Preface |
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xvii | |
Preface to the First Edition |
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xix | |
Suggestions to Instructors |
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xxiii | |
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Overview of MEMS and Microsystems |
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1 | (34) |
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1 | (6) |
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Typical MEMS and Microsystems Products |
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7 | (3) |
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7 | (1) |
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7 | (1) |
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7 | (1) |
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7 | (3) |
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Evolution of Microfabrication |
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10 | (1) |
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Microsystems and Microelectronics |
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11 | (2) |
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Multidisciplinary Nature of Microsystems Design and Manufacture |
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13 | (2) |
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Microsystems and Miniaturization |
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15 | (6) |
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Application of Microsystems in Automotive Industry |
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21 | (6) |
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22 | (2) |
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24 | (1) |
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24 | (1) |
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Vehicle Diagnostics and Health Monitoring |
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24 | (2) |
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Future Automotive Applications |
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26 | (1) |
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Application of Microsystems in Other Industries |
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27 | (3) |
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Application in Health Care Industry |
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27 | (1) |
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Application in Aerospace Industry |
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28 | (1) |
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Application in Industrial Products |
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29 | (1) |
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Application in Consumer Products |
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29 | (1) |
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Application in Telecommunications |
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30 | (1) |
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30 | (5) |
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32 | (3) |
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Working Principles of Microsystems |
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35 | (48) |
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35 | (1) |
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35 | (18) |
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36 | (1) |
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Biomedical and Biosensors |
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37 | (3) |
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40 | (2) |
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42 | (2) |
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44 | (6) |
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50 | (3) |
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53 | (6) |
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Actuation Using Thermal Forces |
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53 | (1) |
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Actuation Using Shape Memory Alloys |
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54 | (1) |
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Actuation Using Piezoelectric Effect |
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54 | (1) |
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Actuation Using Electrostatic Forces |
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55 | (4) |
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59 | (7) |
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59 | (2) |
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61 | (3) |
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64 | (2) |
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Microactuators with Mechanical Inertia |
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66 | (6) |
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66 | (4) |
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70 | (2) |
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72 | (11) |
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74 | (1) |
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75 | (1) |
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75 | (2) |
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77 | (6) |
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Engineering Science for Microsystems Design and Fabrication |
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83 | (26) |
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83 | (1) |
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Atomic Structure of Matter |
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83 | (3) |
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86 | (1) |
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Molecular Theory of Matter and Intermolecular Forces |
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87 | (2) |
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89 | (3) |
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92 | (7) |
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99 | (1) |
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100 | (9) |
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101 | (1) |
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102 | (3) |
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105 | (4) |
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Engineering Mechanics for Microsystems Design |
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109 | (74) |
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109 | (1) |
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Static Bending of Thin Plates |
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110 | (9) |
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Bending of Circular Plates with Edge Fixed |
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112 | (2) |
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Bending of Rectangular Plates with All Edges Fixed |
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114 | (2) |
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Bending of Square Plates with Edges Fixed |
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116 | (3) |
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119 | (31) |
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119 | (4) |
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123 | (2) |
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125 | (1) |
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Design Theory of Accelerometers |
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126 | (8) |
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134 | (10) |
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144 | (6) |
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150 | (15) |
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Thermal Effects on Mechanical Strength of Materials |
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150 | (1) |
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150 | (2) |
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152 | (13) |
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165 | (7) |
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166 | (1) |
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167 | (2) |
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Interfacial Fracture Mechanics |
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169 | (3) |
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172 | (1) |
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Overview of Finite Element Stress Analysis |
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173 | (10) |
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173 | (2) |
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175 | (1) |
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175 | (1) |
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175 | (1) |
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176 | (1) |
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176 | (2) |
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178 | (5) |
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Thermofluid Engineering and Microsystems Design |
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183 | (44) |
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183 | (1) |
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Overview of Basics of Fluid Mechanics at Macro- and Mesoscales |
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184 | (3) |
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184 | (2) |
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Streamlines and Stream Tubes |
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186 | (1) |
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Control Volumes and Control Surfaces |
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187 | (1) |
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Flow Patterns and Reynolds Number |
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187 | (1) |
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Basic Equations in Continuum Fluid Dynamics |
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187 | (8) |
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187 | (3) |
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190 | (2) |
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192 | (3) |
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Laminar Fluid Flow in Circular Conduits |
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195 | (3) |
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Computational Fluid Dynamics |
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198 | (1) |
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Incompressible Fluid Flow in Microconduits |
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199 | (5) |
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199 | (2) |
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201 | (2) |
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203 | (1) |
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Overview of Heat Conduction in Solids |
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204 | (11) |
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General Principle of Heat Conduction |
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204 | (1) |
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Fourier Law of Heat Conduction |
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205 | (2) |
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207 | (1) |
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208 | (1) |
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209 | (1) |
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210 | (5) |
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Heat Conduction in Multilayered Thin Films |
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215 | (5) |
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Heat Conduction in Solids at Submicrometer Scale |
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220 | (7) |
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221 | (6) |
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Scaling Laws in Miniaturization |
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227 | (18) |
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227 | (1) |
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228 | (2) |
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Scaling in Rigid-Body Dynamics |
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230 | (3) |
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Scaling in Dynamic Forces |
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230 | (1) |
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Trimmer Force Scaling Vector |
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231 | (2) |
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Scaling in Electrostatic Forces |
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233 | (2) |
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Scaling of Electromagnetic Forces |
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235 | (2) |
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237 | (1) |
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Scaling in Fluid Mechanics |
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238 | (4) |
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242 | (3) |
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Scaling in Heat Conduction |
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242 | (1) |
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Scaling in Heat Convection |
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243 | (1) |
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244 | (1) |
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Materials for MEMS and Microsystems |
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245 | (40) |
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245 | (1) |
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245 | (2) |
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Active Substrate Materials |
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247 | (1) |
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Silicon as Substrate Material |
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247 | (11) |
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247 | (1) |
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Single-Crystal Silicon and Wafers |
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248 | (2) |
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250 | (3) |
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253 | (3) |
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Mechanical Properties of Silicon |
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256 | (2) |
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258 | (3) |
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258 | (1) |
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259 | (1) |
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259 | (1) |
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260 | (1) |
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261 | (5) |
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266 | (1) |
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267 | (1) |
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268 | (6) |
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274 | (6) |
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Polymers as Industrial Materials |
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274 | (1) |
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Polymers for MEMS and Microsystems |
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275 | (1) |
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275 | (2) |
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277 | (1) |
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278 | (2) |
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280 | (5) |
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281 | (4) |
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Microsystems Fabrication Processes |
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285 | (38) |
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285 | (1) |
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285 | (4) |
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286 | (1) |
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Photoresists and Application |
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286 | (2) |
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288 | (1) |
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289 | (1) |
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Photoresist Removal and Postbaking |
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289 | (1) |
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289 | (3) |
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292 | (3) |
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295 | (6) |
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295 | (1) |
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296 | (1) |
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296 | (4) |
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300 | (1) |
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Chemical Vapor Deposition |
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301 | (11) |
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301 | (1) |
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Chemical Reactions in CVD |
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302 | (1) |
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303 | (7) |
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310 | (2) |
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Physical Vapor Deposition: Sputtering |
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312 | (1) |
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313 | (2) |
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315 | (2) |
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316 | (1) |
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317 | (1) |
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Summary of Microfabrication |
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317 | (6) |
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318 | (5) |
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Overview of Micromanufacturing |
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323 | (26) |
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323 | (1) |
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324 | (9) |
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324 | (1) |
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Isotropic and Anisotropic Etching |
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325 | (1) |
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326 | (2) |
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328 | (1) |
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329 | (4) |
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Comparison of Wet versus Dry Etching |
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333 | (1) |
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333 | (5) |
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333 | (2) |
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335 | (1) |
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Mechanical Problems Associated with Surface Micromachining |
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336 | (2) |
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338 | (5) |
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339 | (1) |
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Materials for Substrates and Photoresists |
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340 | (1) |
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341 | (1) |
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342 | (1) |
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Summary of Micromanufacturing |
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343 | (6) |
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343 | (1) |
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343 | (1) |
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343 | (1) |
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344 | (5) |
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349 | (58) |
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349 | (1) |
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350 | (8) |
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351 | (1) |
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352 | (2) |
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Selection of Manufacturing Processes |
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354 | (1) |
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Selection of Signal Transduction |
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355 | (3) |
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358 | (1) |
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358 | (1) |
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358 | (4) |
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359 | (1) |
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360 | (2) |
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362 | (1) |
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362 | (7) |
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Geometry of MEMS Components |
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362 | (1) |
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362 | (1) |
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Thermomechanical Stress Analysis |
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363 | (1) |
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364 | (5) |
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Interfacial Fracture Analysis |
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369 | (1) |
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Mechanical Design Using Finite Element Method |
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369 | (9) |
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Finite Element Formulation |
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370 | (5) |
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Simulation of Microfabrication Processes |
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375 | (3) |
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Design of Silicon Die of a Micropressure Sensor |
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378 | (4) |
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Design of Microfluidic Network Systems |
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382 | (13) |
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Fluid Resistance in Microchannels |
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383 | (3) |
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Capillary Electrophoresis Network Systems |
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386 | (2) |
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Mathematical Modeling of Capillary Electrophoresis Network Systems |
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388 | (1) |
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Design Case: Capillary Electrophoresis Network System |
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389 | (3) |
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Capillary Electrophoresis in Curved Channels |
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392 | (2) |
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Issues in Design of CE Processes |
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394 | (1) |
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395 | (12) |
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395 | (1) |
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What Is in a CAD Package for Microsystems? |
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395 | (3) |
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How to Choose a CAD Package |
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398 | (1) |
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398 | (4) |
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402 | (5) |
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Assembly, Packaging, and Testing of Microsystems |
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407 | (58) |
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407 | (2) |
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Overview of Microassembly |
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409 | (1) |
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High Costs of Microassembly |
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410 | (1) |
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411 | (2) |
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Major Technical Problems in Microassembly |
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413 | (6) |
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Tolerances in Microassembly |
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414 | (3) |
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417 | (1) |
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Contact Problems in Microassembly Tools |
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417 | (2) |
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419 | (2) |
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Challenging Issues in Microassembly |
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421 | (1) |
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Overview of Microsystems Packaging |
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422 | (2) |
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General Considerations in Packaging Design |
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424 | (1) |
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Three Levels of Microsystems Packaging |
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424 | (3) |
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424 | (1) |
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425 | (2) |
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427 | (1) |
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Interfaces in Microsystems Packaging |
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427 | (1) |
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Essential Packaging Technologies |
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428 | (1) |
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429 | (1) |
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429 | (8) |
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430 | (1) |
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431 | (1) |
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432 | (2) |
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434 | (1) |
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Overview of Surface Bonding Techniques |
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434 | (1) |
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Silicon-on-Insulator: Special Surface Bonding Techniques |
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435 | (2) |
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437 | (2) |
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Sealing and Encapsulation |
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439 | (4) |
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Integrated Encapsulation Processes |
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440 | (1) |
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441 | (1) |
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Vacuum Sealing and Encapsulation |
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442 | (1) |
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Three-Dimensional Packaging |
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443 | (1) |
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Selection of Packaging Materials |
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444 | (3) |
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Signal Mapping and Transduction |
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447 | (4) |
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Typical Electrical Signals in Microsystems |
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447 | (1) |
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Measurement of Resistance |
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447 | (1) |
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Signal Mapping and Transduction in Pressure Sensors |
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448 | (2) |
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450 | (1) |
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Design Case on Pressure Sensor Packaging |
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451 | (4) |
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Reliability in MEMS Packaging |
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455 | (1) |
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456 | (9) |
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458 | (7) |
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Introduction to Nanoscale Engineering |
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465 | (44) |
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465 | (2) |
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Micro- and Nanoscale Technologies |
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467 | (1) |
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General Principle of Nanofabrication |
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468 | (3) |
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471 | (3) |
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Application of Nanoproducts |
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474 | (4) |
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478 | (1) |
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479 | (3) |
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Fluid Flow in Submicrometer- and Nanoscales |
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482 | (4) |
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482 | (1) |
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482 | (1) |
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Modeling of Micro- and Nanoscale Gas Flow |
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483 | (3) |
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Heat Conduction at Nanoscale |
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486 | (5) |
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Heat Transmission at Submicrometer- and Nanoscale |
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486 | (3) |
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Thermal Conductivity of Thin Films |
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489 | (1) |
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Heat Conduction Equation for Thin Films |
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490 | (1) |
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Measurement of Thermal Conductivity |
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491 | (6) |
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Challenges in Nanoscale Engineering |
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497 | (5) |
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Nanopatterning in Nanofabrication |
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498 | (2) |
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500 | (1) |
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New Materials for Nanoelectromechanical Systems (NEMS) |
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500 | (1) |
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501 | (1) |
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502 | (1) |
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Social Impacts of Nanoscale Engineering |
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502 | (7) |
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503 | (6) |
References |
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509 | (14) |
Appendix 1 Recommended Units for Thermophysical Quantities |
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523 | (2) |
Appendix 2 Conversion of Units |
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525 | (2) |
Index |
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527 | |