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E-raamat: Reliability Technology: Principles and Practice of Failure Prevention in Electronic Systems

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Reliability Technology: Principles and Practice of Failure Prevention in Electronic SystemsSuurem pilt
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A unique book that describes the practical processes necessary to achieve failure free equipment performance, for quality and reliability engineers, design, manufacturing process and environmental test engineers.

This book studies the essential requirements for successful product life cycle management. It identifies key contributors to failure in product life cycle management and particular emphasis is placed upon the importance of thorough Manufacturing Process Capability reviews for both in-house and outsourced manufacturing strategies. The readers’ attention is also drawn to the many hazards to which a new product is exposed from the commencement of manufacture through to end of life disposal.

  • Revolutionary in focus, as it describes how to achieve failure free performance rather than how to predict an acceptable performance failure rate (reliability technology rather than reliability engineering)
  • Author has over 40 years experience in the field, and the text is based on classroom tested notes from the reliability technology course he taught at Massachusetts Institute of Technology (MIT), USA 
  • Contains graphical interpretations of mathematical models together with diagrams, tables of physical constants, case studies and unique worked examples 
Foreword ix
Michael Pecht
Series Editor's Preface xi
Preface xiii
About the Author xvii
Acknowledgements xix
1 The Origins and Evolution of Quality and Reliability
1(26)
1.1 Sixty Years of Evolving Electronic Equipment Technology
1(2)
1.2 Manufacturing Processes - From Manual Skills to Automation
3(1)
1.3 Soldering Systems
4(1)
1.4 Component Placement Machines
5(1)
1.5 Automatic Test Equipment
5(1)
1.6 Lean Manufacturing
5(4)
1.7 Outsourcing
9(1)
1.8 Electronic System Reliability - Folklore versus Reality
9(2)
1.9 The `Bathtub' Curve
11(2)
1.10 The Truth about Arrhenius
13(2)
1.11 The Demise of MIL-HDBK-217
15(3)
1.12 The Benefits of Commercial Off-The-Shelf (COTS) Products
18(2)
1.13 The MoD Smart Procurement Initiative
20(1)
1.14 Why do Items Fail?
21(2)
1.15 The Importance of Understanding Physics of Failure (PoF)
23(4)
Summary and Questions
23(2)
References
25(2)
2 Product Lifecycle Management
27(26)
2.1 Overview
27(2)
2.2 Project Management
29(2)
2.3 Project Initiation
31(2)
2.4 Project Planning
33(5)
2.5 Project Execution
38(3)
2.6 Project Closure
41(1)
2.7 A Process Capability Maturity Model
42(5)
2.8 When and How to Define The Distribution Strategy
47(1)
2.9 Transfer of Design to Manufacturing - The High-Risk Phase
48(1)
2.10 Outsourcing - Understanding and Minimising the Risks
49(1)
2.11 How Product Reliability is Increasingly Threatened in the Twenty-First Century
50(3)
Summary and Questions
51(1)
References
52(1)
3 The Physics of Failure
53(36)
3.1 Overview
53(1)
3.2 Background
54(2)
3.3 Potential Failure Mechanisms in Materials and Components
56(15)
3.4 Techniques for Failure Analysis of Components and Assemblies
71(4)
3.5 Transition from Tin-Lead to Lead-Free Soldering
75(2)
3.6 High-Temperature Electronics and Extreme-Temperature Electronics
77(2)
3.7 Some Illustrations of Failure Mechanisms
79(10)
Summary and Questions
86(1)
References
87(2)
4 Heat Transfer - Theory and Practice
89(24)
4.1 Overview
89(1)
4.2 Conduction
90(6)
4.3 Convection
96(4)
4.4 Radiation
100(6)
4.5 Thermal Management
106(1)
4.6 Principles of Temperature Measurement
106(4)
4.7 Temperature Cycling and Thermal Shock
110(3)
Summary and Questions
111(1)
References
112(1)
5 Shock and Vibration - Theory and Practice
113(36)
5.1 Overview
113(1)
5.2 Sources of Shock Pulses in the Real Environment
114(1)
5.3 Response of Electronic Equipment to Shock Pulses
115(1)
5.4 Shock Testing
116(4)
5.5 Product Shock Fragility
120(6)
5.6 Shock and Vibration Isolation Techniques
126(7)
5.7 Sources of Vibration in the Real Environment
133(1)
5.8 Response of Electronic Equipment to Vibration
134(1)
5.9 Vibration Testing
134(5)
5.10 Vibration-Test Fixtures
139(10)
Summary and Questions
145(2)
References
147(2)
6 Achieving Environmental-Test Realism
149(36)
6.1 Overview
149(1)
6.2 Environmental-Testing Objectives
150(2)
6.3 Environmental-Test Specifications and Standards
152(5)
6.4 Quality Standards
157(1)
6.5 The Role of the Test Technician
158(1)
6.6 Mechanical Testing
159(5)
6.7 Climatic Testing
164(4)
6.8 Chemical and Biological Testing
168(1)
6.9 Combined Environment Testing
169(6)
6.10 Electromagnetic Compatibility
175(4)
6.11 Avoiding Misinterpretation of Test Standards and Specifications
179(6)
Summary and Questions
181(2)
References
183(2)
7 Essential Reliability Technology Disciplines in Design
185(32)
7.1 Overview
185(1)
7.2 Robust Design and Quality Loss Function
186(6)
7.3 Six Sigma Quality
192(3)
7.4 Concept, Parameter and Tolerance Design
195(4)
7.5 Understanding Product Whole Lifecycle Environment
199(4)
7.6 Defining User Requirement for Failure-Free Operation
203(2)
7.7 Component Anatomy, Materials and Mechanical Architecture
205(1)
7.8 Design for Testability
206(5)
7.9 Design for Manufacturability
211(2)
7.10 Define Product Distribution Strategy
213(4)
Summary and Questions
215(1)
References
216(1)
8 Essential Reliability Technology Disciplines in Development
217(34)
8.1 Overview
217(1)
8.2 Understanding and Achieving Test Realism
218(1)
8.3 Qualification Testing
219(1)
8.4 Stress Margin Analysis and Functional Performance Stability
219(10)
8.5 Premature Failure Stimulation
229(1)
8.6 Accelerated Ageing vs. Accelerated Life Testing
229(3)
8.7 Design and Proving of Distribution Packaging
232(19)
Summary and Questions
247(1)
References
248(3)
9 Essential Reliability Technology Disciplines in Manufacturing
251(40)
9.1 Overview
251(1)
9.2 Manufacturing Planning
252(1)
9.3 Manufacturing Process Capability
253(4)
9.4 Manufacturing Process Management and Control
257(10)
9.5 Non-invasive Inspection Techniques
267(2)
9.6 Manufacturing Handling Procedures
269(10)
9.7 Lead-Free Soldering - A True Perspective
279(2)
9.8 Conformal Coating
281(6)
9.9 Production Reliability Acceptance Testing
287(4)
Summary and Questions
288(1)
References
289(2)
10 Environmental-Stress Screening
291(46)
10.1 Overview
291(1)
10.2 The Origins of ESS
291(3)
10.3 Thermal-Stress Screening
294(19)
10.4 Developing a Thermal-Stress Screen
313(2)
10.5 Vibration-Stress Screening
315(2)
10.6 Developing a Vibration-Stress Screen
317(9)
10.7 Combined Environment-Stress Screening
326(1)
10.8 Other Stress Screening Methodologies
327(1)
10.9 Estimating Product Life Consumed by Stress Screening
328(1)
10.10 An Environmental-Stress Screening Case Study
329(8)
Summary and Questions
334(1)
References
335(2)
11 Some Worked Examples
337(30)
11.1 Overview
337(3)
11.2 Thermal Expansion Stresses Generated within a PTH Due to Temperature Cycling
340(2)
11.3 Shear Tear-Out Stresses in Through-Hole Solder Joints
342(4)
11.4 Axial Forces on a Through-Hole Component Lead Wire
346(2)
11.5 SMC QFP - Solder-Joint Shear Stresses
348(9)
11.6 Frequency and Peak Half-Amplitude Displacement Calculations
357(1)
11.7 Random Vibration - Converting G2/Hz to GRMS
358(2)
11.8 Accelerated Ageing - Temperature Cycling and Vibration
360(3)
11.9 Stress Screening - Production Vibration Fixture Design
363(4)
References
365(2)
Appendix 1 Physical Properties of Materials 367(10)
Appendix 2 Unit Conversion Tables 377(6)
Index 383
Mr. Norman Pascoe, MIT Consultant (retired), UK The author has worked for forty three years in the fields of Environmental Testing , Quality and Reliability and Environmental Stress Screening. Since 1996 he has worked as a Reliability Technology consultant to some leading telecommunications and aerospace industries. Before becoming a consultant Norman served for five years as European Product Assurance adviser to Nortel Networks Limited. Mr Pascoe has presented papers at seminars and conferences in North America, the UK and other European countries. He became a member of the Society of Environmental Engineers in December 1987 and was elected a Fellow of the Society of Environmental Engineers in April 1998.
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