The text focuses on covering advanced manufacturing processes to fabricate microfluidic and micro-electromechanical system devices.
The reference text focuses on covering advanced manufacturing processes to fabricate microfluidic and micro-electromechanical system devices. It covers the fabrication of multiple hole arrays for interconnects, surface roughening of glass for microsystems packaging applications, and fabrication, and characterization of through-glass via for micro-electromechanical system packaging applications.
This book:
- Presents an overview of subtractive technologies needed to process glass materials for micro-fluidic, and micro-electromechanical system applications.
- Discusses the latest developments in advanced machining techniques based on mechanical energy, chemical energy, plasma energy, and high-temperature methods.
- Covers post-processing techniques employed to facilitate the machined glass substrates for the micro-electromechanical system, micro-fluidic, and lab-on-chip applications.
- Explains advanced techniques such as nonconventional machining processes, hybrid, and sequential machining methods to process glass.
- Illustrates topics such as photoacoustic biosensing, cantilever beam temperature sensor, and parametric effect on machined micro-channels.
It is primarily written for senior undergraduates, graduate students, and academic researchers in the fields of manufacturing engineering, industrial engineering, mechanical engineering, production engineering, materials science, and engineering.
1. Introduction. Part 1: Mechanical Approaches.
2. Micro-Grinding
Process of Glass Substrates.
3. Ultrasonic Machining of Glass Substrates.
4.
Sandblasting of Glass Substrates. Part 2: Chemical Approaches.
5. Chemical
Etching of Glass Substrates.
6. Fabrication of TGVs by ECDD process for MEMS
packaging applications.
7. ECD milling of glass for micro fluidic and RDL
applications. Part 3: Plasma Approach.
8. Reactive Ion Etching of Glass
Substrates. Part 4: High Temperature Approaches.
9. Glass Reflow of Glass
Substrates.
10. Microwave Machining of Glass Substrate for Micro Hole
Fabrication.
11. Laser Machining of Glass Substrates. Part 5: Hybrid
Approach.
12. Triplex hybrid method for glass processing: Laser and
Ultrasonic assisted Electrochemical discharge machining. Part 6: Post
Processing Approach.
13. Post processing of glass substrates for
Micro-Fluidic and MEMS applications.14. Conclusions.
Nguyen Van Toan received his B.S. degree in 2006 and his M.S. degree in 2009 in physics and electronics, respectively, from University of Science, Vietnam National University, Ho Chi Minh City, Viet Nam. He received his Dr. Eng. degree from Tohoku University in 2014 for research on silicon capable of integrating LSI for application to timing devices. He currently works as an Associate Professor at Micro System Integration Center, Tohoku University. He has published 90 peer-reviewed journal papers, four patents, one book, and four book chapters. His research results have been presented in over 100 conferences. He had a class in MEMS/NEMS seminar and mechanical systems engineering, offering guidance to over 30 graduate students. He has received several awards, including Research Travel Award for IEEE-MEMS conferences (in 2017 and 2020) and for IEEE-Transducers (2017), Outstanding paper awards in IEEE-NANO and IEEE-NEMS, Best paper award in 2019 (IEEJ), Best published paper in 2022 (University of Science, VNU, Viet Nam), and Electrical Science Promotion Award in 2022 (-IEE, ). He is pursuing an all-in-one micro/nano energy system, including energy harvesting, energy storage and sensing, and developing high-performance functional materials and devices. His current research interests include capacitive silicon resonators, optical modulator devices, thermal-to-electric power generators, gas sensing, micro-supercapacitor, Knudsen pump, ion transportation and metal-assisted chemical etching.
Tarlochan Singh is currently serving as an Assistant Professor in the School of Product and Industrial Design at Lovely Professional University (LPU), Jalandhar, a position he has held since March 2022. Prior to joining LPU, he was an Institutional Post-doctoral Fellow at the Indian Institute of Technology (IIT) Bombay, India. Dr. Singh earned his B.Tech. in Mechanical Engineering with a Gold Medal from Punjab Technical University in 2011, followed by an M.Tech. in Production and Industrial Systems Engineering from IIT Roorkee in 2013. He completed his Ph.D. in Advanced Machining Processes from IIT Roorkee in 2019. His current research focuses on advanced manufacturing techniques, particularly the machining of hard-to-cut materials and the development of innovative micro-machining processes. He has published 25 peer-reviewed journal articles, holds two patents, and has contributed one book and three book chapters. Dr. Singh is actively involved in the development of sequential and hybrid non-conventional machining methods for processing and finishing hard-to-machine ceramics. Additionally, he is engaged in product design and development using polymer waste materials and is exploring surface modification techniques for ceramics and metals for applications in MEMS and biomedical devices.
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