Muutke küpsiste eelistusi

E-raamat: New Approaches to Image Processing based Failure Analysis of Nano-Scale ULSI Devices

(Dept. of Electronics Engineering, Jerusalem College of Enginee), (Researcher at Bar-Ilan University, Faculty of Engineering, Israel), (Faculty of Engineering and the Center for Advanced Materials and Nanotechnology, Bar-Ilan University)
  • Formaat: EPUB+DRM
  • Sari: Micro & Nano Technologies
  • Ilmumisaeg: 13-Nov-2013
  • Kirjastus: William Andrew Publishing
  • Keel: eng
  • ISBN-13: 9780128000175
  • Formaat - EPUB+DRM
  • Hind: 38,27 €*
  • * hind on lõplik, st. muud allahindlused enam ei rakendu
  • Lisa ostukorvi
  • Lisa soovinimekirja
  • See e-raamat on mõeldud ainult isiklikuks kasutamiseks. E-raamatuid ei saa tagastada.
  • Formaat: EPUB+DRM
  • Sari: Micro & Nano Technologies
  • Ilmumisaeg: 13-Nov-2013
  • Kirjastus: William Andrew Publishing
  • Keel: eng
  • ISBN-13: 9780128000175

DRM piirangud

  • Kopeerimine (copy/paste):

    ei ole lubatud

  • Printimine:

    ei ole lubatud

  • Kasutamine:

    Digitaalõiguste kaitse (DRM)
    Kirjastus on väljastanud selle e-raamatu krüpteeritud kujul, mis tähendab, et selle lugemiseks peate installeerima spetsiaalse tarkvara. Samuti peate looma endale  Adobe ID Rohkem infot siin. E-raamatut saab lugeda 1 kasutaja ning alla laadida kuni 6'de seadmesse (kõik autoriseeritud sama Adobe ID-ga).

    Vajalik tarkvara
    Mobiilsetes seadmetes (telefon või tahvelarvuti) lugemiseks peate installeerima selle tasuta rakenduse: PocketBook Reader (iOS / Android)

    PC või Mac seadmes lugemiseks peate installima Adobe Digital Editionsi (Seeon tasuta rakendus spetsiaalselt e-raamatute lugemiseks. Seda ei tohi segamini ajada Adober Reader'iga, mis tõenäoliselt on juba teie arvutisse installeeritud )

    Seda e-raamatut ei saa lugeda Amazon Kindle's. 

New Approaches to Image Processing Based Failure Analysis of Nano-Scale ULSI Devices introduces the reader to transmission and scanning microscope image processing for metal and non-metallic microstructures.

Engineers and scientists face the pressing problem in ULSI development and quality assurance: microscopy methods can’t keep pace with the continuous shrinking of feature size in microelectronics. Nanometer scale sizes are below the resolution of light, and imaging these features is nearly impossible even with electron microscopes, due to image noise.

This book presents novel "smart" image processing methods, applications, and case studies concerning quality improvement of microscope images of microelectronic chips and process optimization. It explains an approach for high-resolution imaging of advanced metallization for micro- and nanoelectronics. This approach obviates the time-consuming preparation and selection of microscope measurement and sample conditions, enabling not only better electron-microscopic resolution, but also more efficient testing and quality control. This in turn leads to productivity gains in design and development of nano-scale ULSI chips.

The authors also present several approaches for super-resolving low-resolution images to improve failure analysis of microelectronic chips.

  • Acquaints users with new software-based approaches to enhance high-resolution microscope imaging of microchip structures
  • Demonstrates how these methods lead to productivity gains in the development of ULSI chips
  • Presents several techniques for the superresolution of images, enabling engineers and scientists to improve their results in failure analysis of microelectronic chips

Muu info

Presents new software-based approaches for microscope imaging of microchip structures - meeting the challenge of shrinking sizes in micro- and nanoelectronics
Preface vii
1 Introduction
1(28)
1.1 Basics of Image Processing
1(13)
1.2 The Problems of Shrinking Feature Size in ULSI Development and Failure Analysis
14(2)
1.3 High Resolution Imaging of Structures
16(2)
1.4 Fabrication Techniques in ULSI Industry
18(11)
References
25(4)
2 New Image Processing Methods for Advanced Metallization in Micro- and Nano-Electronics
29(16)
2.1 Characteristics of Metal Ultrathin Films' Microstructures
29(7)
2.2 Increased Productivity by Obviating Steps of Selection of Measurement Conditions
36(3)
2.3 Demonstration of Method Capabilities
39(6)
References
42(3)
3 New Super Resolving Techniques and Methods for Microelectronics
45
3.1 The Basics of Super Resolution
45(24)
3.2 Super-Resolution Imaging for Improved Failure Analysis
69(13)
3.3 Usage of Radon Transform for Improved Failure Analysis
82
References
96