This text originated from the 13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference & Workshop, and examines the manufacture of circuits and devices. Topics covered include: advanced meteorology; cost reduction; MEMS technology; time...Loe edasi...
This volume originates from the 2002 8th International Advanced Packaging Materials Symposium and covers topics including: bending of bare fibres; bare fibre under the combined action of bending and tension; polymer coated fibres; and solder materia...Loe edasi...
This CD-ROM contains the proceedings of the Fourth International Conference on Adhesives Joining and Coating Technology in Electronics Manufacturing. The papers cover: novel applications; reliability; high density substrates; materials development;...Loe edasi...
This text constitutes proceedings from the Topical Meeting on Electrical Performance of Electronic Packaging, which took place in 1999. Topics covered include system design issues, modelling and power distribution....Loe edasi...
Aimed at integrated circuit designers, solid state component designers and packaging and manufacturing engineers, these proceedings cover such subjects as: failure analysis technologies; process and device; packaging and metallization; dielectrics;...Loe edasi...
These conference papers present coverage of components and packaging science, technology and education. Topics range from components, connectors, and interconnections to single and multichip packaging and technology....Loe edasi...
These conference papers present coverage of components and packaging science, technology and education. Topics range from components, connectors, and interconnections to single and multichip packaging and technology....Loe edasi...
This volume presents papers from the theormoelectrics conference. The ICT provides a total of 190 scientists, engineers, manufacturers, and users an opportunity to present and discuss findings and developments in thermoelectric research and applicat...Loe edasi...
The mission of the 1998 International Nonvolatile Memory Technology Conference was to promote communication between nonvolatile memory technologists and systems developers. Its scope includes both very small and very large storage systems, and all c...Loe edasi...
saadame teile pakkumise kasutatud raamatule, mille hind võib erineda kodulehel olevast hinnast
These papers discuss the need for and status of high temperature electronics development with particular reference to semiconductor materials, devices and applications, passive components, ohmic contacts and metallizations, testing at high temperatu...Loe edasi...
This volume covers the topics of this meeting, the general topic of which is electrical design, analysis, and characterization of electronic interconnections and packaging structures for performance-driven, high-speed/high complexity electronic syst...Loe edasi...
The papers in this work cover many topics, including not only electronic components, but also developments in all areas of electronic technology. Emerging technologies such as optoelectronic and ballgrid array packaging are reported....Loe edasi...
This volume features coverage of new developments in and applications relating to generation and removal of heat within semiconductor devices, and measurement of junction temperatures under various application and environmental conditions....Loe edasi...
This text covers the 1997 Electronic Packaging Conference, which discussed packaging structures for performance-driven, high-speed and high complexity electronic systems. It includes such topics as: package design issues; on-chip interconnection iss...Loe edasi...
