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E-raamat: Power Systems-On-Chip: Practical Aspects of Design

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  • Ilmumisaeg: 22-Nov-2016
  • Kirjastus: ISTE Ltd and John Wiley & Sons Inc
  • Keel: eng
  • ISBN-13: 9781119377689
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Power Systems-On-Chip: Practical Aspects of DesignSuurem pilt
  • Formaat: PDF+DRM
  • Ilmumisaeg: 22-Nov-2016
  • Kirjastus: ISTE Ltd and John Wiley & Sons Inc
  • Keel: eng
  • ISBN-13: 9781119377689
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The book gathers the major issues involved in the practical design of Power Management solutions in wireless products as Internet-of-things. Presentation is not about state-of-the-art but about appropriation of validated recent technologies by practicing engineers. The book delivers insights on major trade-offs and a presentation of examples as a cookbook. The content is segmented in chapters to make access easier for the lay-person.
Preface xi
Introduction xv
Brano Allard
Chapter 1 Control Strategies and CAD Approach
1(92)
Pedro Alou
Jose A. Cobos
Jesus A. Oliver
Bruno Allard
Benoit Labbe
Aleksandar Prodic
Aleksandar Radic
1.1 Objectives
2(6)
1.2 Operation principle of three non-isolated converters
8(5)
1.2.1 Buck converter operation
8(2)
1.2.2 Boost converter operation
10(1)
1.2.3 Buck-boost converter operation
11(2)
1.3 Power stage
13(16)
1.3.1 MOSFET switching an inductive load
13(5)
1.3.2 Extracting the parasitic capacitance values using simulations
18(1)
1.3.3 Power-stage design issues
19(2)
1.3.4 Segmented power stage and multiphase operation
21(1)
1.3.5 LC filter design space
22(7)
1.4 Control stage
29(34)
1.4.1 Voltage-mode control of the buck converter
29(6)
1.4.2 The RHP zero of the boost converter
35(2)
1.4.3 Current-mode control
37(3)
1.4.4 Hysteretic and sliding-mode control
40(5)
1.4.5 Ripple-based controls for fast dynamics
45(7)
1.4.6 V1 concept: description and applicability
52(7)
1.4.7 Overview of the synchronization of asynchronous modulations
59(3)
1.4.8 PFM -- pulse skipping: burst modes
62(1)
1.5 Minimum voltage deviation controller
63(6)
1.5.1 Introduction
64(3)
1.5.2 Integrated circuit implementation and experimental results
67(2)
1.6 CAD tools for PwrSoC design and optimization
69(22)
1.6.1 Overview of the CAD requirements
71(2)
1.6.2 Loss models for integrated inductors and semiconductors
73(9)
1.6.3 Optimization algorithms
82(2)
1.6.4 Outcome of the optimization (topology, area, loss, fsw, detailed design)
84(3)
1.6.5 Impact of technology
87(4)
1.7 Conclusion
91(2)
Chapter 2 Magnetic Components for Increased Power Density
93(40)
Santosh Kulkarni
Cian O'Mathuna
2.1 Commercial and research trends towards PwrSiP and PwrSoC
96(8)
2.2 Review of magnetics
104(14)
2.2.1 Micro-inductor structures
104(7)
2.2.2 Magnetic materials and processing for thin film integrated micro-magnetic devices
111(7)
2.3 Figures of merit for performance of integrated magnetics
118(5)
2.3.1 Figure of merit -- DC performance
118(5)
2.3.2 Figure of merit and AC performance
123(1)
2.4 Technology roadmap and challenges
123(7)
2.4.1 Market drivers
124(2)
2.4.2 PwrSoC supply chain challenges
126(1)
2.4.3 PwrSoC technology platform
127(1)
2.4.4 Integrated magnetic devices for PwrSoC -- opportunities
128(2)
2.5 Conclusions
130(2)
2.6 Acknowledgments
132(1)
Chapter 3 Dielectric Components for Increased Power Density
133(24)
Frederic Voiron
3.1 Introduction
133(2)
3.2 Basics of dielectric physics
135(5)
3.2.1 Forewords
135(1)
3.2.2 Polarization, dipole and capacitance
135(1)
3.2.3 Polarization mechanisms in dielectrics
136(3)
3.2.4 Losses in dielectrics
139(1)
3.3 Silicon integrated capacitors
140(5)
3.3.1 Integrated capacitors for enhanced performance
141(4)
3.4 Integrated capacitors for enhanced reliability
145(5)
3.4.1 Dielectric processing
145(4)
3.4.2 Lifetime considerations
149(1)
3.5 Integrated capacitor optimization for power switching
150(4)
3.5.1 Regular layout
150(1)
3.5.2 Broad band modeling
150(3)
3.5.3 Capacitance parasitic suppression
153(1)
3.6 Conclusion
154(3)
Chapter 4 On-board Power Management DC/DC Inductive Converter
157(22)
Benoit Labbe
Bruno Allard
4.1 Specifications
157(4)
4.1.1 Load-related requirements
158(1)
4.1.2 System-related requirements
159(2)
4.1.3 Power delivery network
161(1)
4.2 Current-mode sliding-mode control implementation
161(13)
4.2.1 System analysis: voltage regulation loops
162(5)
4.2.2 System analysis: loop delay control
167(1)
4.2.3 System analysis: switching frequency control
168(1)
4.2.4 Design
169(3)
4.2.5 Results
172(2)
4.3 Conclusions
174(5)
Chapter 5 On-Chip Power Management DC/DC Switched-Capacitor Converter
179(34)
Gael Pillonnet
Thomas Souvignet
Bruno Allard
5.1 Topology description
180(10)
5.1.1 Ratio calculation
180(2)
5.1.2 Basic scheme
182(1)
5.1.3 Steady-state modeling
183(7)
5.2 Pros and cons
190(3)
5.2.1 Key advantages
190(2)
5.2.2 Main disadvantages
192(1)
5.3 State-of-the-art
193(11)
5.3.1 Research scope and main focus
194(1)
5.3.2 Integration level
194(1)
5.3.3 The point-of-load (POL) application
195(9)
5.4 Design example
204(9)
5.4.1 Landscape of demonstrated solutions
204(3)
5.4.2 Selected architecture
207(6)
Chapter 6 High-Switching Frequency Inductive DC/DC Converters
213(36)
Christian Martin
Florian Neveu
Bruno Allard
6.1 Context and topologies
214(11)
6.1.1 Discussion on figures of merit
219(5)
6.1.2 Outstanding state-of-the-art performances
224(1)
6.2 Cascode power stage
225(4)
6.3 High-quality decoupling
229(3)
6.4 Design considerations for passive components
232(3)
6.5 Integrated inductor characterization
235(11)
6.5.1 Harmonic characterization
235(2)
6.5.2 Time-domain characterization
237(5)
6.5.3 Converter experimental characterization
242(4)
6.6 Conclusion
246(1)
6.7 Acknowledgments
247(2)
Chapter 7 Hybrid and Multi-level Converter Topologies for On-Chip Implementation of Reduced Voltage-Swing Converters
249(36)
Aleksandar Prodic
Sheikh Mohammad Ahsanuzzaman
Behzad Mahdavikhah
Timothy McRae
7.1 Introduction
249(5)
7.1.1 Inductor volume reduction through voltage swing minimization
251(3)
7.2 Cascaded hybrid SC-inductive topologies
254(8)
7.2.1 Merged switched-capacitor multi-phase buck (MSCB) converter
255(7)
7.3 Hybrid serial input/output converters
262(7)
7.3.1 HSI/O power processing efficiency and power division
265(2)
7.3.2 Switched-capacitor conversion ratio
267(2)
73.3 Passive volume and switch voltage stress
269(1)
7.4 An on-chip integrated high-density power management solution for portable applications based on a multi-output switched-capacitor circuit
270(9)
7.5 Multi-level and flying capacitor multi-level converters
279(3)
7.6 Conclusion
282(3)
Bibliography 285(26)
List of Acronyms 311(4)
List of Authors 315(2)
Index 317
Bruno ALLARD, Professor, Electrical Engineering at INSA Lyon and researcher at Ampere-lab, at INSA Lyon, France.
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