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1 | (8) |
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1.1 Motivation and Objectives |
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1 | (2) |
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1.2 Traditional SRAM Design and Technology Scaling |
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3 | (2) |
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1.3 Structure of the Text |
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5 | (4) |
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7 | (2) |
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2 SRAM Bit Cell Optimization |
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9 | (22) |
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9 | (3) |
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2.2 Different Cell Topologies |
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12 | (15) |
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2.2.1 Read SNM Free (RSNF) 7T Cell |
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13 | (1) |
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2.2.2 Differential Data Aware Power-Supplied (D2AP) 8T SRAM Cell: Improved Write Margin and Half-Select Accesses |
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13 | (1) |
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2.2.3 Half Select Condition Free Cross Point 8T (CR8T) SRAM Cell |
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14 | (2) |
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2.2.4 Read Decoupled 8T and 10T Cell (Isolation of the Internal Storage Nodes from the Read Bit-Lines) |
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16 | (8) |
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2.2.5 Differential Read Decoupled 8T and 10T SRAM Cells |
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24 | (3) |
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27 | (4) |
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30 | (1) |
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3 Adaptive Voltage Optimization Techniques: Low Voltage SRAM Operation |
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31 | (36) |
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31 | (2) |
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3.2 WRITE Assist Techniques |
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33 | (6) |
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3.3 READ Assist Techniques |
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39 | (4) |
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43 | (7) |
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3.5 Hybrid Voltage Optimization Techniques |
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50 | (12) |
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3.5.1 Crosshairs SRAM---Separately Tuning VDD and GND Supplies of SRAM Cells |
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52 | (1) |
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3.5.2 Configurable Write Assist: Compatibility with a Dynamic Voltage Scaling |
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52 | (1) |
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3.5.3 MNBL Technique: Sequential Voltage Optimization |
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53 | (7) |
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3.5.4 Compounded Differential VSS (CDVSS) Bias Technique |
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60 | (2) |
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62 | (5) |
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64 | (3) |
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4 Circuit Techniques to Assist SRAM Cell: Local Assist Circuitry |
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67 | (28) |
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67 | (1) |
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4.2 Hierarchical Divided Bit-Lines |
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68 | (2) |
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4.3 Hierarchical Divided Bit-Lines with Local Assist Circuitry |
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70 | (4) |
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4.3.1 Fine Grained Bit-Line Architecture |
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71 | (1) |
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4.3.2 Divided Read Bit-Line and Read End Detecting Replica Circuit |
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72 | (1) |
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4.3.3 Short Buffered Local Bit-Lines with Low Swing GBLs |
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73 | (1) |
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4.4 WRITE After READ Based Assist Circuitry for Enabling VDDmin Operation |
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74 | (1) |
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4.4.1 WRITE After READ Based Assist Circuitry |
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74 | (1) |
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4.4.2 Short Buffered Bit-line |
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74 | (1) |
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4.4.3 Low-Energy Disturb Mitigation (Half Select Issues) Scheme |
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75 | (1) |
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4.5 Low Swing Bit-Line Hierarchy: Enhanced SRAM Cell Stability |
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75 | (4) |
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4.5.1 Pseudo 8T Sensing Enabled Local Assist Circuitry |
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76 | (1) |
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4.5.2 Hierarchical Buffered Segmented Bit-Lines |
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77 | (2) |
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4.6 High Bit Density Based Bit-Line Hierarchy |
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79 | (4) |
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4.6.1 Cascaded Bit-Line with Self-Write-Back Sense Amplifier |
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79 | (2) |
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4.6.2 SRAM Cell Type Local Assist Circuitry |
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81 | (2) |
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83 | (10) |
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83 | (3) |
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86 | (2) |
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88 | (2) |
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90 | (3) |
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93 | (2) |
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93 | (2) |
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5 SRAM Energy Reduction Techniques |
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95 | (28) |
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5.1 SRAM Array Leakage Reduction |
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95 | (7) |
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5.1.1 Leakage Compensation-Based Techniques |
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96 | (2) |
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5.1.2 Leakage CutOff Based Techniques |
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98 | (4) |
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5.2 Dynamic WRITE Energy Reduction |
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102 | (9) |
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5.2.1 Write Replica Circuit for Low Power Operation |
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105 | (1) |
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5.2.2 Charge Recycling SRAM |
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105 | (1) |
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5.2.3 Sense Amplifying SRAM Cell (SAC-SRAM) |
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106 | (1) |
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5.2.4 Low Swing WRITE Operation |
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107 | (1) |
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5.2.5 Low Swing WRITE with WRITE Masking |
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107 | (2) |
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5.2.6 Low Swing Static WRITE operation |
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109 | (2) |
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5.2.7 Litho Optimized Low Swing Static WRITE |
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111 | (1) |
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5.3 Low Energy READ Operation |
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111 | (5) |
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5.3.1 Hierarchical Buffered Bit-lines |
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112 | (1) |
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5.3.2 Pseudo 8T Architecture Based Local Architecture |
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113 | (2) |
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5.3.3 RSDVt 8T SRAM: Variability Resilient Low Energy Solution |
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115 | (1) |
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116 | (3) |
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119 | (4) |
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120 | (3) |
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6 Variation Tolerant Low Power Sense Amplifiers |
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123 | (20) |
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6.1 Introduction: Energy-Offset Trade off Problem in Sense Amplifier Circuits |
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123 | (3) |
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6.2 Calibration Based Techniques |
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126 | (4) |
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6.2.1 Sense Amplifier Redundancy |
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126 | (1) |
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6.2.2 Sense Amplifier Tuning |
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126 | (1) |
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6.2.3 Capacitive Resist Implementation and Parallel Device Assist Implementation |
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127 | (1) |
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6.2.4 Hot Carrier Injection Trimming |
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128 | (1) |
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6.2.5 Multi-Sized SA Redundancy |
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128 | (2) |
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6.3 Charge Limited Sequential Sense Amplifier: Calibration Free Solution |
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130 | (9) |
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6.3.1 Limitations with the Calibration Based SA Design |
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131 | (1) |
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6.3.2 Charge Limited Sequential Sensing: Concept |
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131 | (2) |
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6.3.3 Circuit Implementation |
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133 | (5) |
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138 | (1) |
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139 | (1) |
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140 | (3) |
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141 | (2) |
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143 | (20) |
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143 | (1) |
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7.2 IM_90 (First Prototype 90 nm IP) |
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143 | (8) |
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143 | (1) |
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7.2.2 Design Innovation Contributions |
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144 | (1) |
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144 | (6) |
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7.2.4 Measurement Results |
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150 | (1) |
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7.3 IM_65 (Second Prototype 65 nm LP) |
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151 | (7) |
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151 | (1) |
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7.3.2 Design Innovation Contributions |
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152 | (1) |
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153 | (2) |
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7.3.4 Measurement Results |
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155 | (3) |
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7.4 Comparison with the State-of-the-Art |
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158 | (5) |
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161 | (2) |
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163 | |
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8.1 Synopsys of Contribution |
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163 | (3) |
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8.2 Technology Scaling Perspective |
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166 | (1) |
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167 | (1) |
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168 | |
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170 | |