2)
Reflow Temperature Delta on Boards and Components
346(4)
Visual Inspection of Lead-Free Soldered Joints
350(3)
Automated Optical Inspection (AOI)
353(2)
X-ray Inspection of Lead-Free Soldered Joints
355(3)
Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow
358(3)
Lead-Free Rework of BGA/CSP Soldered Joints
361(6)
Lead-Free Hand-Soldering Rework
367(3)
In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints
370(1)
Yield Data
371(1)
Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints
371(5)
Conclusions
376(2)
Future Work
378(7)
Acknowledgments
378(1)
References
379(6)
Case Study: Pb-Free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies
385(26)
Jerry Gleason
Charlie Reynolds
Matt Kelly
Jasbir Bath
Quyen Chu
Ken Lyjak
Patrick Roubaud
Introduction
385(1)
Approach and Strategy
386(2)
Observations and Results
388(18)
Conclusions
406(3)
Summary
409(2)
Acknowledgments
410(1)
References
410(1)
Implementing RoHS and WEEE-Compliant Products
411(30)
Jim McElroy
Cynthia Williams
Introduction
411(1)
Are Your Products within the Scope of the EU RoHS?
412(3)
Ten Steps to RoHS Compliance
415(5)
Part Numbering Important for Differentiating Lead-Free from Tin--Lead Components and Boards
420(4)
A Standards-Based Approach to Materials Declaration
424(6)
Standards
430(5)
High-Reliability Requirements
435(4)
Business Impact of Supply Chain Conversion
439(1)
Summary
439(2)
References
439(2)
Index 441


Edwin Bradley is a Distinguished Member of the Technical Staff with Motorola Advanced Product Technology Center in Plantation, Florida. He has extensive experience evaluating the materials, assembly processes, and reliability of portable electronic products, with an emphasis on lead-free soldering.

Carol A. Handwerker is Professor of Materials Engineering at Purdue University. She is active on the iNEMI Technical and Research Committees.

Jasbir Bath is Lead Process Engineer at Solectron Technical Centre in Milpitas, California. He has been chair of various iNEMI lead-free consortia groups.

Richard D. Parker has spent nearly forty years at Delphi Electronics & Safety in Kokomo, Indiana, and he has been active in iNEMI since its inception.

Ronald W. Gedney retired as vice president of operations at iNEMI and remains on as a consultant. A Fellow of the IEEE, he is also a past president of the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society.
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