(Ilmumisaeg: 27-Jan-2021, EPUB+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9780429863813)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and sold...Loe edasi...
(Ilmumisaeg: 27-Jan-2021, PDF+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9780429863820)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and sold...Loe edasi...
