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E-raamat: Sputtering Materials for VLSI and Thin Film Devices

(Engineering Consultant at Praxair Inc., Orangeburg, New York, USA)
  • Formaat: PDF+DRM
  • Ilmumisaeg: 13-Dec-2010
  • Kirjastus: William Andrew Publishing
  • Keel: eng
  • ISBN-13: 9780815519874
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  • Formaat: PDF+DRM
  • Ilmumisaeg: 13-Dec-2010
  • Kirjastus: William Andrew Publishing
  • Keel: eng
  • ISBN-13: 9780815519874
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An important resource for the microelectronics and flat panel display industries, this book focuses on the development of sputtering targets for conductor, diffusion barrier, reflective, data storage and display applications.

Sarkar reviews essential microelectronics industry topics, including: history and technology trends; chip making fundamentals; deposition and properties of thin films; and the role of sputtering target performance on overall production yield. Materials science fundamentals, types of metallic materials for conductors, diffusion barrier, data storage, and flat panel display applications are also discussed.

The author illustrates his arguments with case studies and real-world examples of troubleshooting in an industrial setting.

  • Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements
  • Practical information on technology trends, role of sputtering and major OEMs
  • Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc.
  • Practical case-studies on target performance and troubleshooting
  • Essential technological information for students, engineers and scientists working in the semiconductor, display, data storage and photovoltaic industry


An important resource for students, engineers and researchers working in the area of thin film deposition usingphysical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues.

The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) thesecond section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications.

In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful.

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  • Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements
  • Practical information on technology trends, role of sputtering and major OEMs
  • Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc.
  • Practical case-studies on target performance and troubleshooting
  • Essential technological information for students, engineers and scientists working in the semiconductor, display, data storage and photovoltaic industry

Muu info

The technology of physical vapor deposition (e.g. sputtering) enables the deposition of thin films on suitable substrates, with major application areas including semiconductor, liquid crystal displays, high density recording media and photovoltaic. This is a first-of-its-kind book attempted to explain technologically important manufacturing processes taking into account physics of sputtering, characteristics of sputtering target, PVD chamber design and thin film properties in an integrated manner.
Preface ix
Chapter 1 Sputtering Targets and Sputtered Films for the Microelectronic Industry 1(92)
1.1 Materials for microelectronics
1(8)
1.1.1 Introduction
1(5)
1.1.2 Conductors
6(1)
1.1.3 Semiconductors
6(2)
1.1.4 Insulators
8(1)
1.2 Scope of sputtering in microelectronics
9(4)
1.3 Sputtering materials for integrated circuits
13(26)
1.3.1 Introduction
13(7)
1.3.2 Silicide contact
20(3)
1.3.3 Conductor, liner, barrier and anti-reflection coating
23(8)
1.3.4 Assembly and packaging (back-end process)
31(8)
1.4 Sputtering materials for liquid crystal displays
39(11)
1.4.1 Introduction
39(3)
1.4.2 Active-matrix liquid crystal displays
42(8)
1.5 Sputtering materials for magnetic storage systems
50(17)
1.5.1 Introduction
50(3)
1.5.2 Thin film heads
53(7)
1.5.3 Magnetic recording media
60(7)
1.6 Sputtering materials for optical storage media
67(6)
1.7 Sputtering materials for photovoltaic devices
73(11)
1.7.1 Silicon wafer based solar cells
81(1)
1.7.2 Thin film solar cells
82(2)
1.8 Sputtering target industry
84(2)
References
86(7)
Chapter 2 Sputtering and Thin Film Deposition 93(78)
2.1 Introduction
93(4)
2.2 Physical vapor deposition
97(5)
2.3 Plasma and glow discharge
102(5)
2.4 Sputter deposition of thin films
107(50)
2.4.1 DC sputtering
107(10)
2.4.2 RF sputtering
117(2)
2.4.3 Reactive sputtering
119(4)
2.4.4 Magnetron sputtering
123(34)
2.5 Thin film characteristics
157(9)
References
166(5)
Chapter 3 Performance of Sputtering Targets and Productivity 171(26)
3.1 Introduction
171(1)
3.2 Target chemistry
172(1)
3.3 Target metallurgy
172(15)
3.3.1 Grain size inhomogeneity and banding of grains
173(3)
3.3.2 Second-phase particles, inclusions and porosity
176(1)
3.3.3 Preferred orientation of grains
177(4)
3.3.4 Sputter surface roughness and overall finish
181(2)
3.3.5 Particle performance
183(2)
3.3.6 Target bond characteristics
185(2)
3.4 Ferromagnetic targets
187(2)
3.5 Target cleaning and packaging
189(1)
3.6 Target burn-in
190(1)
3.7 Target utilization
191(2)
References
193(4)
Chapter 4 Sputtering Target Manufacturing 197(94)
4.1 Introduction
197(1)
4.2 Designing sputtering targets
198(2)
4.3 Target material fabrication
200(66)
4.3.1 Liquid metallurgy processing of targets
200(15)
4.3.2 Powder metallurgy processing of targets
215(18)
4.3.3 Heat treatment and phase transformation
233(25)
4.3.4 Metal working
258(8)
4.4 Machining of target and backing plate
266(6)
4.4.1 Turning, facing, milling and drilling
266(4)
4.4.2 Grinding
270(2)
4.5 Bonding methods and bond evaluation
272(13)
4.5.1 Braze and solder bonding
272(3)
4.5.2 Reactive bonding
275(2)
4.5.3 Solid-state bonding
277(4)
4.5.4 Other types of bonding
281(2)
4.5.5 Bond evaluation
283(2)
4.6 Particle trap formation
285(1)
4.7 Degreasing and packaging
286(1)
References
287(4)
Chapter 5 Sputtering Targets and Thin Films for Integrated Circuits 291(126)
5.1 Introduction
291(1)
5.2 Titanium
291(22)
5.2.1 Titanium processing and property control
295(8)
5.2.2 Titanium and titanium nitride thin films
303(10)
5.3 Tungsten
313(9)
5.3.1 Tungsten processing and property control
315(1)
5.3.2 Tungsten thin films
316(6)
5.4 Tungsten-titanium (W-Ti) alloys
322(10)
5.4.1 Tungsten-titanium phase diagram
322(2)
5.4.2 Tungsten-titanium processing and property control
324(4)
5.4.3 Tungsten-titanium alloy thin films
328(4)
5.5 Aluminum and its alloys
332(26)
5.5.1 Al alloy phase diagrams
337(1)
5.5.2 Aluminum alloy processing and property control
337(11)
5.5.3 Aluminum alloy thin films
348(10)
5.6 Tantalum
358(14)
5.6.1 Tantalum processing and property control
360(4)
5.6.2 Tantalum and TaN thin films
364(8)
5.7 Copper and its alloys
372(21)
5.7.1 Copper alloy phase diagrams
373(1)
5.7.2 Copper alloy processing and property control
374(6)
5.7.3 Copper alloy thin films
380(13)
5.8 Nickel-vanadium (Ni-V) alloys
393(3)
5.8.1 Nickel-vanadium and property control
395(1)
5.8.2 Nickel-vanadium alloy thin films
396(1)
5.9 Silicides
396(8)
5.9.1 Polycide and salicide processes
396(3)
5.9.2 Titanium silicides
399(5)
References
404(13)
Chapter 6 Sputtering Targets and Thin Films for Flat Panel Displays and Photovoltaics 417(84)
6.1 Introduction
417(3)
6.1.1 Active matrix liquid crystal displays (AMLCDs)
417(3)
6.1.2 Photovoltaic
420(1)
6.2 Aluminum and its alloys
420(19)
6.2.1 Aluminum alloy phase diagrams
422(1)
6.2.2 Aluminum alloy processing and property control
423(3)
6.2.3 Aluminum alloy thin films
426(13)
6.3 Molybdenum and its alloys
439(12)
6.3.1 Molybdenum processing and property control
440(4)
6.3.2 Molybdenum thin films
444(7)
6.4 Chromium
451(8)
6.4.1 Chromium processing and property control
451(4)
6.4.2 Chromium thin films
455(4)
6.5 Transparent conducting oxides (TCOs)
459(22)
6.5.1 Tin-doped indium-oxide (ITO)
462(11)
6.5.2 Aluminum-doped zinc oxide (AZO)
473(8)
6.6 Absorbers for photovoltaics
481(10)
6.6.1 Cu(In,Ga)Se2 (CIGS)
481(6)
6.6.2 Cu2ZnSnS4 (CZTS)
487(4)
References
491(10)
Chapter 7 Ferromagnetic Sputtering Targets and Thin Films for Silicides and Data Storage 501(66)
7.1 Introduction
501(10)
7.1.1 Magnetic properties of materials
501(6)
7.1.2 Magnetic domain structure and hysteresis of magnetic materials
507(3)
7.1.3 Soft and hard magnetic materials
510(1)
7.2 Nickel and its alloys
511(14)
7.2.1 Processing steps and property control
513(9)
7.2.2 Sputtering of nickel and thin film properties
522(3)
7.3 Cobalt and its alloys
525(15)
7.3.1 Processing steps and property control
527(8)
7.3.2 Sputtering of cobalt and thin film properties
535(5)
7.4 Silicide films
540(12)
7.5 Media for data storage
552(9)
7.5.1 Longitudinal recording media
556(2)
7.5.2 Perpendicular recording media
558(3)
References
561(6)
Chapter 8 Troubleshooting in Sputter Deposition 567(26)
8.1 Introduction
567(1)
8.2 Long bum-in of sputtering target
568(7)
8.2.1 Inhomogeneous material
569(3)
8.2.2 Surface characteristics
572(3)
8.3 In-film defect generation
575(12)
8.3.1 Flaking of nodules from the sputtering target
575(1)
8.3.2 Flaking of brittle films from the process kit
576(2)
8.3.3 Arcing
578(7)
8.3.4 Trace elements of sputtering target
585(1)
8.3.5 Re-deposited material in hollow cathode magnetron (HCM) targets
586(1)
8.3.6 Contaminated particle-traps of the sputtering targets
587(1)
8.4 Bonding-related problems
587(3)
8.5 Long pump-down time and out-gassing
590(1)
References
590(3)
Index 593
Engineering Consultant at Praxair Inc., Orangeburg, New York, USA