Sandip Bhattacharya, J Ajayan, Fernando Avila Herrera
(Ilmumisaeg: 22-Dec-2023, EPUB+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9781003817093)
Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significanc...Loe edasi...
Sandip Bhattacharya, J Ajayan, Fernando Avila Herrera
(Ilmumisaeg: 22-Dec-2023, PDF+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9781003817062)
Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significanc...Loe edasi...
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip...Loe edasi...
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip...Loe edasi...
(Ilmumisaeg: 23-Dec-2021, PDF+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9781000504293)
This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits.It provides analysis of ultra-low power high speed nano-interconnects based on different fa...Loe edasi...
(Ilmumisaeg: 23-Dec-2021, EPUB+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9781000504316)
This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits.It provides analysis of ultra-low power high speed nano-interconnects based on different fa...Loe edasi...
(Ilmumisaeg: 27-Jan-2021, EPUB+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9780429863813)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and sold...Loe edasi...
(Ilmumisaeg: 27-Jan-2021, PDF+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9780429863820)
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and sold...Loe edasi...
(Ilmumisaeg: 03-Oct-2018, EPUB+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781351837170)
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focu...Loe edasi...
(Ilmumisaeg: 03-Oct-2018, PDF+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781420018967)
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focu...Loe edasi...
(Ilmumisaeg: 01-Feb-2018, PDF+DRM, Kirjastus: Nova Science Publishers Inc, ISBN-13: 9781616682705)
This book describes various dielectric material properties, used in many kinds of research, and its industrial applications. A dielectric is a nonconducting substance and a poor conductor of electricity. They are often used in the construction of rad...Loe edasi...
(Ilmumisaeg: 19-Dec-2017, EPUB+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781351832267)
Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. T...Loe edasi...
(Ilmumisaeg: 19-Dec-2017, EPUB+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781351831086)
An Alternative to Copper-Based Interconnect TechnologyWith an increase in demand for more circuit components on a single chip, there is a growing need for nanoelectronic devices and their interconnects (a physical connecting medium made of thin metal...Loe edasi...
(Ilmumisaeg: 19-Dec-2017, PDF+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781466516045)
Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. T...Loe edasi...
(Ilmumisaeg: 19-Dec-2017, PDF+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781482239508)
An Alternative to Copper-Based Interconnect TechnologyWith an increase in demand for more circuit components on a single chip, there is a growing need for nanoelectronic devices and their interconnects (a physical connecting medium made of thin metal...Loe edasi...
(Ilmumisaeg: 30-Nov-2016, EPUB+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781315351797)
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most...Loe edasi...
(Ilmumisaeg: 30-Nov-2016, PDF+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781498745536)
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most re...Loe edasi...
(Ilmumisaeg: 09-Jul-2016, PDF+DRM, Kirjastus: Springer International Publishing AG, ISBN-13: 9783319297460)
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabric...Loe edasi...
(Ilmumisaeg: 09-Jul-2016, EPUB+DRM, Kirjastus: Springer International Publishing AG, ISBN-13: 9783319297460)
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabric...Loe edasi...
