Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. This book offers an overview of nano and bio packaging. It includes a discussion of nano bio packaging materials and design with MD simulations.
This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including:
- Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives;
- Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations;
- Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces;
- Covers nano chemistry for bio sensor/bio material device packaging.
This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging.
Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
Part1. Electronics (electrical interconnections and thermal
management).
Chapter 1.Nanomaterials for Microelectronics, Biomedical, MEMS,
and Energy Devices Packaging.
Chapter
2. Nano-conductive Adhesives for
Nano-electronics Interconnection.
Chapter
3. Applications of Carbon
Nanomaterials as Electrical Interconnects and Thermal Interface Materials.-
Chapter
4. Nanomaterials via Nano Spray Combustion Chemical Vapor
Condensation, and Their Electronic Applications.
Chapter
5. Nanolead-Free
Solder Pastes for Low Processing Temperature Interconnect Applications in
Microelectronic Packaging.
Chapter
6. Introduction to Nanoparticle-Based
Integrated Passives.
Chapter
7. Thermally Conductive Nanocomposites.-
Chapter
8. Physical Properties and Mechanical Behavior of CarbonNano-tubes
(CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs)
for High-Power Integrated Circuit (IC)Packages: Review and Extension.-
Chapter
9. On-Chip Thermal Management andHot-Spot Remediation.
Chapter
10.
Some Aspects of Microchannel Heat Transfer.- Part II.BioMEMs packaging.-
Chapter
11. Nanoprobes for Live-Cell Gene Detection.
Chapter
12. Packaging
for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips.-
Chapter
13. Packaging of Biomolecular and Chemical Microsensors.
Chapter
14.
Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging.-
Chapter
15. Biomimetic Lotus Effect Surfaces for Nanopackaging.- Part III.
Wearable devices packaging and materials.
Chapter
16. Soft Material-Enabled
Packaging for Stretchable and Flexible Hybrid Electronics.- Part IV.
Biomedical devices packaging.
Chapter
17. Evolution of Advanced
Miniaturization for Active Implantable Medical Devices.- Part V. Optical
device packaging.
Chapter
18. An introduction of the phosphor converted
white LED packaging and its reliability.- Part VI. Energy harvesting.-
Chapter
19. Mechanical Energy Harvesting Using Wurtzite Nanowires.
Chapter
20. 1D Nanowire Electrode Materials for Power Sources of Microelectronics.-
Part VII. Energy storage (LIB battery).
Chapter
21. Graphene-based materials
with tailored nanostructures for lithium-ion batteries.- Part VIII. Energy
storage (supercapacitor).
Chapter
22. Fe-Based Anode Materials for
Asymmetric Supercapacitors.- Part XI. Metrology.
Chapter
23. Nanoscale
Deformation and Strain Analysis by AFM/DIC Technique.- Part X.
Computational.
Chapter
24. Molecular Dynamics Applications in Packaging.-
Chapter
25. Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.
C. P. Wong is the Charles Smithgall Institute Endowed Chair and Regents Professor at Georgia Institute of Technology and a member of the National Academy of Engineering of the USA since 2000, and a foreign academician of the Chinese Academy of Engineering since 2013. After his doctoral study at Pennsylvania State University, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University. Prior to joining Georgia Tech, he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow in 1992. His research interests lie in the fields of polymeric materials, electronic packaging and interconnect, interfacial adhesions, energy storage devices, nano-functional material syntheses and characterizations. nano-composites such as well-aligned carbon nanotubes, graphenes, lead-free alloys, flip chip underfill, ultra-high k capacitor composites and novel lotus effect coating materials.
Kyoung-sik (Jack) Moon is Research Faculty with the School of Materials Science and Engineering at George Tech. He received the B.S., M.S. and Ph.D. degrees in materials science and engineering from Korea University, Seoul, Korea, in 1995, 1997 and 1999, respectively. He has published over 135 journal and 140 proceedings papers as author and co-author. His research interests lie in the materials for electrical and thermal interconnections and chemical, physical and electromagnetic protections of IC devices in microelectronics and photonics packaging, and energy storage devices.
Yi Li is Engineering TD manager at Intel Corp. Chandler, AZ, USA. She received the B.S. and M.S. degrees in materials science and engineering from Zhejiang University, Hangzhou, China, in 2000 and 2002, respectively, and the Ph.D. degree in materials science and engineering from the Georgia Institute of Technology, Atlanta, in 2007. She is the author of four book chapters and authored and coauthored 30 technical papers and 40 conference proceedings. Her research interests focus on the materials and process of high-performance lead-free interconnect for electronics packaging, including the application of nano- and bio-materials in advanced polymer composites. Her research interests also include the thermal management of packaging.
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