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E-raamat: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing

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(Huazhong University of Science and Technology, Wuhan, Hubei, China), (Huazhong University of Science and Technology, Wuhan, Hubei, China)
  • Formaat: EPUB+DRM
  • Ilmumisaeg: 05-Jul-2011
  • Kirjastus: John Wiley & Sons Inc
  • Keel: eng
  • ISBN-13: 9780470828403
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LED Packaging for Lighting Applications: Design, Manufacturing, and TestingSuurem pilt
  • Formaat: EPUB+DRM
  • Ilmumisaeg: 05-Jul-2011
  • Kirjastus: John Wiley & Sons Inc
  • Keel: eng
  • ISBN-13: 9780470828403
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Since the first light-emitting diode (LED) was invented by Holonyak and Bevacqua in 1962, LEDs have made remarkable progress in the past few decades with the rapid development of epitaxy growth, chip design and manufacture, packaging structure, processes, and packaging materials. LEDs have superior characteristics such as high efficiency, small size, long life, low power consumption, and high reliability. The market for white LED is growing rapidly in various applications. It has been widely accepted that white LEDs will be the fourth illumination source to substitute the incandescent, fluorescent, and high-pressure sodium lamps. With the development of LED chip and packaging technologies, the efficiency of high power white LED will broaden the application markets of LEDs while changing the lighting concepts of our lives. In LED Packaging for Lighting Applications, Professors Liu and Luo cover the full spectrum of design, manufacturing, and testing. Many concepts are proposed for the first time, and readers will benefit from the concurrent engineering and co-design approaches to advanced engineering design of LED products.





One of the only books to cover LEDs from package design to manufacturing to testing Focuses on the design of LED packaging and its applications such as road lights Includes design methods and experiences necessary for LED engineers, especially optical and thermal design Introduces novel LED packaging structures and manufacturing processes, such as ASLP Covers reliability considerations, the most challenging problem for the LED industry Provides measurement and testing standards, which are critical for LED development, for both LED and LED fixtures Codes and demonstrations available from the books Companion Website

This book is ideal for practicing engineers working in design or packaging at LED companies and graduate students preparing for work in industry. This book also provides a helpful introduction for advanced undergraduates, graduates, researchers, lighting designers, and product managers interested in the fundamentals of LED design and production.

Color version of selected figures can be found at www.wiley.com/go/liu/led

Arvustused

"The book will be useful as a resource for engineers in LED design or packaging, and as an introduction to the field for advanced students, researchers, lighting designers, and product managers." (Book News, 1 October 2011)  

Foreword ix
Magnus George Craford
Foreword xi
C.P. Wong
Foreword xiii
B.J. Lee
Preface xv
Acknowledgments xix
About the Authors xxi
1 Introduction 1(32)
1.1 Historical Evolution of Lighting Technology
1(1)
1.2 Development of LEDs
2(4)
1.3 Basic Physics of LEDs
6(13)
1.3.1 Materials
6(4)
1.3.2 Electrical and Optical Properties
10(8)
1.3.3 Mechanical and Thermal Properties
18(1)
1.4 Industrial Chain of LED
19(9)
1.4.1 LED Upstream Industry
21(1)
1.4.2 LED Midstream Industry
22(1)
1.4.3 LED Downstream Industry
22(6)
1.5 Summary
28(1)
References
29(4)
2 Fundamentals and Development Trends of High Power LED Packaging 33(34)
2.1 Brief Introduction to Electronic Packaging
33(4)
2.1.1 About Electronic Packaging and Its Evolution
33(3)
2.1.2 Wafer Level Packaging, More than Moore, and SiP
36(1)
2.2 LED Chips
37(11)
2.2.1 Current Spreading Efficiency
37(4)
2.2.2 Internal Quantum Efficiency
41(2)
2.2.3 High Light Extraction Efficiency
43(5)
2.3 Types and Functions of LED Packaging
48(3)
2.3.1 Low Power LED Packaging
49(1)
2.3.2 High Power LED Packaging
50(1)
2.4 Key Factors and System Design of High Power LED Packaging
51(6)
2.5 Development Trends and Roadmap
57(5)
2.5.1 Technology Needs
57(2)
2.5.2 Packaging Types
59(3)
2.6 Summary
62(1)
References
62(5)
3 Optical Design of High Power LED Packaging Module 67(82)
3.1 Properties of LED Light
67(16)
3.1.1 Light Frequency and Wavelength
67(2)
3.1.2 Spectral Distribution
69(1)
3.1.3 Flux of Light
69(2)
3.1.4 Lumen Efficiency
71(1)
3.1.5 Luminous Intensity, Illuminance and Luminance
71(5)
3.1.6 Color Temperature, Correlated Color Temperature and Color Rendering index
76(4)
3.1.7 White Light LED
80(3)
3.2 Key Components and Packaging Processes for Optical Design
83(10)
3.2.1 Chip Types and Bonding Process
83(2)
3.2.2 Phosphor Materials and Phosphor Coating Processes
85(5)
3.2.3 Lens and Molding Process
90(3)
3.3 Light Extraction
93(5)
3.4 Optical Modeling and Simulation
98(10)
3.4.1 Chip Modeling
98(4)
3.4.2 Phosphor Modeling
102(6)
3.5 Phosphor for White LED Packaging
108(21)
3.5.1 Phosphor Location for White LED Packaging
108(10)
3.5.2 Phosphor Thickness and Concentration for White LED Packaging
118(5)
3.5.3 Phosphor for Spatial Color Distribution
123(6)
3.6 Collaborative Design
129(15)
3.6.1 Co-design of Surface Micro-Structures of LED Chips and Packages
129(5)
3.6.2 Application Specific LED Packages
134(10)
3.7 Summary
144(1)
References
144(5)
4 Thermal Management of High Power LED Packaging Module 149(18)
4.1 Basic Concepts of Heat Transfer
149(5)
4.1.1 Conduction Heat Transfer
150(1)
4.1.2 Convection Heat Transfer
150(1)
4.1.3 Thermal Radiation
151(2)
4.1.4 Thermal Resistance
153(1)
4.2 Thermal Resistance Analysis of Typical LED Packaging
154(2)
4.3 Various LED Packages for Decreasing Thermal Resistance
156(8)
4.3.1 Development of LED Packaging
156(2)
4.3.2 Thermal Resistance Decrease for LED Packaging
158(4)
4.3.3 SiP/COB LED Chip Packaging Process
162(2)
4.4 Summary
164(1)
References
164(3)
5 Reliability Engineering of High Power LED Packaging 167(48)
5.1 Concept of Design for Reliability (DfR) and Reliability Engineering
167(12)
5.1.1 Fundamentals of Reliability
168(1)
5.1.2 Life Distribution
169(3)
5.1.3 Accelerated Models
172(3)
5.1.4 Applied Mechanics
175(4)
5.2 High Power LED Packaging Reliability Test
179(8)
5.2.1 Traditional Testing Standards, Methods, and Evaluation
179(3)
5.2.2 Methods for Failure Mechanism Analysis
182(2)
5.2.3 Failure Mechanisms Analysis
184(3)
5.3 Rapid Reliability Evaluation
187(24)
5.3.1 Material Property Database
190(4)
5.3.2 Numerical Modeling and Simulation
194(17)
5.4 Summary
211(1)
References
211(4)
6 Design of LED Packaging Applications 215(102)
6.1 Optical Design
215(72)
6.1.1 Introduction of Light Control
215(5)
6.1.2 Reflectors
220(12)
6.1.3 Lenses
232(40)
6.1.4 Diffuser
272(5)
6.1.5 Color Design and Control in LED Applications
277(10)
6.2 Thermal Management
287(24)
6.2.1 Analysis of System Thermal Resistance
287(6)
6.2.2 Types of Heat Dissipation to Environment
293(5)
6.2.3 Design and Optimization of Fin Heat Sink
298(5)
6.2.4 Design Examples of Thermal Management of Typical LED Lighting Systems
303(8)
6.3 Drive Circuit and Intelligent Control Design
311(2)
6.3.1 Typical LED Wireless Intelligent Control System
311(1)
6.3.2 Working Principles of Wireless Intelligent Control System
312(1)
6.4 Summary
313(1)
References
313(4)
7 LED Measurement and Standards 317(14)
7.1 Review of Measurement for LED Light Source
317(1)
7.2 Luminous Flux and Radiant Flux
318(1)
7.3 Measurement for Luminous Intensity
319(1)
7.4 LED Chromaticity Coordinates
320(1)
7.5 Dominant Wavelength Determination Algorithm
321(1)
7.5.1 Curve Fitting Method
321(1)
7.6 LED Color Purity
322(1)
7.7 Color Temperature and Correlated Color Temperature of Light Source
323(1)
7.8 Automatic Sorting for LEDs
324(1)
7.9 Measurement for LED Road Lights
325(4)
7.9.1 Electrical Characteristics
325(1)
7.9.2 Color Characteristics
326(1)
7.9.3 Light Distribution Characteristics
326(1)
7.9.4 Dynamic Characteristics
326(3)
7.9.5 Test of Reliability
329(1)
7.10 Summary
329(1)
References
329(2)
Appendix: Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance 331(18)
Index 349
Sheng Liu is a ChangJiang Professor of Mechanical Engineering at Huazhong University of Science and Technology. He holds a dual appointment at Wuhan National Laboratory for Optoelectronics, and has served as tenured faculty at Wayne State University. He has over 14 years experience in LED/MEMS/IC packaging and extensive experience in consulting with many leading multi-national and Chinese companies. Liu was awarded the White House/NSF Presidential Faculty Fellowship in 1995, ASME Young Engineer Award in 1996, and China NSFC Overseas Young Scientist in 1999. He has been an associate editor for IEEE Trans. On Electronic Packaging Manufacturing since 1999 and an associate editor of Journal of Frontiers of Optoelectronics in China since 2007. He is currently one of the 11 National Committee Members in LED under Ministry of Science and Technology. He obtained a Ph.D. from Stanford in 1992, and got MS and BS in flight vehicle design, Nanjing University of Aeronautics and Astronautics, and he had three years industrial experience in China and USA. He has filed more than 70 patents in China and the USA, and has published more than 300 technical articles. Xiaobing Luo is a professor at Huazhong University of Science and Technology, Wuhan, China, with appointments at the School of Energy and Power Engineering and Wuhan National Lab for Optoelectronics. He received his Ph.D. in 2002 from Tsinghua University, China. He has also worked in Samsung Electronics in Korea as a Senior Engineer. His main research interests are LED, heat and mass transfer, microfluidics, MEMS, and sensors and actuators. He has published more than 60 papers and has applied for 40 patents in the USA, Korea, Japan, Europe and China.
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