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E-raamat: Solder Materials

(Nat'l Cheng Kung Univ, Taiwan)
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This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.

Preface v
1 Solder Products and Soldering Process
1(18)
1.1 Solder Products
1(12)
1.2 Soldering Process
13(3)
1.3 Materials Property Acquirements for Solders and Soldering
16(3)
References
17(2)
2 Solder Alloys
19(14)
2.1 Solder Properties Requirement
19(2)
2.2 Pb-containing Solders
21(3)
2.3 Pb-free Solders
24(9)
References
31(2)
3 Physical Metallurgy of Solder Alloys
33(56)
3.1 The Behavior of Sn in Solder Alloy
33(3)
3.2 Eutectic Systems
36(1)
3.3 Formation of Intermetallic Compounds
37(17)
3.4 Tin Whiskers
54(35)
3.4.1 Microstructure of tin whiskers
54(6)
3.4.2 Growth mechanism and kinetics of tin whiskers
60(8)
3.4.3 Mitigation of tin whiskers
68(8)
3.4.4 Properties of Sn whiskers
76(1)
References
77(12)
4 Solderability and Soldering Reactions
89(46)
4.1 Solderability
89(12)
4.2 Soldering Reactions
101(34)
References
127(8)
5 Solid State Reactions of Solder Joints Induced by Thermal Energy
135(62)
5.1 High Temperature Isothermal Heating
136(26)
5.2 Thermal Cycling
162(35)
References
191(6)
6 Solid State Interactions Induced by Electromigration
197(46)
6.1 Electromigration
197(1)
6.2 The Microstructure Variation of Solder Induced by Electromigration
198(14)
6.3 Electromigration and Thermomigration
212(2)
6.4 Polarization Behavior in IMC Formation Induced by Electromigration
214(12)
6.5 Microstructure Variation and Failure of Solder Microbump under Electric Current Stressing
226(17)
References
235(8)
7 Mechanical Properties
243(52)
7.1 The Tensile Properties of Solder Alloys
244(19)
7.1.1 Effect of temperature and strain rate
248(3)
7.1.2 Effect of cooling rate
251(4)
7.1.3 Effect of alloying elements
255(8)
7.2 The Creep Properties of Solder Alloys
263(9)
7.3 The Fatigue Performance of Solder Alloys
272(7)
7.4 The Composite Solders
279(16)
References
289(6)
8 Reliability of Solder Joints
295(72)
8.1 Thermal Fatigue Test
296(31)
8.2 Vibration Test
327(1)
8.3 Shear and Impact Test
328(8)
8.4 Drop Test
336(5)
8.5 Electromigration Test
341(26)
References
360(7)
Index 367