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  • Formaat: 1000 pages
  • Ilmumisaeg: 22-May-2007
  • Kirjastus: McGraw-Hill Professional
  • Keel: eng
  • ISBN-13: 9780071510790
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Printed Circuits HandbookSuurem pilt
  • Formaat: 1000 pages
  • Ilmumisaeg: 22-May-2007
  • Kirjastus: McGraw-Hill Professional
  • Keel: eng
  • ISBN-13: 9780071510790
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The World's #1 Guide to Printed Circuit Boards_Now Completely Updated with the Latest Information on Lead-Free Manufacturing! The best reference in the field for over 30 years, the Printed Circuits Handbook equips you with definitive coverage of every facet of printed circuit assemblies_from design methods to fabrication processes. Now completely revised and updated, the Sixth Edition presents the latest information on lead-free manufacturing, including lead-free PCB design and fabrication techniques, lead-free materials, and lead-free reliability models. The new edition also explores best practices for High Density Interconnect (HDI), as well as flexible printed circuits. Written by a team of experts from around the world, the Sixth Edition of this renowned handbook contains cutting-edge material on engineering and design of printed circuits fabrication methods!assembly processes! solders and soldering!test and repair!waste minimization and treatment !quality and reliability of printed circuit processes!and much more. The updated Printed Circuits Handbook provides you with: Unsurpassed guidance on printed circuits_from design to manufacturing Over 500 illustrations, charts, and tables for quick access to essential data New to this edition: New coverage of lead-free PCB design and manufacturing techniques, lead-free materials, lead-free reliability models, best practices for High Density Interconnect (HDI), and flexible printed circuits Inside This State-of-the-Art Printed Circuits Guide / Introduction to Printed Circuits / Engineering and Design of Printed Circuits Fabrication Processes / Assembly Processes / Solders and Soldering / Test and Repair / Waste Minimization and Treatment / Quality and Reliability of Printed Circuit Processes / Flexible Circuits
List of Contributors
xxi
Preface xxiii
Part 1 Lead-Free Legislation
Legislation and Impact on Printed Circuits
3(1)
Legislation Overview
3(1)
Waste Electrical and Electronic Equipment (WEEE)
3(1)
Restriction of Hazardous Substances (RoHS)
3(3)
RoHS' Impact on the Printed Circuit Industry
6(4)
Lead-Free perspecives
10(1)
Other Legislative Initiatives
10
Part 2 Printed Circuit Technology Drivers
Electronic Packaging and High-Density Interconnectivity
3
Introduction
3(1)
Measuring the Interconnectivity Revolution (HDI)
3(3)
Hierarchy of Interconnections
6(1)
Factors Affecting Selection of Interconnections
7(3)
ICS and Packages
10(4)
Density Evaluations
14(2)
Methods to Increase PWB Density
16
References
21
Semiconductor Packaging Technology
1(1)
Introduction
1(4)
Single-Chip Packaging
5(10)
Multichip Packages
15(3)
Optical Interconnects
18(3)
High-Density/High-Performance Packaging Summary
21(1)
Roadmap Information
21
References
21
Advanced Component Packaging
1(1)
Introduction
1(1)
Lead-Free
2(1)
System-on-a-Chip (SOC) versus System-on-a-Package (SOP)
3(2)
Multichip Modules
5(1)
Multichip Packaging
6(4)
Enabling Technologies
10(8)
Acknowledgment
18
References
18
Types of Printed Wiring Boards
1(2)
Introduction
1(1)
Classification of Printed Wiring Boards
1(2)
Organic and Nonorganic Substrates
3(1)
Graphical and Discrete-Wire Boards
3(2)
Rigid and Flexible Boards
5(1)
Graphically Produced Boards
6(4)
Molded Interconnection Devices
10(1)
Plated-Through-Hole (PTH) Technologies
10(3)
Summary
13
References
14
Part 3 Materials
Introduction to Base Materials
3
Introduction
1(2)
Grades and Specifications
3(6)
Properties Used to Classify Base Materials
9(4)
Types of FR-4
13(1)
Laminate Identification Scheme
14(4)
Prepreg Identification Scheme
18(1)
Laminate and Prepreg Manufacturing Processes
18
References
24
Base Material Components
1(1)
Introduction
1(1)
Epoxy Resin Systems
1(4)
Other Resin Systems
5(2)
Additives
7(5)
Reinforcements
12(6)
Conductive Materials
18
References
25
Properties of Base Materials
1(1)
Introduction
1(1)
Thermal, Physical, and Mechanical Properties
1(12)
Electrical Properties
13
References
16
Base Materials Performance Issues
1(1)
Introduction
1(1)
Methods of Increasing Circuit Density
2(1)
Copper foil
2(5)
Laminate Constructions
7(2)
Prepreg Options and Yield-Per-Ply Values
9(1)
Dimensional Stability
10(3)
High-Density Interconnect/Microvia Materials
13(2)
CAF Growth
15(7)
Electrical Performance
22
References
33
The Impact of Lead-Free Assembly on Base Materials
1(1)
Introduction
1(1)
Rohs Basics
1(1)
Base Material Compatibility Issues
2(2)
The Impact of Lead-Free Assembly on Base Material Components
4(1)
Critical Base Material Properties
4(14)
Impact on Printed Circuit Reliability and Material Selection
18(3)
Summary
21
References
22
Selecting Base Materials for Lead-Free Assembly Applications
1(1)
Introduction
1(1)
Pcb fabrication and Assembly Interactions
1(5)
Selecting the Right Base Material for Specific Application
6(8)
Example Application of this Tool
14(1)
Discussion of the Range of Peak Temperatures for Lead-Free Assembly
15(1)
Lead-Free Applications and Ipc-4101 Specification Sheets
15(1)
Additional Base material Options for Lead-Free Applications
16(1)
Summary
17
References
18
Laminate Qualification and Testing
1(2)
Introduction
1(1)
Industry Standards
2(2)
Laminate Test Strategy
4(1)
Initial Tests
5(4)
Full Material Characterization
9(13)
Characterization Test Plan
22(1)
Manufacturability in the Shop
23
Part 4 Engineering and Design
Physical Characteristics of the PCB
3
Classes of PCB Designs
3(6)
Types of PCBs or Packages for Electronic Circuits
9(5)
Methods of Attaching Components
14(1)
Component Package Types
15(1)
Materials Choices
15(7)
Fabrication Methods
22(2)
Choosing a Package Type and Fabrication Vendor
24
The PCB Design Process
1(1)
Objective of the PCB Design Process
1(1)
Design Processes
1(5)
Design Tools
6(4)
Selecting a Set of Design Tools
10(1)
Interfacing Cae, Cad, and Cam Tools to Each Other
11(1)
Inputs to the Design Process
11
Electrical and Mechanical Design Parameters
1(1)
Printed Circuit Design Requirements
1(1)
Introduction to Electrical Signal Integrity
1(2)
Introduction to Electromagnetic Compatibility
3(1)
Noise Budget
4(1)
Designing for Signal Integrity and Electromagnetic Compatibility
4(5)
Mechanical Design Requirements
9
References
17
Current Carrying Capacity in Printed Circuits
1(1)
Introduction
1(1)
Conductor (Trace) Sizing Charts
1(1)
Current Carrying Capacity
2(4)
Charts
6(4)
Baseline Charts
10(9)
Odd-Shaped Geometries and the ``Swiss Cheese'' Effect
19(1)
Copper Thickness
20
References
21
PCB Design for Thermal Performance
1(1)
Introduction
1(1)
The PCB as a Heat Sink Soldered to the Component
2(1)
Optimizing the PCB for Thermal Performance
3(9)
Conducting Heat to the Chassis
12(2)
PCB Requirements for High-Power Heat Sink Attach
14(1)
Modeling the Thermal Performance of the PCB
15
References
18
Information Formating and Exchange
1(1)
Introduction to Data Exchange
1(2)
The Data Exchange Process
3(6)
Data Exchange Formats
9(13)
Drivers for Evolution
22(1)
Acknowledgment
23
References
23
Planning for Design, Fabrication, and Assembly
1(1)
Introduction
1(2)
General Considerations
3(1)
New Product Design
4(6)
Layout Trade-off Planning
10(7)
PWB Fabrication Trade-off Planning
17(7)
Assembly Trade-Off Planning
24
References
27
Manufacturing Information, Documentation, and Transfer Including CAM Tooling for Fab and Assembly
1(1)
Introduction
1(1)
Manufacturing Information
2(5)
Initial Design Review
7(8)
Design Input
15(4)
Design Analysis and Review
19(1)
The CAM-Tooling Process
19(12)
Additional Processes
31(1)
Acknowledgment
32
Embedded Components
1(2)
Introduction
1(1)
Definitions and Example
1(1)
Applications and Trade-Offs
2(1)
Designing for Embedded Component Applications
3(3)
Materials
6(3)
Material Supply Types
9
Part 5 High Density Interconnection
Introduction to High-Density Interconnection (HDI) Technology
3
Introduction
3(1)
Definitions
3(4)
HDI Structures
7(4)
Design
11(2)
Dielectric Materials and Coating Methods
13(13)
HDI Manufacturing Processes
26
References
34(1)
Bibliography-Additional Reading
35
Advanced High-Density Interconnection (HDI) Technologies
1(2)
Introduction
1(1)
Definitions of HDI Process Factors
1(2)
HDI Fabrication Processes
3(30)
Next-Generation HDI Processes
33
References
37
Part 6 Fabrication
Drilling Processes
3
Introduction
3(1)
Materials
4(7)
Machines
11(4)
Methods
15(3)
Hole Quality
18(2)
Postdrilling Inspection
20(1)
Drilling Cost Per Hole
20
Precision Interconnect Drilling
1(1)
Introduction
1(1)
Factors Affecting High-Density Drilling
1(1)
Laser versus Mechanical
2(3)
Factors Affecting High-Density Drilling
5(5)
Depth-Controlled Drilling Methods
10(1)
High-Aspect-Ratio Drilling
10(3)
Innerlayer Inspection of Multilayer Boards
13
Imaging
1(1)
Introduction
1(1)
Photosensitive Materials
2(2)
Dry-Film Resists
4(3)
Liquid Photoresists
7(1)
Electrophoretic Depositable Photoresists
8(1)
Resist Processing
8(19)
Design for Manufacturing
27
References
29
Multilayer Materials and Processing
1(1)
Introduction
1(1)
Printed Wiring Board Materials
2(14)
Multilayer Construction Types
16(21)
ML-PWB Processing and Flows
37(14)
Lamination Process
51(8)
Lamination Process Control and Troubleshooting
59(4)
Lamination Overview
63(1)
ML-PWB Summary
63
References
63
Preparing Boards for Plating
1(1)
Introduction
1(1)
Process Decisions
1(2)
Process Feedwater
3(1)
Multilayer PTH Preprocessing
4(4)
Electroless Copper
8(3)
Acknowledgment
11
References
11
Electroplating
1(1)
Introduction
1(1)
Electroplating Basics
1(1)
High-Aspect Ratio Hole and Microvia Plating
2(2)
Horizontal Electroplating
4(2)
Copper Electroplating General Issues
6(8)
Acid Copper Sulfate Solutions and Operation
14(5)
Solder (Tin-Lead) Electroplating
19(2)
Tin Electroplating
21(2)
Nickel Electroplating
23(2)
Gold Electroplating
25(3)
Platinum Metals
28(1)
Silver Electroplating
29(1)
Laboratory Process control
29(2)
Acknowledgment
31
References
31
Direct Plating
1(1)
Direct Metallization Technology
1(1)
References
1(1)
PWB Manufacture Using Fully Electroless Copper
1(1)
Fully Electroless Plating
1(1)
The Additive Process and its Variations
2(1)
Pattern-Plating Additive
2(5)
Panel-Plate Additive
7(1)
Partly Additive
8(1)
Chemistry of Electroless Plating
9(3)
Fully Electroless Plating Issues
12
References
14
Printed Circuit Board Surface Finishes
1(1)
Introduction
1(2)
Alternative Finishes
3(1)
Hot Air Solder Level (Hasl or Hal)
4(2)
Electroless Nickel Immersion Gold (ENIG)
6(2)
Organic Solderability Preservative (OSP)
8(2)
Immersion Silver
10(1)
Immersion Tin
11(2)
Other Surface Finishes
13(1)
Assembly Compatibility
14(3)
Reliability Test Methods
17(1)
Special Topics
18(1)
Failure Modes
19(4)
Comparing Surface Finish Properties
23
References
23
Solder Mask
1(1)
Introduction
1(1)
Trends and Challenges for Solder Mask
2(1)
Types of Solder Mask
3(1)
Solder Mask Selection
4(5)
Solder Mask Application and Processing
9(9)
VIA Protection
18(1)
Solder Mask Final Properties
19(1)
Legend and Marking (Nomenclature)
19
Etching Process and Technologies
1(1)
Introduction
1(1)
General Etching Considerations and Procedures
2(2)
Resist Removal
4(2)
Etching Solutions
6(12)
Other Materials for Board Construction
18(1)
Metals Other than Copper
19(1)
Basics of Etched Line Formation
20(6)
Equipment and Techniques
26
References
29
Machining and Routing
1(2)
Introduction
1(1)
Punching Holes (Piercing)
1(2)
Blanking, Shearing, and Cutting of Copper-Clad Laminates
3(3)
Routing
6(7)
Scoring
13(2)
Acknowledgment
15
Part 7 Bare Board Test
Bare Board Test Objectives and Definitions
3
Introduction
3(1)
The Impact of HDI
3(1)
Why Test?
4(2)
Circuit Board Faults
6
Bare Board Test Methods
1(1)
Introduction
1(1)
Nonelectrical Testing Methods
1(1)
Basic Electrical Testing Methods
2(7)
Specialized Electrical Testing Methods
9(4)
Data and Fixture Preparation
13(7)
Combined Testing Methods
20
Bare Board Test Equipment
1(1)
Introduction
1(1)
System Alternatives
1(2)
Universal Grid Systems
3(14)
Flying-Probe/Moving-Probe Test Systems
17(4)
Verification and Repair
21(1)
Test Department Planning and Management
22
HDI Bare Board Special Testing Methods
1(2)
Introduction
1(1)
Fine-Pitch Tilt-Pin Fixtures
2(1)
Bending Beam Fixtures
3(1)
Flying Probe
3(1)
Coupled Plate
3(1)
Shorting Plate
4(1)
Conductive Rubber Fixtures
5(1)
Optical Inspection
5(1)
Noncontact Test Methods
5(2)
Combinational Test Methods
7
Part 8 Assembly
Assembly Processes
3
Introduction
3(2)
Through-Hole Technology
5(11)
Surface-Mount Technology
16(26)
Odd-Form Component Assembly
42(6)
Process Control
48(6)
Process Equipment Selection
54(3)
Repair and Rework
57(7)
Conformal Coating, Encapsulation, and Underfill Materials
64(2)
Acknowledgment
66
Conformal Coating
1(2)
Introduction
1(2)
Types of Conformal Coatings
3(3)
Product Preparation
6(1)
Application Processes
7(4)
Cure, Inspection, and Finishing
11(2)
Repair Methods
13(1)
Design for Conformal Coating
14
References
17
Part 9 Solderability Technology
Solderability: Incoming Inspection and Wet Balance Technique
3
Introduction
3(1)
Solderability
4(4)
Solderability Testing---a Scientific Approach
8(5)
The Influence of Temperature on Test Results
13(1)
Interpreting the Results: Wetting Balance Solderability Testing
14(1)
Globule Testing
15(1)
PCB Surface Finishes and Solderability Testing
16(6)
Component Solderability
22
Fluxes and Cleaning
1(2)
Introduction
1(1)
Assembly Process
2(1)
Surface Finishes
3(2)
Soldering Flux
5(1)
Flux Form Versus Soldering Process
6(1)
Rosin Flux
7(1)
Water-Soluble Flux
8(1)
Low Solids Flux
9(1)
Cleaning Issues
10(2)
Summary
12
References
12
Part 10 Solder Materials and Processes
Soldering Fundamentals
3
Introduction
3(1)
Elements of a Solder Joint
4(1)
The Solder Connection to the Circuit Board
4(1)
The solder Connection to the Electrical Component
5(1)
Common Metal-Joining Methods
5(4)
Solder Overview
9(1)
Soldering Basics
9
Soldering Materials and Metallurgy
1(1)
Introduction
1(1)
Solders
2(2)
Solder Alloys and Corrosion
4(1)
PB-Free Solders: Search for Alternatives and Implications
5(1)
PB-Free Elemental Alloy Candidates
5(6)
Board Surface Finishes
11
References
19
Solder Fluxes
1(1)
Introduction to Fluxes
1(1)
Flux Activity and Attributes
2(1)
Flux: Ideal Versus Reality
3(1)
Flux Types
4(1)
Water-Clean (Aqueous) Fluxes
4(3)
No-Clean Flux
7(2)
Other Fluxing Caveats
9(3)
Soldering Atmospheres
12
References
15
Soldering Techniques
1(1)
Introduction
1(1)
Mass Soldering Methods
1(1)
Oven Reflow Soldering
1(27)
Wave Soldering
28(11)
Wave Solder Defects
39(3)
Vapor-Phase Reflow Soldering
42(1)
Laser Reflow Soldering
43(7)
Tooling and the Need for Coplanarity and Intimate Contact
50(3)
Additional Information Sources
53(1)
Hot-Bar Soldering
53(5)
Hot-Gas Soldering
58(1)
Ultrasonic Soldering
59
References
61
Soldering Repair and Rework
1(2)
Introduction
1(1)
Hot-Gas Repair
1(4)
Manual Solder Fountain
5(1)
Automated Solder Fountain
6(1)
Laser
6(1)
Considerations for Repair
6
Reference
7
Part 11 Nonsolder Interconnection
Press-Fit Interconnection
3
Introduction
3(1)
The Rise of Press-Fit Technology
3(1)
Compliant Pin Configurations
4(2)
Press-Fit Considerations
6(1)
Press-Fit Pin Materials
7(1)
Surface Finishes and Effects
8(2)
Equipment
10(1)
Assembly Process
11(1)
Press Routines
12(2)
PWB Design and Board Procurement Tips
14(1)
Press-Fit Process Tips
15(1)
Inspection and Testing
16(1)
Soldering and Press-Fit Pins
17
References
17
Land Grid Array Interconnect
1(2)
Introduction
1(1)
LGA and the Environment
1(1)
Elements of the LGA System
2(3)
Assembly
5(2)
Printed Circuit Assembly (PCA) Rework
7(1)
Design Guidelines
8
Reference
8
Part 12 Quality
Acceptability and Quality of Fabricated Boards
3
Introduction
3(1)
Specific Quality and Acceptability Criteria by PCB Type
4(2)
Methods for Verification of Acceptability
6(1)
Inspection Lot Formation
7(1)
Inspections Categories
8(1)
Acceptability and Quality After Simulated Solder Cycle(s)
8(2)
Nonconforming PCBS and Material Review Board (MRB) Function
10(1)
The Cost of the Assembled PCB
11(1)
How to Develop Acceptability and Quality Criteria
11(2)
Class of Service
13(1)
Inspection Criteria
13(19)
Reliability Inspection Using Accelerated Environmental Exposure
32
Acceptability of Printed Circuit Board Assemblies
1(1)
Understanding Customer Requirements
1(6)
Handling to Protect the PCBA
7(3)
PCBA Hardware Acceptability Considerations
10(5)
Component Installation or Placement Requirements
15(10)
Component and PCB Solderability Requirements
25(1)
Solder-Related Defects
25(7)
PCBA Laminate Condition, Cleanliness, and Marking Requirements
32(2)
PCBA Coatings
34(1)
Solderless Wrapping of Wire to Posts (Wire Wrap)
35(2)
PCBA Modifications
37
References
39
Assembly Inspection
1(1)
Introduction
1(2)
Definition of Defects, Faults, Process Indicators, and Potential Defects
3(1)
Reasons for Inspection
4(2)
Lead-Free Impact on Inspection
6(2)
Miniaturization and Higher Complexity
8(1)
Visual Inspection
8(4)
Automated Inspection
12(2)
Three-Dimensional Automated Solder Paste Inspection
14(2)
PRE-Reflow Aoi
16(1)
Post-Reflow Automated Inspection
17(6)
Implementation of Inspection Systems
23(1)
Design Implications of Inspection Systems
24
References
25
Design for Testing
1(1)
Introduction
1(1)
Definitions
2(1)
AD HOC Design for Testability
2(2)
Structured Design for Testability
4(1)
Standards-Based Testing
5
References
12
Loaded Board Testing
1(2)
Introduction
1(1)
The process of Test
1(3)
Definitions
4(3)
Testing Approaches
7(4)
In-Circuit Test Techniques
11(6)
Alternatives to Conventional Electrical Tests
17(2)
Tester Comparison
19
References
20
Part 13 Reliability
Conductive Anodic Filament Formation
3
Introduction
3(1)
Understanding Caf Formation
3(4)
Electrochemical Migration and Formation of Caf
7(3)
Factors that Affect Caf Formation
10(4)
Test Method for Caf-Resistant Materials
14(1)
Manufacturing Tolerance Considerations
14
References
15
Reliability of Printed Circuit Assemblies
1(1)
Fundamentals of Reliability
2(2)
Failure Mechanisms of PCBS and Their Interconnects
4(15)
Influence of Design on Reliability
19(1)
Impact of PCB Fabrication and Assembly on Reliability
20(7)
Influence of Materials Selection on Reliability
27(9)
Burn-in, Acceptance Testing, and Accelerated Reliability Testing
36(9)
Summary
45
References
45(2)
Further Reading
47
Component-to-PWB Reliability: The Impact of Design Variables and Lead Free
1(1)
Introduction
1(1)
Packaging Challenges
2(3)
Variables that Impact Reliability
5
References
30
Component-to-PWB Reliability: Estimating Solder-Joint Reliability and the Impact of Lead-Free Solders
1(2)
Introduction
1(2)
Thermomechanical Reliability
3(17)
Mechanical Reliability
20(7)
Finite Element Analysis (FEA)
27
References
35
Part 14 Environmental Issues
Process Waste Minimization and Treatment
3(1)
Introduction
3(1)
Regulatory Compliance
3(2)
Major Sources and Amounts of Wastewater in a Printed Circuit Board Fabrication Facility
5(1)
Waste Minimization
6(2)
Pollution Prevention Techniques
8(7)
Recycling and Recovery Techniques
15(3)
Alternative Treatments
18(3)
Chemical Treatment Systems
21(5)
Advantages and Disadvantages of Various Treatment Alternatives
26
Part 15 Flexible Circuits
Flexible Circuit Applications and Materials
3
Introduction to Flexible Circuits
3(3)
Applications of Flexible Circuits
6(1)
High-Density Flexible Circuits
6(2)
Materials for Flexible Circuits
8(1)
Substrate Material Properties
9(4)
Conductor Materials
13(1)
Copper-Clad Laminates
14(5)
Coverlay Material
19(3)
Stiffener Materials
22(1)
Adhesive materials
22(1)
Restriction of Hazardous Substances (ROHS) Issues
23
Design of Flexible Circuits
1(1)
Introduction
1(1)
Design Procedure
1(1)
Types of Flexible Circuits
2(10)
Circuit Designs for Flexibility
12(3)
Electrical Design of the Circuits
15(1)
Circuit Designs for Higher Reliability
16(1)
Circuit Designs for Rohs Compliance
17
Manufacturing of Flexible Circuits
1(1)
Introduction
1(1)
Special Issues with HDI Flexible Circuits
1(2)
Basic Process Elements
3(11)
New Processes for Fine Traces
14(10)
Coverlay Processes
24(6)
Surface Treatment
30(1)
Blanking
31(2)
Stiffener Processes
33(1)
Packaging
33(1)
Roll-to-Roll Manufacturing
34(2)
Dimension Control
36
Termination of Flexible Circuits
1(1)
Introduction
1(1)
Selection of Termination Technologies
1(3)
Permanent Connections
4(7)
Semipermanent Connections
11(2)
Nonpermanent Connections
13(7)
High-Density Flexible Circuit Termination
20
Multilayer Flex and Rigid/Flex
1(1)
Introduction
1(1)
Multilayer Rigid/flex
1(1)
Special Constructions of Flexible Circuits
1(1)
Introduction
1(1)
Flying-Lead Construction
1(7)
Tape Automated Bonding
8(2)
Microbump Arrays
10(2)
Thick-Film Conductor Flex Circuits
12(1)
Shielding of the Flexible Cables
13(1)
Functional Flexible Circuits
14
Quality Assurance of Flexible Circuits
1(1)
Introduction
1(1)
Basic Concepts in Flexible Circuit Quality Assurance
1(1)
Automatic Optical Inspection Systems
2(1)
Dimensional Measurements
3(1)
Electrical Tests
3(1)
Inspection Sequence
3(3)
Raw Materials
6(1)
Flexible Circuit Feature Inspection
6(2)
Standards and Specifications for Flexible Circuits
8
Appendix 1(1)
Glossary 1(1)
Index 1


Clyde F. Coombs, Jr. (Los Altos, CA) recently retired from Hewlett-Packard. He is the editor of all five editions of the Printed Circuits Handbook, the first of which was published in 1967. He is also the editor of two editions of the Electronic Instrument Handbook.
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