| Preface |
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xv | |
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1 | (8) |
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General Field-Solver Applications |
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2 | (1) |
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3 | (1) |
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A Note on 3D Wireframe Views |
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4 | (2) |
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6 | (3) |
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8 | (1) |
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CAD of Passive Components |
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9 | (20) |
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10 | (3) |
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13 | (3) |
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Solution Time for Circuit Theory and Field Theory |
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16 | (2) |
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A ``Hybrid'' Approach to Circuit Analysis |
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18 | (5) |
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23 | (1) |
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Modern Microwave CAD---What's Missing? |
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24 | (2) |
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26 | (3) |
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27 | (2) |
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Numerical Electromagnetics |
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29 | (52) |
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Microwave Analysis and Design |
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30 | (2) |
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Methods of Electromagnetic Analysis |
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32 | (2) |
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The Features Common to All Numerical Methods |
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34 | (1) |
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The Differences Between Numerical Methods |
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35 | (1) |
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Categories of Numerical Methods |
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35 | (2) |
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37 | (3) |
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Strategies for Finding the Unknown Coefficients |
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40 | (3) |
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43 | (7) |
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49 | (1) |
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The Finite Element Method |
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50 | (5) |
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Linear Expansion Functions and Unknown Coefficients |
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51 | (2) |
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Strategy for Determining the Unknown Expansion Coefficients |
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53 | (2) |
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Finite Difference and Finite Integration Methods |
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55 | (6) |
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Finite Difference Formulations |
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55 | (3) |
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Finite Integration Formulation |
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58 | (1) |
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59 | (2) |
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Finite Difference Time Domain Formulations |
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61 | (6) |
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65 | (1) |
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Initial and Boundary Conditions |
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66 | (1) |
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Output from FDTD Simulators |
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66 | (1) |
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Transmission Line Matrix Methods |
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67 | (6) |
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TLM Basics and the Two-Dimensional TLM Shunt Mesh |
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67 | (3) |
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The Three-Dimensional Expanded TLM Mesh |
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70 | (1) |
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The Symmetrical Condensed Node TLM Mesh |
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71 | (1) |
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Inhomogeneous Materials and Losses |
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72 | (1) |
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Initial and Boundary Conditions |
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72 | (1) |
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73 | (1) |
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Output from Electromagnetic Simulators |
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73 | (2) |
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Discussion and Conclusion |
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75 | (2) |
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77 | (4) |
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77 | (4) |
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Alternative Classifications |
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81 | (8) |
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Classification by Geometry |
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81 | (4) |
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81 | (2) |
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83 | (1) |
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84 | (1) |
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85 | (1) |
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Classification by Solution Domain |
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85 | (4) |
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86 | (1) |
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86 | (1) |
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87 | (1) |
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88 | (1) |
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89 | (36) |
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Closed Box Moment Method---Strengths |
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89 | (1) |
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Closed Box Moment Method---Weaknesses |
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89 | (1) |
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Laterally Open Moment Method---Strengths |
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90 | (1) |
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Laterally Open Moment Method---Weaknesses |
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90 | (1) |
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Issues Common to Both MoM Formulations |
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91 | (1) |
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Exceptions to General MoM Comments |
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92 | (1) |
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92 | (3) |
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MoM---Cells and Subsections |
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95 | (1) |
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MoM---Validation Structures |
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96 | (2) |
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MoM Meshing and Convergence |
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98 | (4) |
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Uniform Versus Edge-Meshing |
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99 | (1) |
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100 | (1) |
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Summary for Meshing and Impedance Convergence |
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101 | (1) |
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102 | (12) |
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Meshing a Microstrip Tee-Junction |
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103 | (2) |
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105 | (1) |
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Meshing a Printed Spiral Inductor |
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105 | (2) |
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Meshing Printed Capacitors |
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107 | (4) |
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Meshing Overlay and MIM Capacitors |
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111 | (2) |
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Exceptions to Mesh Control Discussion |
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113 | (1) |
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113 | (1) |
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114 | (2) |
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MoM---Calibration Structures |
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116 | (6) |
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Microstrip Ideal Short Circuit |
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116 | (2) |
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118 | (1) |
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Microstrip Thin-Film Resistor |
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118 | (3) |
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Summary for Microstrip Calibration Structures |
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121 | (1) |
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122 | (3) |
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122 | (3) |
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Finite Element Method Simulators |
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125 | (28) |
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Finite Element Method---Strengths |
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125 | (2) |
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Finite Element Method---Weaknesses |
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127 | (1) |
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FEM Simulators---Validation Structures |
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128 | (1) |
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128 | (17) |
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Meshing The Coaxial Standard---Geometrical Resolution |
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130 | (2) |
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Meshing a Coaxial Resonator---Dummies and Seeding |
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132 | (5) |
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Meshing a Coaxial Step Discontinuity---Dummies and Seeding |
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137 | (6) |
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Solving the Step Discontinuity in 2D |
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143 | (1) |
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143 | (2) |
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FEM Calibration Structures |
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145 | (5) |
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7-mm Coaxial Through Line |
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145 | (2) |
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147 | (1) |
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7-mm Shielded Coaxial Open |
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148 | (1) |
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149 | (1) |
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150 | (1) |
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150 | (3) |
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151 | (2) |
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153 | (20) |
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153 | (1) |
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FDTD and TLM---Weaknesses |
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154 | (2) |
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FDTD and TLM---Validation Structures |
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156 | (7) |
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158 | (2) |
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Wideband Rectangular Waveguide Validation |
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160 | (3) |
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163 | (7) |
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Meshing the Stripline Standard |
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165 | (1) |
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Meshing the Coaxial Step Discontinuity |
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166 | (4) |
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170 | (3) |
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170 | (3) |
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173 | (26) |
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Ports---Connecting Fields to Circuits |
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173 | (3) |
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De-embedding and Unterminating |
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176 | (4) |
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Closed Box MoM Ports and De-embedding |
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180 | (3) |
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Laterally Open MoM Ports and De-embedding |
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183 | (1) |
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3D FEM Ports and De-embedding |
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184 | (3) |
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3D FDTD and TLM Ports and De-embedding |
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187 | (2) |
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Internal, Lumped, and Gap Ports |
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189 | (4) |
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Exceptions to the Comments on Internal Ports |
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192 | (1) |
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193 | (6) |
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196 | (3) |
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Numerical Methods Summary |
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199 | (6) |
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199 | (1) |
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200 | (1) |
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200 | (1) |
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200 | (2) |
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201 | (1) |
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201 | (1) |
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201 | (1) |
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202 | (1) |
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202 | (1) |
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203 | (2) |
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203 | (1) |
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204 | (1) |
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Internal, Lumped, and Gap Ports |
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204 | (1) |
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205 | (32) |
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205 | (2) |
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Microstrip Vias and Slots |
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207 | (2) |
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209 | (3) |
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212 | (3) |
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215 | (2) |
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217 | (2) |
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Summary for Microstrip Discontinuities |
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219 | (1) |
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Quasi-TEM Nature of Microstrip |
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220 | (2) |
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Evanescent Modes in Microstrip |
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222 | (2) |
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224 | (5) |
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Compaction of Microstrip Circuits |
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229 | (8) |
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230 | (2) |
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232 | (1) |
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Microstrip Branchline Coupler |
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233 | (1) |
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234 | (3) |
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237 | (18) |
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Single Strip Impedance and Phase Velocity |
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237 | (7) |
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Single Strip Impedance Using Symmetry |
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244 | (2) |
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Coupled Line Parameters Using Symmetry |
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246 | (4) |
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CPW with Dielectric Overlay |
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250 | (2) |
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Buried Transmission Lines |
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252 | (1) |
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Other Applications of 2D Cross-Section-Solvers |
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253 | (2) |
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254 | (1) |
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Vias, Via Fences, and Grounding Pads |
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255 | (28) |
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255 | (3) |
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A More Advanced Via Model |
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258 | (4) |
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Summary for Microstrip Single Layer Vias |
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262 | (1) |
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Via Isolation Fences---Part I |
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263 | (5) |
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263 | (4) |
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267 | (1) |
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Via Isolation Fences---Part II |
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268 | (3) |
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271 | (10) |
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Summary for Grounding Pads |
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281 | (2) |
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282 | (1) |
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Multilayer Printed Circuit Boards |
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283 | (32) |
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A Multilayer Transition in FR4 |
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283 | (7) |
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Controlled Impedance Transitions |
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290 | (15) |
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Analysis Using Closed Box MoM |
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291 | (8) |
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Analysis Using Laterally Open MoM |
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299 | (2) |
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301 | (4) |
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305 | (6) |
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311 | (4) |
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313 | (2) |
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315 | (24) |
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RF Edge-Launch Connectors |
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315 | (6) |
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Digital Edge-Launch Connectors |
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321 | (2) |
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Another Digital Edge-Launch Example |
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323 | (3) |
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Through Hole SMA Connectors |
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326 | (7) |
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Surface Mount SMA Connectors |
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333 | (3) |
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336 | (3) |
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337 | (2) |
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339 | (38) |
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339 | (8) |
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Couplers and Metal Thickness |
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347 | (10) |
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357 | (6) |
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363 | (6) |
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PCS Band Coax-to-Coax Transition |
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369 | (8) |
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375 | (2) |
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377 | (30) |
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378 | (6) |
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384 | (3) |
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387 | (7) |
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394 | (5) |
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1.5 to 5.5-GHz Bandpass Filter |
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399 | (2) |
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401 | (6) |
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405 | (2) |
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407 | (26) |
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407 | (7) |
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414 | (11) |
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425 | (8) |
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431 | (2) |
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Choosing the Right Software |
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433 | (6) |
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The Solution Process From Start to Finish |
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433 | (1) |
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Features All Tools Must Have |
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434 | (1) |
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Features That Are Nice to Have |
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435 | (1) |
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435 | (1) |
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Ease of Use and Total Solution Time |
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436 | (1) |
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The Right Tool for the Job |
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437 | (2) |
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438 | (1) |
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Appendix A Survey of Field-Solver Software |
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439 | (14) |
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A.1 2D Cross-Section-Solvers |
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439 | (6) |
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A.1.1 Stand-Alone Software-PDE Solvers |
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439 | (2) |
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A.1.2 Stand-Alone 2D Electrostatic Solvers |
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441 | (1) |
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A.1.3 Summary for Stand-Alone 2D Solvers |
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442 | (1) |
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A.1.4 Integrated 2D Field-Solvers |
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443 | (2) |
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A.1.5 Summary for Integrated 2D Field-Solvers |
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445 | (1) |
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A.2 2.5D Planar Solvers (3D Mostly Planar) |
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445 | (4) |
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A.3 3D Arbitrary Geometry Solvers |
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449 | (4) |
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Appendix B List of Software Vendors |
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453 | (4) |
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Appendix C List of Internet Sites |
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457 | (2) |
| About the Authors |
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459 | (2) |
| Index |
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461 | |
Lisainfo e-raamatute kohta