(Ilmumisaeg: 03-Sep-2018, EPUB+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781351831598)
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. W...Loe edasi...
(Ilmumisaeg: 03-Sep-2018, PDF+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781466589421)
Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. W...Loe edasi...
(Ilmumisaeg: 19-Dec-2017, EPUB+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781351830195)
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.The b...Loe edasi...
(Ilmumisaeg: 19-Dec-2017, PDF+DRM, Kirjastus: Taylor & Francis Inc, ISBN-13: 9781498710374)
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.The b...Loe edasi...
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneou...Loe edasi...
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneou...Loe edasi...
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bond...Loe edasi...
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bond...Loe edasi...
(Ilmumisaeg: 27-Nov-2012, PDF+DRM, Kirjastus: Springer-Verlag New York Inc., ISBN-13: 9781441995421)
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous "e;manufacturing-ready"e; GDSII-leve...Loe edasi...
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume h...Loe edasi...
With vastly increased complexity and functionality in the "e;nanometer era"e; (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (int...Loe edasi...
With vastly increased complexity and functionality in the "e;nanometer era"e; (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (int...Loe edasi...
