FinFET/GAA Modeling for IC Simulation and Design: Using the BSIM-CMG Standard, Second Edition is the first to book to explain FinFET modeling for IC simulation and the industry standard - BSIM-CMG - describing the rush in demand for advancing the tec...Loe edasi...
FinFET/GAA Modeling for IC Simulation and Design: Using the BSIM-CMG Standard, Second Edition is the first to book to explain FinFET modeling for IC simulation and the industry standard - BSIM-CMG - describing the rush in demand for advancing the tec...Loe edasi...
(Ilmumisaeg: 13-Apr-2023, EPUB+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9781000888447)
This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications. Resistive random-access memory (RRAM) i...Loe edasi...
(Ilmumisaeg: 13-Apr-2023, PDF+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9781000888409)
This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications. Resistive random-access memory (RRAM) i...Loe edasi...
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about th...Loe edasi...
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about th...Loe edasi...
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and hig...Loe edasi...
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and hig...Loe edasi...
(Ilmumisaeg: 08-Mar-2019, PDF+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9780429680076)
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forw...Loe edasi...
(Ilmumisaeg: 08-Mar-2019, EPUB+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9780429680069)
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forw...Loe edasi...
(Ilmumisaeg: 03-Sep-2018, EPUB+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781351831598)
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. W...Loe edasi...
(Ilmumisaeg: 03-Sep-2018, PDF+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781466589421)
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. W...Loe edasi...
(Ilmumisaeg: 17-Apr-2018, EPUB+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9781351779821)
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and...Loe edasi...
(Ilmumisaeg: 17-Apr-2018, PDF+DRM, Kirjastus: Taylor & Francis Ltd, ISBN-13: 9781351779838)
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and...Loe edasi...
(Ilmumisaeg: 19-Dec-2017, EPUB+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781351830195)
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.The b...Loe edasi...
(Ilmumisaeg: 19-Dec-2017, PDF+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781498710374)
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.The b...Loe edasi...
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneou...Loe edasi...
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneou...Loe edasi...
(Ilmumisaeg: 30-Nov-2016, EPUB+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781315351797)
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most...Loe edasi...
