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E-raamat: Printed Circuits Handbook, Seventh Edition

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  • Ilmumisaeg: 15-Feb-2016
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  • Keel: eng
  • ISBN-13: 9780071833967
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Printed Circuits Handbook, Seventh EditionSuurem pilt
  • Formaat: 1504 pages
  • Ilmumisaeg: 15-Feb-2016
  • Kirjastus: McGraw-Hill Inc.,US
  • Keel: eng
  • ISBN-13: 9780071833967
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The Most Complete and Widely Used Guide to Printed Circuits, Now Updated and Thoroughly Revised

The Printed Circuits Handbook has served as the definitive source for coverage of every facet of printed circuit boards and assemblies for 50 years. And now, for the first time anywhere, the new edition of this essential guide provides time-saving tools for success in the area of printed circuit supply chain management, including an entire new section on the elements of design, supplier identification and qualification, process control, product acceptance processes, and quality and reliability specification and assurance. Written by a team of experts from around the world, this encyclopedic resource has been thoroughly revised and expanded to include the latest printed circuit tools and technologies from design to fabrication. Hundreds of illustrations and charts demonstrate key concepts, and valuable tables provide quick and easy access to essential information.





This new edition of the most trusted guide to printed circuits includes: Introduction to Printed Circuits Supply Chain Management Lead-Free Materials and Processes Engineering and Design of Printed Circuits Base Materials for All Applications Fabrication Processes High Density Interconnection Bare Board Testing Assembly Processes Soldering Materials and Processes Non-Solder Interconnection Quality Specification and Assessment Reliability Prediction and Assessment Assembly Testing Repair and Rework Flexible Circuits And Much More
Contributors xxi
Preface xxiii
Part 1 Printed Circuit Technology Drivers
Chapter 1 Electronic Packaging and High-Density interconnectivity
3(16)
Clyde F. Coombs Jr
Happy T. Holden
1.1 Introduction
3(1)
1.2 Measuring the Interconnectivity Revolution
3(3)
1.3 Hierarchy of Interconnections
6(1)
1.4 Factors Affecting Selection of Interconnections
7(2)
1.5 ICs and Packages
9(1)
1.6 Density Evaluations
10(3)
1.7 Methods to Increase PWB Density
13(5)
1.8 References
18(1)
Chapter 2 Types of Printed Wiring Boards
19(14)
Hayao Nakahara
2.1 Introduction
19(1)
2.2 Classification of Printed Wiring Boards
19(2)
2.3 Organic and Nonorganic Substrates
21(1)
2.4 Graphical and Discrete-Wire Boards
21(1)
2.5 Rigid and Flexible Boards
22(1)
2.6 Graphically Produced Boards
22(5)
2.7 Molded Interconnection Devices
27(1)
2.8 Plated-Through-Hole Technologies
27(3)
2.9 Summary
30(1)
2.10 References
30(3)
Part 2 Managing the Printed Circuit Supply Chain
Chapter 3 Basics of Printed Circuit Supply Chain Management
33(10)
Tim Rodgers
3.1 Introduction
33(1)
3.2 General Business Considerations
34(1)
3.3 Contract Manufacturers
35(1)
3.4 Criteria for Evaluating Suppliers
35(6)
3.5 Supplier Selection Criteria Example
41(2)
Chapter 4 Design for Manufacturability
43(20)
Tim Rodgers
4.1 General Principles
43(1)
4.2 PCB PCA Pricing Models
44(5)
4.3 Process Cost Drivers
49(2)
4.4 Production Yield and Design for Manufacturability
51(8)
4.5 DFM Complexity Models
59(4)
Chapter 5 Manufacturing Information, Documentation, Formatting, and Exchange
63(38)
Happy T. Holden
5.1 Introduction
63(1)
5.2 Manufacturing Information
64(4)
5.3 Fabrication Information Exchange
68(5)
5.4 Data Exchange Formats
73(13)
5.5 Initial Design Review
86(8)
5.6 Design Input
94(5)
5.7 Design Analysis and Review
99(1)
5.8 Acknowledgments
99(1)
5.9 References
100(1)
Chapter 6 Supplier Selection and Qualification
101(16)
Tim Rodgers
6.1 Introduction
101(1)
6.2 Evaluating Suppliers
102(11)
6.3 Supplier Selection
113(1)
6.4 Supplier Qualification
114(3)
Chapter 7 Process Control, Monitoring, and Incoming inspection
117(42)
Tim Rodgers
7.1 Introduction
117(1)
7.2 Process Capability and Process Control
117(5)
7.3 Process Monitoring and Troubleshooting
122(1)
7.4 Assessing a PCB Fabricators Capability
122(34)
7.5 Testing and Inspection
156(2)
7.6 Incoming Inspection
158(1)
Chapter 8 Product Acceptance and Feedback
159(12)
Tim Rodgers
8.1 Introduction
159(1)
8.2 Design Qualification
159(1)
8.3 Incoming Inspection and Lot Acceptance
160(2)
8.4 Supplier Performance Management
162(3)
8.5 Business Reviews
165(2)
8.6 Strategic Supplier Management
167(4)
Part 3 Materials
Chapter 9 Introduction to Base Materials
171(26)
Edward Kelley
Douglas Trobough
9.1 Introduction
171(1)
9.2 Grades and Specifications
171(7)
9.3 Properties Used to Classify Base Materials
178(6)
9.4 Types of FR-4
184(1)
9.5 Laminate Identification Scheme
185(1)
9.6 Prepreg Identification Scheme
186(3)
9.7 Laminate and Prepreg Manufacturing Processes
189(6)
9.8 References
195(2)
Chapter 10 Base Material Components
197(28)
Edward Kelley
Douglas Trobough
10.1 Introduction
197(4)
10.2 Other Resin Systems
201(2)
10.3 Legislative Issues
203(4)
10.4 Additives
207(2)
10.5 Reinforcements
209(8)
10.6 Conductive Materials
217(7)
10.7 References
224(1)
Chapter 11 Properties of Base Materials
225(16)
Edward Kelley
Douglas Trobough
11.1 Introduction
225(1)
11.2 Thermal, Physical, and Mechanical Properties
225(11)
11.3 Electrical Properties
236(4)
11.4 Other Test Methods
240(1)
11.5 References
240(1)
Chapter 12 Base Material Performance in PCBs
241(32)
Edward Kelley
Douglas Trobough
12.1 Introduction
241(1)
12.2 Methods of Increasing Circuit Density
241(1)
12.3 Copper Foil
242(5)
12.4 Laminate Constructions
247(1)
12.5 Prepreg Options and Yield-per-Ply Values
248(1)
12.6 Dimensional Stability
249(1)
12.7 High-Density Interconnect Microvia Materials
250(2)
12.8 Conductive Anodic Filament Growth
252(6)
12.9 Electrical Performance
258(10)
12.10 Electrical Performance of Lower Dk Df Lead-Free Compatible Materials
268(1)
12.11 Resin and Glass Micro-Dk Effects
268(4)
12.12 References
272(1)
Chapter 13 The Impact of Lead-Free Assembly on Base Materials
273(20)
Edward Kelley
Douglas Trobough
13.1 Introduction
273(1)
13.2 RoHS Basics
273(1)
13.3 Base Material Compatibility Issues
274(2)
13.4 The Impact of Lead-Free Assembly on Base Material Components
276(1)
13.5 Critical Base Material Properties
276(12)
13.6 Impact on Printed Circuit Reliability and Material Selection
288(4)
13.7 Summary
292(1)
13.8 Further Reading
292(1)
Chapter 14 Selecting Base Materials
293(24)
Edward Kelley
Douglas Trobough
14.1 Introduction
293(1)
14.2 Selecting Materials for Thermal Reliability
293(5)
14.3 Selecting a Base Material for Thermal Reliability
298(6)
14.4 Selecting Materials for Electrical Performance
304(5)
14.5 CAF Resistance
309(6)
14.6 References
315(2)
Chapter 15 Laminate Qualification and Testing
317(24)
Michael Roesch
Sylvia Ehrler
15.1 Introduction
317(1)
15.2 Industry Standards
318(1)
15.3 Laminate Test Strategy
319(2)
15.4 Initial Tests
321(3)
15.5 Full Material Characterization
324(11)
15.6 Characterization Test Plan
335(2)
15.7 Manufacturability in the Shop
337(4)
Part 4 Engineering and Design
Chapter 16 Planning for Design, Fabrication, and Assembly
341(24)
Happy T. Holden
16.1 Introduction
341(1)
16.2 General Considerations
342(1)
16.3 New Product Design
343(3)
16.4 Specification: Capture of System Description
346(3)
16.5 Layout Trade-Off Planning
349(6)
16.6 PWB Fabrication Trade-Off Planning
355(7)
16.7 Assembly Trade-Off Planning
362(2)
16.8 References
364(1)
Chapter 17 Physical Characteristics of the PCB
365(8)
Lee W. Ritchey
17.1 Introduction
365(1)
17.2 Types of PCBs or Substrates
366(3)
17.3 Methods of Attaching Components
369(1)
17.4 Component Package Types
369(2)
17.5 Materials Choices
371(1)
17.6 Fabrication Methods
372(1)
Chapter 18 Electronic Design Automation and Printed Circuit Design Tools
373(12)
Andy Shaughnessy
18.1 Description of PCB Design Tools
373(1)
18.2 Using PCB Design Tools
374(2)
18.3 Major PCB Design Tools
376(2)
18.4 Lower-Cost PCB Design Tools
378(1)
18.5 Free PCB Design Tools
379(2)
18.6 Signal Integrity and EMC Tools
381(2)
18.7 Key Questions to Consider
383(1)
18.8 Further Reading
383(2)
Chapter 19 The PCB Design Process
385(10)
Lee W. Ritchey
19.1 Introduction
385(2)
19.2 The Virtual Prototyping Process
387(7)
19.3 Making the Conversion from Hardware Prototyping to Virtual Prototyping
394(1)
Chapter 20 Electrical and Mechanical Design Parameters
395(48)
Bill Hargin
Mark I. Montrose
20.1 Electrical and Mechanical Design Parameters Overview
395(1)
20.2 Introduction to Digital Signal Integrity
396(10)
20.3 Which Nets to Terminate and What Type of Termination to Use
406(9)
20.4 Introduction to Differential Signaling
415(4)
20.5 Introduction to Power Integrity
419(7)
20.6 Introduction to Electromagnetic Compatibility
426(8)
20.7 Introduction to Mechanical Design Requirements
434(4)
20.8 Types of Edge Mounting for Circuit Boards
438(3)
20.9 Acknowledgments
441(1)
20.10 References
441(2)
Chapter 21 The Basics of Printed Circuit Board Design
443(26)
Susy Webb
21.1 Software Selection
443(1)
21.2 Standards
443(2)
21.3 The Schematic
445(1)
21.4 Parts
446(2)
21.5 Padstacks
448(1)
21.6 Starting a New Board
449(4)
21.7 Placement
453(3)
21.8 Planes
456(1)
21.9 Stackup
457(1)
21.10 Routing
458(6)
21.11 Finishing
464(2)
21.12 Saving
466(1)
21.13 Conclusion
466(3)
Chapter 22 Current Carrying Capacity in Printed Circuits
469(12)
Mike Jouppi
22.1 Introduction
469(1)
22.2 Conductor (Trace) Sizing Charts
470(3)
22.3 Baseline Charts
473(7)
22.4 Summary
480(1)
22.5 References
480(1)
Chapter 23 PCB Design for Thermal Performance
481(18)
Mike Jouppi
23.1 Introduction
481(1)
23.2 The PCB as a Heat Sink Soldered to the Component
482(1)
23.3 Optimizing the PCB for Thermal Performance
482(8)
23.4 Conducting Heat to the Chassis
490(2)
23.5 PCB Requirements for High-Power Heat Sink Attach
492(1)
23.6 Modeling the Thermal Performance of the PCB
493(3)
23.7 Heat Sources
496(1)
23.8 Acknowledgment
497(1)
23.9 References
497(2)
Chapter 24 Embedded Components
499(20)
Vern Solberg
24.1 Introduction
499(1)
24.2 Definitions and Example
499(1)
24.3 Applications and Trade-Offs
500(1)
24.4 Designing for Embedded Component Applications
501(4)
24.5 Materials
505(4)
24.6 Material Supply Types
509(6)
24.7 Conclusion
515(1)
24.8 Acknowledgment
515(4)
Part 5 High-Density Interconnection
Chapter 25 Introduction to High-Density Interconnection Technology
519(32)
Happy T. Holden
25.1 Introduction
519(1)
25.2 Definitions
519(4)
25.3 HDI Structures
523(4)
25.4 Design
527(2)
25.5 Dielectric Materials and Coating Methods
529(12)
25.6 HDI Manufacturing Processes
541(8)
25.7 Appendix
549(1)
25.8 References
550(1)
25.9 Further Reading
550(1)
Chapter 26 Advanced High-Density Interconnection Technologies
551(32)
Happy T. Holden
26.1 Introduction
551(1)
26.2 Definitions of HDI Process Factors
551(2)
26.3 HDI Fabrication Processes
553(19)
26.4 Next-Generation HDI Processes
572(6)
26.5 References
578(1)
26.6 Further Reading
579(4)
Part 6 Fabrication
Chapter 27 CAM Tooling for Fab and Assembly
583(18)
Happy T. Holden
27.1 Introduction
583(1)
27.2 Manufacturing Information
583(2)
27.3 Design Analysis and Review
585(1)
27.4 The CAM-Tooling Process
586(11)
27.5 Additional Processes
597(3)
27.6 Acknowledgments
600(1)
Chapter 28 Drilling Processes
601(24)
Matthias Stickel
28.1 Introduction
601(1)
28.2 Materials
602(6)
28.3 Machines
608(4)
28.4 Methods
612(6)
28.5 Hole Quality
618(1)
28.6 Troubleshooting
619(2)
28.7 Postdrilling Inspection
621(1)
28.8 Drilling Cost per Hole
621(3)
28.9 Acknowledgment
624(1)
Chapter 29 Precision Interconnect and Laser Drilling
625(16)
Matthias Stickel
29.1 Introduction
625(1)
29.2 Factors Affecting High-Density Drilling
625(1)
29.3 Laser versus Mechanical
626(3)
29.4 Factors Affecting High-Density Mechanical Drilling
629(4)
29.5 Depth-Controlled Drilling Methods
633(1)
29.6 Controlled Depth Via Drilling
633(4)
29.7 Innerlayer Registration of Multilayer Boards
637(1)
29.8 Laser Drilling
637(2)
29.9 Laser Via Formation
639(1)
29.10 Laser Tool Types
639(1)
29.11 Acknowledgment
640(1)
29.12 Further Reading
640(1)
Chapter 30 Imaging and Automated Optical Inspection
641(30)
Gareth Parry
30.1 Introduction
641(1)
30.2 Photosensitive Materials
641(3)
30.3 Dry-Film Resists
644(2)
30.4 Liquid Photoresists
646(1)
30.5 Electrophoretic Depositable Photoresists
647(1)
30.6 Resist Processing
648(17)
30.7 Design for Manufacturing
665(2)
30.8 Inkjet Imaging
667(1)
30.9 Automatic Optical Inspection
668(1)
30.10 References
668(3)
Chapter 31 Multilayer Materials and Processing
671(38)
C.D. Dupriest
Happy T. Holden
31.1 Introduction
671(1)
31.2 Multilayer Construction Types
672(18)
31.3 ML-PWB Processing and Flows
690(7)
31.4 Lamination Process
697(7)
31.5 Lamination Process Control and Troubleshooting
704(2)
31.6 Lamination Overview
706(1)
31.7 ML-PWB Summary
707(1)
31.8 Acknowledgment
708(1)
31.9 Further Reading
708(1)
Chapter 32 Preparing Boards for Plating
709(12)
Michael Carano
32.1 Introduction
709(1)
32.2 Process Decisions
709(2)
32.3 Process Feedwater
711(2)
32.4 Multilayer PTH Preprocessing
713(4)
32.5 Electroless Copper
717(2)
32.6 Acknowledgments
719(1)
32.7 References
719(2)
Chapter 33 Electroplating
721(22)
George Milad
33.1 Introduction
721(1)
33.2 Electroplating Basics
721(1)
33.3 Acid Copper Electroplating
722(13)
33.4 Tin Electroplating
735(1)
33.5 Nickel Electroplating
736(3)
33.6 Gold Electroplate
739(4)
Chapter 34 Direct Plating
743(12)
Hayao Nakahara
34.1 Direct Metallization Technology
743(10)
34.2 References
753(2)
Chapter 35 Printed Circuit Board Surface Finishes
755(16)
George Milad
35.1 Introduction
755(2)
35.2 PWB Surface Finishes
757(1)
35.3 Hot Air Solder Level
758(1)
35.4 Electroless Nickel Immersion Gold
758(3)
35.5 Nickel Palladium Gold
761(2)
35.6 Organic Solderability Preservatives
763(2)
35.7 Immersion Silver
765(1)
35.8 Immersion Tin
766(1)
35.9 Other Surface Finishes
767(4)
Chapter 36 Solder Mask
771(18)
David A. Vaughan
36.1 Introduction
771(1)
36.2 Trends and Challenges for Solder Mask
772(1)
36.3 Types of Solder Mask
773(1)
36.4 Solder Mask Selection
774(4)
36.5 Solder Mask Application and Processing
778(7)
36.6 Via Protection
785(1)
36.7 Solder Mask Final Properties
786(1)
36.8 Legend and Marking (Nomenclature)
787(2)
Chapter 37 Etching Process and Technologies
789(28)
Gareth Parry
37.1 Introduction
789(1)
37.2 General Etching Considerations and Procedures
790(2)
37.3 Resist Removal
792(1)
37.4 Etching Solutions
793(11)
37.5 Other Materials for Board Construction
804(1)
37.6 Metals Other than Copper
805(1)
37.7 Basics of Etched Line Formation
806(5)
37.8 Equipment and Techniques
811(3)
37.9 Acknowledgment
814(1)
37.10 References
814(3)
Chapter 38 Routing and V-Scoring
817(18)
Matthias Stickel
38.1 Introduction
817(1)
38.2 The Routing Operation
817(4)
38.3 Materials
821(1)
38.4 Machines
822(2)
38.5 Routers
824(1)
38.6 Parameters
825(2)
38.7 Depth Controlled Routing
827(1)
38.8 V-Scoring
828(3)
38.9 References
831(4)
Part 7 Bare Board Test
Chapter 39 Bare Board Test Objectives and Definitions
835(6)
David J. Wilkie
39.1 Introduction
835(1)
39.2 The Impact of HDI
835(1)
39.3 Why Test?
836(2)
39.4 Circuit Board Faults
838(3)
Chapter 40 Bare Board Test Methods
841(18)
David J. Wilkie
40.1 Introduction
841(1)
40.2 Nonelectrical Testing Methods
841(1)
40.3 Basic Electrical Testing Methods
842(6)
40.4 Specialized Electrical Testing Methods
848(3)
40.5 Data and Fixture Preparation
851(6)
40.6 Combined Testing Methods
857(2)
Chapter 41 Bare Board Test Equipment
859(20)
David J. Wilkie
41.1 Introduction
859(1)
41.2 System Alternatives
859(2)
41.3 Universal Grid Systems
861(11)
41.4 Flying-Probe Moving-Probe Test Systems
872(4)
41.5 Verification and Repair
876(1)
41.6 Test Department Planning and Management
876(3)
Chapter 42 HDI Bare Board Special Testing Methods
879(8)
David J. Wilkie
42.1 Introduction
879(1)
42.2 Fine-Pitch Tilt-Pin Fixtures
880(1)
42.3 Bending Beam Fixtures
880(1)
42.4 Flying Probe
881(1)
42.5 Coupled Plate
881(1)
42.6 Shorting Plate
881(1)
42.7 Conductive Rubber Fixtures
882(1)
42.8 Optical Inspection
882(1)
42.9 Noncontact Test Methods
882(2)
42.10 Combinational Test Methods
884(3)
Part 8 Assembly, Soldering Materials, and Processes
Chapter 43 Assembly Processes
887(48)
Happy T. Holden
43.1 Introduction
887(2)
43.2 Through-Hole Technology
889(10)
43.3 Surface-Mount Technology
899(24)
43.4 Odd-Form Component Assembly
923(7)
43.5 Process Equipment Selection
930(3)
43.6 Conformal Coating, Encapsulation, and Underfill Materials
933(1)
43.7 Acknowledgments
934(1)
Chapter 44 Conformal Coating
935(22)
Jason Keeping
44.1 Introduction
935(1)
44.2 Types of Conformal Coatings
936(4)
44.3 Product Preparation
940(6)
44.4 Application Processes
946(3)
44.5 Cure, Inspection, and Demasking
949(2)
44.6 Repair Methods
951(1)
44.7 Design for Conformal Coating
952(3)
44.8 References
955(2)
Chapter 45 Fluxes and Cleaning
957(12)
Gregory C. Munie
Laura J. Turbini
45.1 Introduction
957(1)
45.2 Assembly Process
958(1)
45.3 Surface Finishes
959(1)
45.4 Soldering Flux
960(1)
45.5 Flux Form versus Soldering Process
961(1)
45.6 Rosin Flux
962(1)
45.7 Water-Soluble Flux
963(1)
45.8 Low Solids Flux
964(1)
45.9 Cleaning Issues
965(2)
45.10 Summary
967(1)
45.11 References
967(2)
Chapter 46 Soldering Fundamentals
969(8)
Gary M. Freedman
46.1 Introduction
969(1)
46.2 Elements of a Solder Joint
970(1)
46.3 Solder Overview
971(1)
46.4 Soldering Basics
971(4)
46.5 References
975(2)
Chapter 47 Soldering Materials and Metallurgy
977(20)
Gary M. Freedman
47.1 Introduction
977(1)
47.2 Solders
978(2)
47.3 Solder Alloys and Corrosion
980(1)
47.4 Pb-Free Solders: Alternatives and Implications
980(6)
47.5 Board Surface Finishes
986(8)
47.6 References
994(3)
Chapter 48 Solder Fluxes
997(18)
Gary M. Freedman
48.1 Introduction to Fluxes
997(1)
48.2 Flux Functions
997(2)
48.3 Flux Delivery Methods
999(1)
48.4 Flux Activity and Attributes
999(1)
48.5 Flux: Ideal versus Reality
1000(1)
48.6 Flux Types
1000(9)
48.7 Soldering Atmospheres
1009(3)
48.8 References
1012(3)
Chapter 49 Soldering Techniques
1015(60)
Gary M. Freedman
49.1 Introduction
1015(1)
49.2 Mass Soldering Methods
1015(1)
49.3 Oven Reflow Soldering
1015(24)
49.4 Wave Soldering
1039(15)
49.5 Wave Solder Defects
1054(1)
49.6 Vapor-Phase Reflow Soldering
1055(2)
49.7 Laser Reflow Soldering
1057(7)
49.8 Hot-Bar Soldering
1064(5)
49.9 Hot-Gas Soldering
1069(2)
49.10 Ultrasonic Soldering
1071(1)
49.11 References
1072(3)
Chapter 50 Soldering Repair and Rework
1075(10)
Gary M. Freedman
50.1 Introduction
1075(1)
50.2 Hot-Gas Repair
1075(5)
50.3 Manual Solder Fountain
1080(1)
50.4 Automated Solder Fountain (Single-Point Soldering)
1080(1)
50.5 Laser
1080(1)
50.6 Considerations for Repair
1081(1)
50.7 Reference
1082(3)
Part 9 Nonsolder Interconnection
Chapter 51 Press-Fit Interconnection
1085(18)
Gary M. Freedman
51.1 Introduction
1085(1)
51.2 The Rise of Press-Fit Technology
1086(1)
51.3 Compliant Pin Configurations
1086(3)
51.4 Press-Fit Considerations
1089(1)
51.5 Press-Fit Pin Materials
1089(1)
51.6 Surface Finishes and Effects
1090(3)
51.7 Equipment
1093(1)
51.8 Assembly Process
1093(3)
51.9 Rework for Press-Fit Connectors
1096(2)
51.10 PCB Design and Board Procurement Tips
1098(1)
51.11 Press-Fit Process Tips
1099(2)
51.12 Further Reading
1101(2)
Chapter 52 Pressure-Interconnect Land Grid Array Systems
1103(10)
Gary M. Freedman
52.1 Introduction
1103(1)
52.2 LGA and the Environment
1103(1)
52.3 Elements of the LGA System
1103(4)
52.4 Assembly
1107(2)
52.5 PCA Rework
1109(1)
52.6 Design Guidelines
1110(1)
52.7 Reference
1110(3)
Part 10 Quality
Chapter 53 Acceptability and Quality of Fabricated Boards
1113(32)
Robert Neves
53.1 Introduction
1113(1)
53.2 Specific Quality and Acceptability Criteria by PCB Type
1114(1)
53.3 Methods for Verification of Acceptability
1115(1)
53.4 Inspection Lot Formation
1116(1)
53.5 Inspections Categories
1117(1)
53.6 Acceptability and Quality After Simulated Solder Cycle(s)
1118(2)
53.7 Nonconforming PCBs and Material Review Board Function
1120(1)
53.8 The Cost of the Assembled PCB
1120(1)
53.9 How to Develop Acceptability and Quality Criteria
1121(1)
53.10 Class of Service
1122(1)
53.11 Inspection Criteria
1123(19)
53.12 Reliability Inspection Using Accelerated Environmental Exposure
1142(3)
Chapter 54 Acceptability of Printed Circuit Board Assemblies
1145(34)
Mel Parrish
54.1 Understanding Customer Requirements
1145(5)
54.2 Handling to Protect the PCBA
1150(3)
54.3 PCBA Hardware Acceptability Considerations
1153(5)
54.4 Component Installation or Placement Requirements
1158(8)
54.5 Component and PCB Solderability Requirements
1166(1)
54.6 Solder-Related Defects
1166(5)
54.7 PCBA Laminate Condition, Cleanliness, and Marking Requirements
1171(3)
54.8 PCBA Coatings
1174(1)
54.9 Solderless Wrapping of Wire to Posts (Wire Wrap)
1175(1)
54.10 PCBA Modifications
1176(2)
54.11 References
1178(1)
Chapter 55 Assembly Inspection
1179(24)
Stacy Kalisz Johnson
Stig Oresjo
55.1 Introduction
1179(2)
55.2 Definition of Defects, Faults, Process Indicators, and Potential Defects
1181(1)
55.3 Reasons for Inspection
1182(2)
55.4 Lead-Free Impact on Inspection
1184(1)
55.5 Miniaturization and Higher Complexity
1185(1)
55.6 Visual Inspection
1186(3)
55.7 Automated Inspection
1189(2)
55.8 Three-Dimensional Automated Solder Paste Inspection
1191(2)
55.9 Pre-Reflow AOI
1193(1)
55.10 Post-Reflow Automated Inspection
1194(5)
55.11 Implementation of Inspection Systems
1199(1)
55.12 Design Implications of Inspection Systems
1200(1)
55.13 References
1201(2)
Chapter 56 Design for Testing
1203(12)
Kenneth P. Parker
56.1 Introduction
1203(1)
56.2 Definitions
1204(1)
56.3 Ad Hoc Design for Testability
1204(2)
56.4 Structured Design for Testability
1206(1)
56.5 Standards-Based Testing
1207(6)
56.6 References
1213(2)
Chapter 57 Loaded Board Testing
1215(18)
Kenneth P. Parker
57.1 Introduction
1215(1)
57.2 The Process of Test
1216(1)
57.3 Definitions
1217(4)
57.4 Testing Approaches
1221(3)
57.5 In-Circuit Test Techniques
1224(5)
57.6 Alternatives to Conventional Electrical Tests
1229(3)
57.7 Tester Comparison
1232(1)
57.8 References
1232(1)
Chapter 58 Failure Modes and Effects Analysis
1233(14)
Happy T. Holden
58.1 Prognostics and Health Management
1233(2)
58.2 Theory
1235(6)
58.3 What Is Process FMEA?
1241(3)
58.4 Reference
1244(1)
58.5 Further Reading
1244(3)
Part 11 Reliability
Chapter 59 Conductive Anodic Filament Formation
1247(24)
Laura J. Turbini
Antonio Caputo
59.1 Introduction
1247(1)
59.2 Electrochemical Migration
1247(2)
59.3 Developing a Quantitative Copper Corrosion Test
1249(7)
59.4 Understanding CAF Formation
1256(4)
59.5 Factors That Affect CAF Formation
1260(6)
59.6 Test Method for CAF-Resistant Materials
1266(1)
59.7 Manufacturing Tolerance Considerations
1267(1)
59.8 References
1267(4)
Chapter 60 Reliability of Printed Circuit Boards
1271(56)
Reza Ghaffarian
60.1 Introduction
1271(1)
60.2 PCB and Microelectronics Trends and Reliability
1272(11)
60.3 PCB Fabrication and Failure Mechanisms
1283(11)
60.4 PTH Thermal Cycle Reliability and Projections Methods
1294(28)
60.5 Acknowledgments
1322(1)
60.6 References
1322(3)
60.7 Further Reading
1325(2)
Chapter 61 Reliability of Microvia Printed Circuit Boards
1327(20)
Reza Ghaffarian
61.1 Microvia Fabrication
1327(15)
61.2 Summary
1342(1)
61.3 List of Acronyms
1342(3)
61.4 Acknowledgments
1345(1)
61.5 References
1345(1)
61.6 Further Reading
1346(1)
Chapter 62 Component-to-PWB Reliability: The Impact of Design Variables and Lead Free
1347(28)
Mudasir Ahmad
Mark Brillhart
62.1 Introduction
1347(1)
62.2 Packaging Challenges
1348(3)
62.3 Variables That Impact Reliability
1351(22)
62.4 References
1373(2)
Chapter 63 Lead-Free Solder Joint Reliability: Fundamentals and Design-for-Reliabllity Rules
1375(26)
Jean-Paul Clech
63.1 Introduction
1375(1)
63.2 Reliability Definition and Goals
1376(1)
63.3 Why Do Solder Joints Fail?
1377(1)
63.4 Main Effects and Basic Rules-of-Thumb
1378(6)
63.5 Parameters That Affect Solder Joint Reliability Under Thermal Cycling Conditions
1384(3)
63.6 Significance of Board Parameter Effects
1387(6)
63.7 Lead-Free Reliability Trends
1393(4)
63.8 Conclusions
1397(1)
63.9 Further Reading
1397(4)
Chapter 64 Component-to-PWB Reliability: Estimating Solder Joint Reliability and the Impact of Lead-Free Solders
1401(38)
Mudasir Ahmad
Mark Brillhart
64.1 Introduction
1401(2)
64.2 Thermomechanical Reliability
1403(15)
64.3 Mechanical Reliability
1418(7)
64.4 Finite Element Analysis
1425(7)
64.5 References
1432(7)
Part 12 Flexible Circuits
Chapter 65 Flexible Circuit Applications and Materials
1439(32)
Happy T. Holden
65.1 Introduction to Flexible Circuits
1439(2)
65.2 Applications of Flexible Circuits
1441(1)
65.3 High-Density Flexible Circuits
1442(1)
65.4 Materials for Flexible Circuits
1443(2)
65.5 Substrate Material Properties
1445(14)
65.6 Conductor Materials
1459(1)
65.7 Copper-Clad Laminates
1460(4)
65.8 Coverlay Materials
1464(5)
65.9 Stiffener Materials
1469(1)
65.10 Adhesive Materials
1469(1)
65.11 Restriction of Hazardous Substances Issues
1470(1)
65.12 Acknowledgments
1470(1)
Chapter 66 Design of Flexible Circuits
1471(32)
Happy T. Holden
66.1 Introduction
1471(1)
66.2 Types of Flexible Circuits
1472(6)
66.3 Multilayer Rigid Flex (Multilayer Flex)
1478(2)
66.4 Circuit Designs for Flexibility
1480(5)
66.5 Electrical Design of the Circuits
1485(5)
66.6 Design of Flexible Printed Wiring with Transmission Line Properties
1490(10)
66.7 Circuit Designs for Higher Reliability
1500(2)
66.8 Acknowledgments
1502(1)
Chapter 67 Manufacturing Flexible Circuits
1503(28)
Joseph Fjelstad
67.1 Introduction
1503(1)
67.2 Fundamental Flex Circuit Processing Steps
1504(3)
67.3 Equipment for Wet Processing of Flexible Materials
1507(2)
67.4 Coverlayer Cover-Coating Methods
1509(7)
67.5 Interconnection Surface Treatments
1516(1)
67.6 Depanelization of Flexible Circuits
1517(2)
67.7 Stiffener Processes
1519(1)
67.8 Packaging for Flex
1520(1)
67.9 High-Density Flexible Circuit Manufacturing
1520(9)
67.10 Acknowledgments
1529(2)
Chapter 68 Termination Options for Flexible Circuits
1531(12)
Joseph Fjelstad
68.1 Introduction
1531(2)
68.2 Wirebonding Technology
1533(3)
68.3 Solutions Where the Flex Circuit Is Half of the Mated Pair
1536(5)
68.4 Summary
1541(1)
68.5 Acknowledgments
1541(2)
Chapter 69 Multilayer Flex and Rigid Flex
1543(14)
Joseph Fjelstad
69.1 Introduction
1543(1)
69.2 Multilayer Flex versus Rigid Flex
1543(7)
69.3 Aluminum Rigid Flex Circuit-Prospective Structure for the Future
1550(4)
69.4 Summary
1554(1)
69.5 Acknowledgments
1555(2)
Chapter 70 Special Constructions of Flexible Circuits
1557(16)
Dominique K. Numakura
70.1 Introduction
1557(1)
70.2 Flying-Lead Construction
1557(7)
70.3 Tape Automated Bonding
1564(2)
70.4 Microbump Arrays
1566(2)
70.5 Thick-Film Conductor Flex Circuits
1568(1)
70.6 Shielding of the Flexible Cables
1569(1)
70.7 Functional Flexible Circuits
1570(3)
Chapter 71 Flexible Circuit Quality Assurance: Principles and Practices
1573(12)
Joseph Fjelstad
71.1 Introduction
1573(1)
71.2 Basic Concepts in Flexible Circuit Quality Assurance
1574(1)
71.3 Raw Material Testing
1575(1)
71.4 Electrical Performance Tests
1576(1)
71.5 General Testing Requirements for Flexible Circuit Materials
1577(1)
71.6 Flexible Circuit Visual Evaluation
1577(1)
71.7 Flexible Circuit Dimensional Requirements
1578(1)
71.8 Physical Testing Requirements for Flexible Circuits
1579(2)
71.9 Electrical Requirements for Flexible Circuits
1581(1)
71.10 Environmental Resistance Requirements
1582(1)
71.11 Solderability Requirements
1582(1)
71.12 Standards and Specifications for Flexible Circuits
1582(2)
71.13 Summary
1584(1)
71.14 Acknowledgments
1584(1)
Appendix. Summary of Key Component, Material, Process, and Design Standards Marc Carter 1585(10)
Glossary 1595(10)
Index 1605
Clyde F. Coombs, Jr, (Los Altos, CA) recently retired from Hewlett-Packard. He is the editor of all five editions of the Printed Circuits Handbook, the first of which was published in 1967. He is also the editor of two editions of the Electronics Instrument Handbook and the communications Network Test and Measurement Handbook.
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